Patent Application
20250182952
The present invention relates to a coil device, and more particularly to a coil device for serving as an electrical inductor.
A coil device generally includes a core and two conductors. The conductors are arranged inside the core so that an area between the two conductors that has no magnetic elements arranged therein can enhance the magnetic coupling between the two conductors.
Taiwan Patent I786632 provides a coil device that includes a first conductor, a second conductor arranged inside of the first conductor and at least partly extending along the first conductor, and a core having an interior in which the first conductor and the second conductor are arranged, and an insulation layer is formed between at least the first conductor and the second conductor.
However, in the prior art, referring to FIG. 1A of I786632, a length of mounting portions is less than a width of outer leg portions and the core is exposed outside of the mounting portions. Since the length of the mounting portions is relatively small, a contact area between the mounting portions and a circuit board is limited and an area for soldering is limited and the soldering strength is limited, so that there is still room for improvement. Further, the second conductor is arranged on the periphery of a first central leg portion (second central leg portion), but there is no fixing structure arranged between the second conductor and the first central leg portion (second central leg portion), so that during application of an adhesive agent to fix the second conductor on the first core, the second conductor may get vibrated, making it hard to accurately position the second conductor at a designated location, and consequently, mass productivity is poor.
To achieve the above objective, the present invention provides a coil device, which comprises: a core, which comprises a central pillar and two rims located on two sides of the central pillar; a first conductor, which is disposed in an interior of the core, the first conductor comprising a first body portion and two first mounting portions, the two first mounting portions being respectively formed at two sides of the first body portion, the first mounting portions having lengths that are greater than or equal to widths of the rims so as to allow the two first mounting portions to each expose outside of the core; a second conductor, which is disposed in an interior of the first conductor, the second conductor comprising a second body portion and two second mounting portions, the two second mounting portions being respectively formed at two sides of the second body portion, the second conductor comprising a retention portion, the retention portion being set in retaining engagement with the central pillar; and an insulation layer, which is arranged between the first conductor and the second conductor.
In the above device, the core is provided with an insulative coating layer.
In the above device, the first conductor comprises a conductor plate having a coating layer.
In the above device, the first conductor comprises two outer curved portions that are curved in an outward direction, and the outer curved portions are located between the first body portion and the first mounting portions.
In the above device, the second conductor comprises two inner curved portions that are curved in an inward direction, and the inner curved portions are located between the second body portion and the second mounting portions.
In the above device, the second conductor is formed of a flattened wire.
In the above device, the insulation layer comprises an insulative covering film formed on a surface of the second conductor.
In the above device, the retention portion comprises an M-shaped configuration.
In the above device, the retention portion comprises a W-shaped configuration.
By setting the lengths of the first mounting portions to be greater than or equal to the widths of the rims, the two first mounting portions are each exposed outside of the core to increase a contact area of the first mounting portions with the circuit board for increasing a soldering area and thus enhancing soldering strength. Further, by setting the retention portion in retaining engagement with the central pillar, the first conductor and the second conductor are securely retained and fixed in the interior of the core.
Referring to
Referring to
The first conductor 2 is disposed in an interior of the core 1. The first conductor 2 comprises a first body portion 21 and two first mounting portions 22. The two first mounting portions 22 are respectively formed on two sides of the first body portion 21. Further, lengths of the first mounting portions 22 are greater than or equal to widths of the rims 12, so that the two first mounting portions 22 are exposed outside of the core 1. Specifically speaking, examples of materials making the first conductor 2 include good conductors, such as metals including copper and copper alloys, silver, and nickel, but not limited thereto. The first conductor 2 can be a conductor plate having a coating layer and is formed in a curved configuration having a U-shape. The two first mounting portions 22 are provided for connecting with a circuit board, and solder (or electrically conductive adhesive) can be used to solder (or adhere) the two first mounting portions 22 to the circuit board 5. The core 1 can be provided with an insulative coating layer 15. The insulative coating layer 15 is formed of a resinous material, such as epoxy resin or polyurethane resin. The insulative coating layer 15 is formed on a bottom surface of the central pillar 11 (namely the first central pillar 11a and the second central pillar 11b).
The second conductor 3 is disposed in an interior of the first conductor 2. The second conductor 3 comprises a second body portion 31 and two second mounting portions 32. The two second mounting portions 32 are respectively formed on two sides of the second body portion 31. Further, the second conductor 3 comprises a retention portion 33, and the retention portion 33 is set in retaining engagement with the central pillar 11. The second conductor 3 is formed of a flattened wire and is formed in a curved configuration having a U-shape. The second conductor 3 can be made of a material that is the same as that of the first conductor 2. The first conductor 2 and the second conductor 3 are both disposed in the interior of the core 1, such that the second conductor 3 is arranged in the interior of the first conductor 2 in a manner of being mutually spaced from each other and the central pillar 11 (which is jointly formed of the first central pillar 11a and the second central pillar 11b) is located in an interior of the second conductor 3, and the two rims 12 (which is jointly formed of the first rims 12a and the second rims 12b) are located outside of the first conductor 2. The first conductor 2 is provided with two outer curved portions 23 that are curved in an outward direction, and the outer curved portions 23 are located between the first body portion 21 and the first mounting portions 22, respectively. The second conductor 3 is provided with two inner curved portions 34 that are curved in an inward direction, and the inner curved portions 34 are located between the second body portion 31 and the second mounting portions 32, respectively. Referring to
Continuing to refer to
By setting the lengths of the first mounting portions 22 to be greater than or equal to the widths of the rims 12, the two first mounting portions 22 are each exposed outside of the core 1 to increase a contact area of the first mounting portions 22 with the circuit board 5 for increasing a soldering area and thus enhancing soldering strength. Further, by setting the retention portion 33 in retaining engagement with the central pillar 11, the first conductor 2 and the second conductor 3 are securely retained and fixed in the interior of the core 1, so that during application of an adhesive agent to fix the second conductor 3 to the first core 1a, no vibration of the second conductor 3 will occur and the second conductor 3 can be easily and accurately positioned on a designated location to thereby improve mass productivity thereof.
