The present invention relates to a coiling machine for manufacturing a coil spring and a coil spring manufacturing method.
As a device for manufacturing a coil spring, for example, the coil spring forming machine described in Patent Literature 1 (JP S62-50028 A) is known. This coil spring forming machine calculates the position of the cut site based on the length of a wire formed into a helical shape in advance and cuts the wire in a state where the cut site is softened by high-frequency heating.
Meanwhile like the spring manufacturing device described in Patent Literature 2 (JP H6-218476 A), a coiling machine which cuts a wire formed into a helical shape by laser light is also known.
In a case where high-frequency heating is used like the coil spring forming machine of Patent Literature 1, the responsiveness of the heating of the cut site is not good. In addition, in the coil spring forming machine, as the wire is cut in a state where the hating of the cut site by high-frequency heating is continued, the members used for cutting may be affected by high-frequency heating. Further, in the coil spring forming machine, the responsiveness of high-frequency heating is not satisfactory, and the wire is coiled up in a state where the wire is partly heated. Therefore, it may be difficult to stabilize the formation accuracy of the spring.
On the other hand, the spring manufacturing device of Patent Literature 2 requires high-power laser light which can cut a wire. In this case, sputter may occur because of irradiation with laser light, and further, laser light may be applied to each unit of the spring manufacturing device as well as the wire. Therefore, measures for these problems need to be taken.
In consideration of these matters, the applicant of the present application suggests the method of cutting a site of a wire heated by laser light by a cutting member such as a cutter as described in Patent Literature 3 (JP 7066880 B2). By this method, the wire can be easily cut, and further, a coil spring having a good cutting surface can be obtained.
The method of cutting a site of a wire heated by laser light by a cutting member as described above has room for improvement in various ways. For example, the irradiation direction of laser light for the irradiation position of a wire needs to be appropriately determined in consideration of the efficiency of heating and interference with various members.
In an aspect of the embodiments, one of the objects is to provide a coiling machine and a coil spring manufacturing method for enabling the improvement of the manufacturing efficiency of a coil spring and the improvement of the efficiency of the layout of various elements for manufacturing a coil spring.
According to an embodiment, the coiling machine comprises a feed unit configured to feed a wire in a feed direction, a helix formation unit configured to bend the wire fed by the feed unit in a perpendicular direction orthogonal to the feed direction in series, thereby forming a coil spring extending into a helical shape toward a formation direction orthogonal to the feed direction and the perpendicular direction, a laser heater configured to heat a portion of the wire by emitting laser light to the wire which is bent by the helix formation unit, and a cutting unit configured to cut a site of the wire heated by the laser light.
According to another aspect of the embodiment, the coil spring manufacturing method comprises feeding a wire in a feed direction, bending the fed wire in a perpendicular direction orthogonal to the feed direction in series, thereby forming a coil spring extending into a helical shape toward a formation direction orthogonal to the feed direction and the perpendicular direction, heating a portion of the wire by emitting laser light to the bent wire, and cutting a site of the wire heated by the laser light.
According to an aspect of the embodiment, when, relative to an irradiation area irradiated with the laser light in the wire, the formation direction is defined as 0°, and an opposite side of the feed direction is defined as 90°, and an opposite side of the formation direction is defined as 180°, and the feed direction is defined as 270°, an irradiation direction of the laser light by the laser heater forms a first angle which is greater than or equal to 0° and less than or equal to 270° with the formation direction.
According to another aspect of the embodiment, when, relative to an irradiation area irradiated with the laser light in the wire, the perpendicular direction is defined as 0°, and the formation direction is defined as 90°, an irradiation direction of the laser light by the laser heater forms a second angle which is greater than or equal to 5° and less than or equal to 80° with the perpendicular direction.
The first angle should be desirably greater than or equal to 0° and less than or equal to 180°, and more desirably greater than or equal to 0° and less than or equal to 80°.
The second angle should be desirably greater than or equal to 5° and less than or equal to 45°.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.
showing a specific example of a helix formation process by the coiling machine according to the embodiment.
Embodiments related to a coiling machine and a coil spring manufacturing method are hereinafter explained with reference to the accompanying drawings.
The coiling machine 100 comprises a feed unit 10, a helix formation unit 20, a heating unit (laser heater 30), a cutting unit 40 and a control unit 50.
In the example of
The driving rollers 11 face the driven rollers 12, respectively, via the wire 1. When each driving roller 11 rotates, a corresponding driven roller 12 rotates via the wire 1. In accordance with this rotation, the wire 1 interposed between the driving rollers 11 and the driven rollers 12 is fed in the feed direction X. The wire 1 is inserted into the wire guide 13. The wire guide 13 guides the wire 1 such that the wire 1 goes straight in the feed direction X, and guides the wire 1 to the helix formation unit 20.
The helix formation unit 20 forms the wire 1 fed by the feed unit 10 into a helical shape. In the example of
The first formation roller 21, the second formation roller 22 and the pitch tool 23 are provided in order in the circumferential direction De. The positions of the first formation roller 21, the second formation roller 22 and the pitch tool 23 in the formation direction Z are different from each other.
The first formation roller 21 and the second formation roller 22 bend, in the perpendicular direction Y, the wire 1 fed in the feed direction X in series. The wire 1 which is bent in series in this manner draws an arc along the circumferential direction De. The bent wire 1 is guided by the pitch tool 23 at a position deviating in the formation direction z relative to the second formation roller 22.
The laser heater 30 emits laser light L to a portion of the wire 1 formed into a helical shape as shown in
In the example of
For the laser oscillator 31, for example, a semiconductor laser which generates laser light L can be used. The optical fiber 32 transmits laser light L generated in the laser oscillator 31 to the laser head 33. The laser head 33 adjusts the beam shape of laser light L so as to be a rectangle or a circle by the beam spot adjustment device described above. For the beam spot adjustment device, for example, an optical element such as a beam homogenizer can be used.
The laser heater 30 may further comprise a measurement device 34 which measures the temperature of the heated site 1V. The measurement device 34 has, for example, a sensor which detects the temperature of the heated site 1V of the wire 1. The measurement device 34 may be provided on a lateral side of the cutting unit 40 to avoid interference with the cutting unit 40. The measurement device 34 may be configured to move away from a cutter 41 in cooperation with the operation of the cutter 41 to avoid interference with the cutter 41 described later. The measurement result by the measurement device 34 can be used to, for example, control the cut timing of the wire 1 by the cutting unit 40.
It should be noted that the measurement device 34 is not an essential configuration. In other words, without using the measurement device 34, various conditions related to the cutting of the wire 1 may be set in advance, and the cutting unit 40 may cut the heated site 1V based on the conditions.
The laser heater 30 may further comprise a movement stage which causes the laser head 33 to approach or move away from the heated site 1V of the wire 1. The movement stage may consist of, for example, a linear-motion stage or a robot hand. When the operation distance of the laser head 33 can be set so as to be sufficiently long, and interference with the cutting unit 40 can be avoided, the use of the movement stage is not necessary.
After the irradiation with laser light L is stopped, the cutting unit 40 cuts the heated site 1V of the wire 1 having a temperature higher than that before the irradiation with the laser light. In the example of
The cutter 41 is provided between the second formation roller 22 and the pitch tool 23 in the circumferential direction De. The cutter 41 has, at the distal end, for example, a sharp cutting blade in which the blade edge is parallel to the formation direction Z. The cutter 41 is configured such that it can be moved in the perpendicular direction Y by a drive mechanism (not shown).
The mandrel 42 is provided on the inner side of the first formation roller 21, the second formation roller 22 and the pitch tool 23. For example, as shown in
The control unit 50 controls the feed unit 10, the helix formation unit 20, the laser heater 30 and the cutting unit 40. This control unit 50 comprises a controller 51.
The controller 51 includes a read only memory (ROM), a central processing unit (CPU) and a random access memory (RAM). The ROM stores a computer program for controlling the feed unit 10, the helix formation unit 20, the laser heater 30 and the cutting unit 40. The CPU runs the computer program stored in the ROM. The RAM temporarily stores various types of data generated in association with the run of the computer program while the computer program is run by the CPU.
Now, this specification explains the manufacturing method of a coil spring 2 using the coiling machine 100 of the present embodiment with reference to
In the helix formation process S01, the wire 1 is formed into a helical shape. In the heating process S02 subsequent to the completion of the helix formation process S01, laser light L is emitted to a portion of the wire 1, thereby forming the heated site V1 in the wire 1. The heated site 1V includes a portion which is softened relative to the other portion (base material) of the wire 1. In the cutting process S03 subsequent to the completion of the heating process S02, the heated site 1V of the wire 1 is cut.
When the heating process S02 is performed, the feeding of the wire 1 by the feed unit 10 is stopped. The laser heater 30 is provided at, for example, a predetermined position in a fixed manner, and emits laser light L to a portion of the suspended wire 1 from that position. As another example, when the laser heater 30 has the movement stage described above, the laser heater 30 may move the laser head 33 closer to the wire 1 and then emit laser light L. In the heating process S02, the laser heater 30 may emit laser light L to the site of the wire 1 delivered in the circumferential direction De without stopping the feeding of the wire 1 by the feed unit 10. In this case, the movement of the laser heater 30 may be controlled such that the irradiation position of laser light L is moved so as to follow the movement of the cut position by coiling.
The heated site 1V may extend to the inside of the wire 1 more deeply than the examples shown in
In both the first example and the second example, the heated site 1V may include a melt pool in which the base material of the wire 1 is melted by the energy of laser light L. The melt pool may extend to the surrounding area of the irradiation area 1a as well as the irradiation area 1a.
Specifically, the cutter 41 descends toward the vicinity of the portion of the wire 1 supported by the mandrel 42 in the cutting process S03. At this time, the wire 1 is cut by the impact applied by the cutter 41.
In a case where the heated site 1V includes a melt pool, the melt pool may solidify during the period from the suspension of irradiation with laser light L until the start of the operation of the cutter 41. The melt pool may be solidified as the heat of the heated site 1V is taken by the cutter 41 when the cutter 41 comes into contact with the surface of the wire 1 after the operation of the cutter 41. Thus, as the melt pool solidifies before or during the operation of the cutter 41, the attachment of melted metal to the cutter 41 can be prevented.
In the cutting process S03, the cutter 41 may be operated based on the measurement result of the temperature of the heated site 1V by the measurement device 34. Specifically, the cutter 41 may operate when the temperature of the heated site 1V is decreased to the predetermined target temperature after the irradiation with laser light L. The target temperature may be, for example, a temperature at which the melted base material solidifies. As a matter of course, in the cutting process S03, the heated site 1V may be cut without using the measurement device 34 by determining in advance the delay time from the suspension of irradiation with laser light L until the start of the operation of the cutter 41.
The cut coil spring 2 has a first terminal 61 including a first end face 61a, and a second terminal 62 including a second end face 62a. After one coil spring 2 is manufactured, the helix formation process S01, heating process S02 and cutting process S03 described above are performed again, and thus, the next coil spring 2 is manufactured. Thus, each of the first terminal 61 and the second terminal 62 is cut through the processes descried above.
A shear force necessary for cutting the wire 1 decreases as the temperature of the wire 1 is increased by heating. Even if the wire 1 has not reached the melting point, the shear force can be decreased. Further, this tendency does not depend on the diameter of the wire 1. For example, when the wire 1 is cut by the cutter 41, the temperature of at least a portion of the heated site 1V should be desirably greater than or equal to 500° C.
As described above, when the wire 1 is irradiated with laser light L, the heated site 1V is formed. During the irradiation with laser light L or immediately after the irradiation, a melt pool is formed around the irradiation center O. By subsequent cooling, the melt pool is solidified, thereby forming a quench hardened portion 1C. Around the melt pool, a heat affected portion (heat affected zone [HAZ]) 1H is formed. The heat affected portion 1H has not been melted, but the property has been changed from the base material of the wire 1 by the heat applied at the time of the irradiation with laser light L. Thus, the heated site 1V includes the quench hardened portion 1C and the heat affected portion 1H.
Thus, similarly, the distribution of the hardness is nonuniform in the heated site 1V. Therefore, the relationships between the positions of the cutter 41 and the mandrel 42 and the irradiation area irradiated with laser light L need to be appropriately determined.
In the example of
In the example of
To the contrary, the melt pool 1P does not overlap the end portion 42a of the mandrel 42 in the perpendicular direction Y. In the example of
When the distal end portion of the cutter 41 applies an impact to the outer circumferential surface of the wire 1 which protrudes from the end portion 42a of the mandrel 42, a shear force is applied to the heated site 1V and its vicinity, and thus, the wire 1 is broken and cut. For example, the cutter 41 descends to the vicinity of the axis of the wire 1 at the maximum. In the cut wire 1, in other words, the coil spring 2, a dent (recess portion) B by the cutter 41 is formed. In the example of
As described above, the heat affected portion 1H is softer than the quench hardened portion 1C and the base material of the wire 1. Therefore, when the cutter 41 applies an impact to the wire 1, the heat affected portion 1H is easily broken and cut in the heated site 1V. In particular, if the irradiation center O is displaced on the cutter 41 side relative to the clearance center C as shown in
The first end face 61a corresponds to the fracture surface of the coil spring 2 which is separated from the wire 1 in
The second end face 62a corresponds to the fracture surface of the wire 1 which remains above the mandrel 42 when the coil spring 2 manufactured before the above coil spring 2 is separated. The second terminal 62 has the second irradiation trace M2 of laser light L. The second irradiation trace M2 includes the heat affected portion (second heat affected portion) 1H. When the wire 1 is cut as shown in
The heat affected portion 1H included in the first irradiation trace M1 extends to at least a portion of the first end face 61a. The heat affected portion 1H included in the second irradiation trace M2 extends to at least a portion of the second end face 62a. To the contrary, the quench hardened portion 1C included in the first irradiation trace M1 does not extend to the first end face 61a. It should be noted that a portion of the quench hardened portion 1C may extend to the first end face 61a. In this case, on the first end face 61a, the area of the quench hardened portion 1C should be desirably less than that of the heat affected portion 1H.
Now, this specification explains the irradiation direction DL of laser light L.
The body 110 accommodates a drive source which supplies power to the feed unit 10, the helix formation unit 20, the cutting unit 40 and the like, the control unit 50 and the like. The body 110 supports the driving rollers 11, the wire guide 13, the second formation roller 22, the pitch tool 23, the mandrel 42 and the like, and is located on the opposite side of the formation direction Z relative to these elements. The cover 120 is located on the formation direction Z side relative to the driving rollers 11, the wire guide 13, the second formation roller 22, the pitch tool 23, the mandrel 42 and the like. In the example of
In the plan view of
The first angle θ1 needs to be determined such that the laser head 33 or laser light L does not interfere with the coil spring 2 formed into a helical shape. In the example of
In the range from 180° to 270°, the second formation roller 22 is provided. Since the second formation roller 22 is located near the irradiation area 1a, when the first angle θ1 is in this range, the laser head 33 and laser light L easily interfere with the second formation roller 22. In light of this matter, the first angle θ1 should be more desirably determined within range Rib which is greater than or equal to 0° and less than or equal to 180°. In a case where the first angle θ1 is in range R1b, the laser head 33 is located on the upstream side of the feed direction X relative to the irradiation area 1a.
It should be noted that, if the irradiation center O of laser light L is set on the downstream side of the circumferential direction De (the opposite side of the feed direction X) relative to the end portion 42a of the mandrel 42 as shown in
In the range from 90° to 180°, the body 110 is provided. The pitch tool 23 is provided near 90°. In a case where the cover 120 is provided, the interference with this cover 120 also has to be avoided. Therefore, the first angle θ1 should be yet more desirably determined in the range which is greater than or equal to 0° and less than or equal to 80°.
In the cross-sectional view of
In a manner similar to that of the first angle θ1, the second angle θ2 needs to be determined such that the laser head 33 or laser light L does not interfere with each portion of the coiling machine 100 or the first turn P1. To avoid the interference with the body 110 and the wire 1 of the first turn P1 and the subsequent turns, the second angle θ2 is determined at least in the range which is greater than or equal to 0° and less than or equal to 90°.
The zeroth turn P0 is in contact with the first formation roller 21, the second formation roller 22, the pitch tool 23 and the mandrel 42. To the contrary, as the first turn P1 is released from the contact with these elements, the outside diameter of the first turn P1 and the subsequent turns could be greater than that of the zeroth turn P0 as shown in
Since the cutter 41 is located immediately above the irradiation area 1a, it is difficult to set the second angle θ2 so as to be 0°. Further, to avoid the interference with the first turn P1 in which the outside diameter is greater than the zeroth turn P0, the second angle θ2 must be less than 90°. Therefore, the second angle θ2 should be desirably determined within range R2a which is greater than or equal to 5° and less than or equal to 80°.
In a case where the irradiation area 1a is located near the outermost circumference of the wire 1 on the mandrel 42 as shown in the example of
It should be noted that there is no need to always satisfy the condition that the first angle θ1 belongs to one of ranges R1a, R1b and R1c and the condition that the second angle θ2 belongs to one of ranges R2a and R2b at the same time.
In the embodiment described above, of the wire 1 which is bent into a helical shape, the site (the heated site 1V) in which the temperature is increased by irradiation with laser light L is cut by the cutting unit 40 (the cutter 41 and the mandrel 42). Therefore, the shear force required for cutting becomes less. Thus, the wire 1 can be easily cut.
Further, when the irradiation direction DL of laser light L is determined as explained using
The embodiment described above does not limit the scope of the present invention to the configuration disclosed in the embodiment. The present invention can be implemented by modifying the configuration disclosed in the embodiment in various ways.
For example, as a matter of course, the present invention can be implemented by modifying modes such as the configuration and layout of the elements provided in the coiling machine 100 in various ways depending on the need.
Each embodiment exemplarily shows the configuration in which the coiling machine 100 cuts the heated site 1V of the wire 1 using the cutter 41. The coiling machine 100 is not limited to this configuration. The heated site 1V of the wire 1 may be cut by cutting using a rotary cutting blade.
There are various forms for the coil spring 2 manufactured by the coiling machine 100. For example, the coil diameter and the pitch may be changed in the axial direction of the coil spring. In other words, the coil spring 2 manufactured by the coiling machine 100 may be a coil spring in various forms, such as a cylindrical coil spring, a barrel-shaped coil spring, a hourglass coil spring, a tapered coil spring, a variable pitch coil spring and a coil spring having a portion with a minus pitch. The first angle θ1 and second angle θ2 described above may be determined so as to be appropriate values such that laser light L does not interfere with the first turn P1 and the subsequent turns depending on the shape of the coil spring.
Each figure exemplarily shows the coiling machine 100 and the manufacturing method for manufacturing a clockwise coil spring which is wound clockwise from the terminal. The configuration disclosed in the present embodiment can be also applied to a coiling machine and a manufacturing method for manufacturing a counterclockwise coil which is wound counterclockwise from the terminal.
In the coiling machine 200 shown in
Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
Number | Date | Country | Kind |
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2022-129255 | Aug 2022 | JP | national |
This application is a Continuation Application of PCT Application No. PCT/JP2023/022576, filed Jun. 19, 2023 and based upon and claiming the benefit of priority from prior Japanese Patent Application No. 2022-129255, filed Aug. 15, 2022, the entire contents of all of which are incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/JP2023/022576 | Jun 2023 | WO |
Child | 19049337 | US |