Manufacturing lines have generally evolved through the application of highly sophisticated automation devices and methods. Gains in productivity have been realized as past reliance on human judgment and manipulation is replaced by processor-driven systems. The repeatability of such systems enables the throughput velocity of components to be maximized.
Along with maximizing throughput, there has been a general trend toward performing both fabrication and testing operations at the point of final assembly, rather than building batches of subassemblies ahead of the time they are needed. By scheduling as many parts as possible to be ready “just in time” for final assembly, the utilization of all production equipment supporting final assembly is maximized.
However, these practices inevitably raise some problematic issues that cannot be ignored. For example, fabrication and assembly operations can create debris that, if not controlled, can damage sensitive components. With the continued demand for automated manufacturing lines having ever higher levels of throughput performance, there remains a continual need for improvements in the manner in which such debris is controlled. It is to the furthering of those efforts that the embodiments of the present invention are directed.
Embodiments of the present invention are directed to an apparatus and associated method for collecting debris from a tool. Programming instructions are stored in memory and executed by a machine tool controller, making the controller responsive to an intermittent debris collect signal in altering an operative path of a tool in order to engage the tool with a debris collecting device.
These and various other features and advantages which characterize the claimed embodiments will become apparent upon reading the following detailed description and upon reviewing the associated drawings.
The illustrative cell 100 depicts a balance measurement station in a manufacturing system for producing data storage devices, and is described in detail in U.S. Pat. No. 6,507,992 which is assigned to the present assignee. A pallet (not shown) supporting the data storage device in its various stages of manufacture is transported down the conveyor 106. In the balance measurement station of
Left unchecked, the debris can dislodge from the rotary positioner 108 and ultimately end up inside the data storage device enclosure. There are a number of opportunities for debris trapped inside the enclosure to degrade the performance of the data storage device, if not cause an outright failure mode. For instance, debris can damage sensitive printed circuit board components or precision bearing surfaces, or it can become wedged between the transducer and the data storage medium causing the loss of stored data and/or damage to the transducer and the storage medium.
The tool 132 is depicted as starting at a common reference datum position in relation to the conveyor 106 at the start of each cycle. The machine cell (such as 100, 110 in
It will be noted that both the operative path 136 and the alternative path 138 have both lateral and vertical components of trajectory. In alternative equivalent embodiments the paths 136, 138 can have more or fewer such components. For example, in some embodiments the lateral position of the tool 132 can be fixed and only the vertical trajectory might be altered when the debris collecting device 126 is presented in the cell. Alternatively, in addition to the lateral and vertical trajectory components shown, the altered path 138 may also have a longitudinal trajectory component, making it possible to contact the adhesive surface 130 at different longitudinal positions to prevent contact with previously collected debris on the adhesive surface 130.
The debris collect signal 146 is intermittently dispersed within the normal course of the machine cell operations. Its frequency of occurrence can be empirically determined in relation to what is minimally necessary to keep the accumulations of debris below a desired level. In some embodiments the debris collect signal 146 can be programmed into the instructions stored in memory 142, such as by correlating its occurrence to a planned deployment of a debris collecting device 126 (
By integrating the presentations of the debris collecting device 126 into the production flow, the cleaning of debris from the transport device and the tooling can advantageously be performed continuously without stoppages in production. The amount of debris collected by the device 126 can be monitored and used in a statistical approach to adaptively determine the frequency with which the devices 126 should be deployed, or alternatively deciding when to shut down the production line for a more rigorous cleaning procedure. Furthermore, the debris collected can be analyzed to determine its origin, and that information is useful in root cause determination for continually reducing the introduction of debris into the production process.
Preferably, the adhesive surface 130 is provided by using multiple layers of adhesive-coated film. This prolongs the useful life of a debris collecting device 126 before it must be refurbished to renew its debris collecting capability. During reduction to practice of the present embodiments, successful experimentation was conducted by using a product marketed as TackMat™ by Melino Enterprises, Incorporated, of Cranston, R.I., U.S.A. This particular tacky product consists of sixty layers of adhesive-coated film. When a particular adhesive layer 130 becomes ineffective through exposure and/or contamination, then that layer can be easily peeled away to expose a fresh adhesive surface 130. More generally, the adhesive used to produce the adhesive surfaces 130 was successfully made from an epoxy product marketed as DP460 by 3M™ Corporation of St. Paul, Minn., U.S.A.
Generally, the present embodiments contemplate a machine cell having a processor controlling movements of a tool, and means for collecting debris by selectively altering the movements of the tool in response to presentation of a debris collect signal. For purposes of this description and meaning of the appended claims, the term “means for collecting debris” is only associated with the structure disclosed herein and structural equivalents thereof that are capable of executing written programming instructions stored in memory to perform the steps of the method of
It is to be understood that even though numerous characteristics and advantages of various embodiments of the present invention have been set forth in the foregoing description, together with details of the structure and function of various embodiments of the invention, this detailed description is illustrative only, and changes may be made in detail, especially in matters of structure and arrangements of parts within the principles of the present invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. For example, the particular elements may vary in type or arrangement without departing from the spirit and scope of the present invention.
In addition, although the embodiments described herein are directed to machine cells in a manufacturing line, it will be appreciated by those skilled in the art that the claimed subject matter is not so limited and various other systems can utilize the present embodiments without departing from the spirit and scope of the claimed invention.
Number | Name | Date | Kind |
---|---|---|---|
5138390 | Miyabayashi et al. | Aug 1992 | A |
5227844 | Bhattacharjee et al. | Jul 1993 | A |
5235485 | Martin | Aug 1993 | A |
5273329 | Wessel | Dec 1993 | A |
5401111 | Nubson et al. | Mar 1995 | A |
5423411 | Kennett | Jun 1995 | A |
5519910 | Messina | May 1996 | A |
5811184 | Anderson et al. | Sep 1998 | A |
5891259 | Ikeda et al. | Apr 1999 | A |
6001472 | Ikeda et al. | Dec 1999 | A |
6118289 | Kitani et al. | Sep 2000 | A |
6175984 | Prime et al. | Jan 2001 | B1 |
6430903 | Christiansen et al. | Aug 2002 | B1 |
6582141 | Meier et al. | Jun 2003 | B2 |
6615435 | Randall | Sep 2003 | B2 |
6646455 | Maekawa et al. | Nov 2003 | B2 |
6741086 | Maekawa et al. | May 2004 | B2 |
6744592 | Randall | Jun 2004 | B2 |
6777966 | Humphrey et al. | Aug 2004 | B1 |
6781395 | Maruyama et al. | Aug 2004 | B2 |
6884300 | Sato et al. | Apr 2005 | B2 |
6888344 | Maekawa et al. | May 2005 | B2 |
6956348 | Landry et al. | Oct 2005 | B2 |
7065864 | Yamamoto et al. | Jun 2006 | B2 |
7093642 | Sharp et al. | Aug 2006 | B2 |
7101033 | Roche et al. | Sep 2006 | B2 |
7152271 | Pfautz | Dec 2006 | B2 |
7204792 | Hagihara et al. | Apr 2007 | B2 |
7461430 | Reick-Mitrisin et al. | Dec 2008 | B2 |
7487006 | Kamiya et al. | Feb 2009 | B2 |
20050183223 | Cheng | Aug 2005 | A1 |
20070074740 | Aaron et al. | Apr 2007 | A1 |
Number | Date | Country | |
---|---|---|---|
20090076656 A1 | Mar 2009 | US |