Claims
- 1. A method of manufacturing a combination thin film magnetic head comprising a reading head having a magnetoresistive element layer, and an inductive head composed of a coil layer and a core layer and laminated on the reading head, the method comprising forming a shielding layer on the magnetoresistive element layer with an insulation layer therebetween by a method comprising the steps of:forming a resist layer for a lift off method on the insulation layer; forming an anti-milling layer made of a non-magnetic material on the surface of the resist layer for a lift off method and on a portion of the insulation layer where the resist layer for a lift off method is not formed; removing a portion of the resist layer for a lift off method; forming a soft magnetic material layer on a portion of the insulation layer where the resist layer for a lift off method has been removed, and on the anti-milling layer by sputtering or evaporation; forming a resist layer on the portion of the insulation layer where the resist layer for a lift off method has been removed, with the soft magnetic material layer therebetween; removing the soft magnetic material layer by ion milling to leave the portion of the soft magnetic material layer formed below the resist layer as a shielding layer; and removing the resist layer formed on the shielding layer.
- 2. A method of manufacturing a combination thin film magnetic head according to claim 1, wherein a slope is formed at the bottom of either side end of the lift off resist layer.
- 3. A method of manufacturing a combination thin film magnetic head according to claim 1, wherein the anti-milling layer is formed to a thickness of about 3000 angstroms.
- 4. A method of manufacturing a combination thin film magnetic head according to claim 1, wherein the ion milling rate of the material used for forming the anti-milling layer is lower than that of the material used for the shielding layer.
Priority Claims (2)
Number |
Date |
Country |
Kind |
9-019264 |
Jan 1997 |
JP |
|
9-034563 |
Feb 1997 |
JP |
|
Parent Case Info
The present application is a continuation of Ser. No. 09/016,838, filed Jan. 30, 1999, now pending.
US Referenced Citations (13)
Continuations (1)
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Number |
Date |
Country |
Parent |
09/016838 |
Jan 1998 |
US |
Child |
09/429129 |
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US |