Patent Application
20250224776
The present disclosure relates in general to information handling systems, and more particularly to systems and methods for housing information handling resources having different form factors in a common housing.
As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
Oftentimes, information handling systems and other information handling resources (e.g., storage devices, input/output devices, and other peripheral devices) are each manufactured in a modular form factor and may be configured to be disposed in a chassis configured to receive such modular components. Such a chassis and its component modular information handling systems and information handling resources typically include various rails, carriers, and other mechanical components allowing for a person to add and remove the modular information handling systems and information handling resources from the chassis.
Increasingly, information handling resources (e.g., storage resources) are manufactured according to different form factors (e.g., 2.5″ and 3.5″ solid-state drives). Current industry practice is to manufacture different housings to accommodate different form factors, which increases costs and supply chain complexity. Currently, no housing capable of accommodating information handling resources having different form factors exists. Accordingly, systems and methods for accommodating mixed information handling resource installations in a single housing are desirable.
In accordance with the teachings of the present disclosure, the disadvantages and problems associated with existing approaches to accommodate different information handling resource form factors may be reduced or eliminated. In accordance with embodiments of the present disclosure, a system may include a housing comprising a plurality of slots. Each slot may comprise a first set of adapter alignment features and a second set of adapter alignment features. The first set of adapter alignment features and the second set of adapter alignment features may each be configured to mechanically couple to a form factor adapter. The form factor adapter may be configured to receive one or more information handling resources.
In accordance with embodiments of the present disclosure, a form factor adapter may include a connector assembly comprising one or more connector features configured to mechanically and electrically couple to one or more information handling resources, a circuit board mechanically and electrically coupled to the connector assembly and configured to electrically couple the one or more information handling resources to another circuit board, and a bracket mechanically coupled to the circuit board and comprising a plurality of housing alignment features configured to mechanically couple the form factor adapter to a housing.
In accordance with embodiments of the present disclosure, a method of making a form factor adapter may include mechanically and electrically coupling a connector assembly to a circuit board, the connector assembly configured to mechanically and electrically couple to one or more information handling resources, and mechanically coupling a bracket to the circuit board. The bracket may comprise a plurality of housing alignment features configured to mechanically couple the form factor adapter to a housing.
It is to be understood that both the foregoing general description and the following detailed description are examples and explanatory and are not restrictive of the claims set forth in this disclosure.
A more complete understanding of the present embodiments and advantages thereof may be acquired by referring to the following description taken in conjunction with the accompanying drawings, in which like reference numbers indicate like features, and wherein:
Preferred embodiments and their advantages are best understood by reference to
For the purposes of this disclosure, computer-readable media may include any instrumentality or aggregation of instrumentalities that may retain data and/or instructions for a period of time. Computer-readable media may include, without limitation, storage media such as a direct access storage device (e.g., a hard disk resource or floppy disk), a sequential access storage device (e.g., a tape disk resource), compact disk, CD-ROM, DVD, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and/or flash memory; as well as communications media such as wires, optical fibers, microwaves, radio waves, and other electromagnetic and/or optical carriers; and/or any combination of the foregoing.
For the purposes of this disclosure, information handling resources may broadly refer to any component system, device or apparatus of an information handling system, including without limitation processors, buses, memories, I/O devices and/or interfaces, storage resources, network interfaces, motherboards, integrated circuit packages; electro-mechanical devices (e.g., air movers), displays, and power supplies.
For the purposes of this disclosure, a circuit board may broadly refer to a printed circuit board (PCB), printed wiring board (PWB), printed wiring assembly (PWA) etched wiring board, and/or any other board or similar physical structure operable to mechanically support and electrically couple electronic components (e.g., packaged integrated circuits, slot connectors, etc.). A circuit board may comprise a substrate of a plurality of conductive layers separated and supported by layers of insulating material laminated together, with conductive traces disposed on and/or in any of such conductive layers, with vias for coupling conductive traces of different layers together, and with pads for coupling electronic components (e.g., packaged integrated circuits, slot connectors, etc.) to conductive traces of the circuit board.
Connector features 104 may be arranged within connector assembly 103 such that information handling resources 203 having differing widths (e.g., 2T or 1T) may electrically and mechanically couple to connector assembly 103. Printed circuit board 102 may further comprise one or more receptacle connectors 105 mounted thereon, which may electrically couple information handling resource 203 to another circuit board (e.g., a motherboard) via cables. While
Accordingly, in some embodiments, housing alignment features 107 of adapter 100 may “slide” or “snap” into adapter alignment features 201 of housing 200 to mechanically couple adapter 100 to a desired position within housing 200. In some embodiments, adapter 100 may additionally mechanically couple to housing 200 via a fastener 108 (e.g., a screw) extending through a through-hole of bracket 101 and a recess 202 of housing 200. Information handling resources 203 may further mechanically couple to housing 200 near a second edge of housing 200 via connectors 204 and/or recesses 205.
While the terms “front” and “rear” are used for purposes of clarity and exposition, such terms are not intended to limit adapter 100 or housing 200 to a particular orientation or configuration.
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As used herein, when two or more elements are referred to as “coupled” to one another, such term indicates that such two or more elements are in electronic communication or mechanical communication, as applicable, whether connected indirectly or directly, with or without intervening elements.
This disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Similarly, where appropriate, the appended claims encompass all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Moreover, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. Accordingly, modifications, additions, or omissions may be made to the systems, apparatuses, and methods described herein without departing from the scope of the disclosure. For example, the components of the systems and apparatuses may be integrated or separated. Moreover, the operations of the systems and apparatuses disclosed herein may be performed by more, fewer, or other components and the methods described may include more, fewer, or other steps. Additionally, steps may be performed in any suitable order. As used in this document, “each” refers to each member of a set or each member of a subset of a set.
Although exemplary embodiments are illustrated in the figures and described below, the principles of the present disclosure may be implemented using any number of techniques, whether currently known or not. The present disclosure should in no way be limited to the exemplary implementations and techniques illustrated in the drawings and described above.
Unless otherwise specifically noted, articles depicted in the drawings are not necessarily drawn to scale.
All examples and conditional language recited herein are intended for pedagogical objects to aid the reader in understanding the disclosure and the concepts contributed by the inventor to furthering the art, and are construed as being without limitation to such specifically recited examples and conditions. Although embodiments of the present disclosure have been described in detail, it should be understood that various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the disclosure.
Although specific advantages have been enumerated above, various embodiments may include some, none, or all of the enumerated advantages. Additionally, other technical advantages may become readily apparent to one of ordinary skill in the art after review of the foregoing figures and description.
To aid the Patent Office and any readers of any patent issued on this application in interpreting the claims appended hereto, applicants wish to note that they do not intend any of the appended claims or claim elements to invoke 35 U.S.C. § 112 (f) unless the words “means for” or “step for” are explicitly used in the particular claim.
