This application claims priority of Taiwan Patent Application No. 110143114 filed on Nov. 19, 2021, the entirety of which is incorporated by reference herein.
The disclosure generally relates to a communication device, and more particularly, to a communication device with high isolation.
With the advancements being made in mobile communication technology, mobile devices such as portable computers, mobile phones, multimedia players, and other hybrid functional portable electronic devices have become more common. To satisfy consumer demand, mobile devices can usually perform wireless communication functions. Some devices cover a large wireless communication area; these include mobile phones using 2G, 3G, and LTE (Long Term Evolution) systems and using frequency bands of 700 MHz, 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, 2100 MHz, 2300 MHz, and 2500 MHz. Some devices cover a small wireless communication area; these include mobile phones using Wi-Fi systems and using frequency bands of 2.4 GHz, 5.2 GHz, and 5.8 GHz.
Antennas are indispensable elements of a mobile device supporting wireless communication. However, because of the small amount of internal space in the mobile device, the configuration of the antennas and their transmission lines are often very close, and they are likely to interfere with each other. Accordingly, it is necessary to propose a novel solution for solving the problem of low isolation in the conventional design.
In an exemplary embodiment, the invention is directed to a communication device that includes a first ground element, a second ground element, a third ground element, a first signaling conductor, a second signaling conductor, a resonant circuit, and a dielectric substrate. The first signaling conductor is disposed between the first ground element and the second ground element. The second signaling conductor is disposed between the second ground element and the third ground element. The first signaling conductor is coupled through the resonant circuit to the first ground element. The dielectric substrate has a first surface and a second surface which are opposite to each other. The first ground element, the second ground element, the third ground element, the first signaling conductor, and the second signaling conductor are all disposed on the first surface of the dielectric substrate. The resonant circuit is configured to increase the isolation between the first signaling conductor and the second signaling conductor in a target frequency band.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
In order to illustrate the purposes, features and advantages of the invention, the embodiments and figures of the invention are shown in detail as follows.
Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms “include” and “comprise” are used in an open-ended fashion, and thus should be interpreted to mean “include, but not limited to . . . ”. The term “substantially” means the value is within an acceptable error range. One skilled in the art can solve the technical problem within a predetermined error range and achieve the proposed technical performance. Also, the term “couple” is intended to mean either an indirect or direct electrical connection. Accordingly, if one device is coupled to another device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections.
The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Furthermore, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
The first ground element 110, the second ground element 120, and the third ground element 130 can provide a ground voltage VSS. The first signaling conductor 140 may substantially have a straight-line shape. The first signaling conductor 140 is disposed between the first ground element 110 and the second ground element 120. The second signaling conductor 150 may substantially have another straight-line shape, which may be substantially parallel to the first signal conductor 140. The second signaling conductor 150 is disposed between the second ground element 120 and the third ground element 130. In some embodiments, the first signaling conductor 140 and the second signaling conductor 150 are completely separate from the first ground element 110, the second ground element 120, and the third ground element 130.
The first signaling conductor 140 is coupled through the resonant circuit 160 to the first ground element 110. In some embodiments, the first signaling conductor 140 and the resonant circuit 160 are coupled in parallel with the first ground element 110, but they are not limited thereto. It should be noted that the resonant circuit 160 is configured to increase the isolation between the first signaling conductor 140 and the second signaling conductor 150 in a target frequency band. That is, within the aforementioned target frequency band, the first signaling conductor 140 and the second signaling conductor 150 do not tend to interfere with each other.
The dielectric substrate 170 may be an FR4 (Flame Retardant 4) substrate, a PCB (Printed Circuit Board), or an FPC (Flexible Printed Circuit). The dielectric substrate 170 has a first surface E1 and a second surface E2 with are opposite to each other. The first ground element 110, the second ground element 120, the third ground element 130, the first signaling conductor 140, and the second signaling conductor 150 may all be disposed on the first surface E1 of the dielectric substrate 170.
The following embodiments will introduce different configurations and detailed structural features of the communication device. It should be understood that these figures and descriptions are merely exemplary, rather than limitations of the invention.
The first signaling conductor 140 has a first end 141 and a second end 142. A first feeding point FP1 is positioned at the first end 141 of the first signaling conductor 140. The first feeding point FP1 may be further coupled to a first antenna 281. The second signaling conductor 150 has a first end 151 and a second end 152. A second feeding point FP2 is positioned at the first end 151 of the second signaling conductor 150. The second feeding point FP2 may be further coupled to a second antenna 282. Furthermore, the second end 142 of the first signaling conductor 140 may be further coupled to a first RF (Radio Frequency) module 283, and the second end 152 of the second signaling conductor 150 may be further coupled to a second RF module 284. For example, the first antenna 281 may be excited by the first RF module 283 through the first signaling conductor 140, and the second antenna 282 may be excited by the second RF module 284 through the second signaling conductor 150.
In the embodiment of
where “FC” represents the central frequency FC, “L” represents the inductance of the inductive element 262, and “C” represents the capacitance of the capacitive element 264.
Generally, the first signaling conductor 140 is mainly configured to transmit signals within a first frequency band, and the second signaling conductor 150 is mainly configured to transmit signals within a second frequency band. For example, the first frequency band may be from 2400 MHz to 2500 MHz, and the second frequency band may be from 5150 MHz to 5850 MHz. The second frequency band may overlap the target frequency band FB1. Since the resonant circuit 260 can absorb the current distributions within the target frequency band FB1, the communication device 200 of the invention can effectively avoid the interference between the first signaling conductor 140 and the second signaling conductor 150 (especially for the target frequency band FB1). In addition, according to practical measurements, if the distance D1 between the first connection point NC1 and the first feeding point FP1 is from 0 mil to 100 mil, the isolating function of the resonant circuit 260 can be further enhanced. Other features of the communication device 200 of
The invention proposes a novel communication device, which includes a resonant circuit integrated with a dielectric substrate. In comparison to the conventional design, the invention has at least the advantages of high isolation and low manufacturing cost. Therefore, the invention is suitable for application in a variety of mobile communication devices.
Note that the above element sizes, element shapes, and frequency ranges are not limitations of the invention. A designer can fine-tune these settings or values according to different requirements. It should be understood that the communication device of the invention is not limited to the configurations of
Use of ordinal terms such as “first”, “second”, “third”, etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having the same name (but for use of the ordinal term) to distinguish the claim elements.
While the invention has been described by way of example and in terms of the preferred embodiments, it should be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
---|---|---|---|
110143114 | Nov 2021 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
2851613 | Welker | Sep 1958 | A |
3413574 | Schroeder | Nov 1968 | A |
4342012 | Inaba | Jul 1982 | A |
4600906 | Blight | Jul 1986 | A |
5023768 | Collier | Jun 1991 | A |
6078295 | Rawle | Jun 2000 | A |
6300906 | Rawnick | Oct 2001 | B1 |
8200301 | Yamamoto | Jun 2012 | B2 |
8654743 | Li | Feb 2014 | B1 |
10630257 | Nosaka | Apr 2020 | B2 |
11075050 | Wang | Jul 2021 | B2 |
20030030589 | Zurcher | Feb 2003 | A1 |
20030222732 | Matthaei | Dec 2003 | A1 |
20040160367 | Mendolia | Aug 2004 | A1 |
20040212039 | Yamamoto | Oct 2004 | A1 |
20040217915 | Imaizumi | Nov 2004 | A1 |
20050092845 | Forster | May 2005 | A1 |
20050225484 | Kuramoto | Oct 2005 | A1 |
20060117163 | Okuyama | Jun 2006 | A1 |
20060152430 | Seddon | Jul 2006 | A1 |
20070001785 | Yamanaka | Jan 2007 | A1 |
20070133182 | Chen | Jun 2007 | A1 |
20080136736 | Proctor | Jun 2008 | A1 |
20080174508 | Iwai | Jul 2008 | A1 |
20090284431 | Meharry | Nov 2009 | A1 |
20100060535 | Tiezzi | Mar 2010 | A1 |
20110018776 | Brown | Jan 2011 | A1 |
20110115676 | Tatarnikov | May 2011 | A1 |
20120064954 | Kato | Mar 2012 | A1 |
20120127038 | Kim | May 2012 | A1 |
20120194290 | Wu | Aug 2012 | A1 |
20130123726 | Yu | May 2013 | A1 |
20130257674 | Li | Oct 2013 | A1 |
20130335280 | Chen, III | Dec 2013 | A1 |
20140021591 | Sung | Jan 2014 | A1 |
20140139391 | Lo | May 2014 | A1 |
20140159981 | Wang | Jun 2014 | A1 |
20140320351 | Wei | Oct 2014 | A1 |
20150123869 | Bit-Babik | May 2015 | A1 |
20150138036 | Harper | May 2015 | A1 |
20150295311 | Bringuier | Oct 2015 | A1 |
20160043468 | Onaka | Feb 2016 | A1 |
20160141749 | Tagi | May 2016 | A1 |
20170062932 | Foster | Mar 2017 | A1 |
20170279192 | Taniguchi | Sep 2017 | A1 |
20170309405 | Moalemi | Oct 2017 | A1 |
20170352943 | Sung | Dec 2017 | A1 |
20180069301 | Choi | Mar 2018 | A1 |
20180083367 | Song | Mar 2018 | A1 |
20180090821 | Lee | Mar 2018 | A1 |
20180233811 | Gommé | Aug 2018 | A1 |
20180277946 | Murata | Sep 2018 | A1 |
20190027802 | Noori | Jan 2019 | A1 |
20190103676 | Sugimoto | Apr 2019 | A1 |
20190199001 | Kato | Jun 2019 | A1 |
20190334225 | Lee | Oct 2019 | A1 |
20190348356 | Hsieh | Nov 2019 | A1 |
20200098676 | Elsherbini | Mar 2020 | A1 |
20210066191 | Chen | Mar 2021 | A1 |
20210066795 | Flores-Cuadras | Mar 2021 | A1 |
20210111486 | Tamrakar | Apr 2021 | A1 |
20210159598 | Hamabe | May 2021 | A1 |
20220173515 | Koyama | Jun 2022 | A1 |
20220393324 | Sukegawa | Dec 2022 | A1 |
20230163470 | Hsu | May 2023 | A1 |
20230198149 | Wei | Jun 2023 | A1 |
20230304980 | Li | Sep 2023 | A1 |
Number | Date | Country |
---|---|---|
205792477 | Dec 2016 | CN |
206349489 | Jul 2017 | CN |
109980364 | Jul 2019 | CN |
2696437 | Feb 2014 | EP |
3340383 | Jun 2018 | EP |
3713013 | Sep 2020 | EP |
793867 | Feb 2023 | TW |
WO-2020158213 | Aug 2020 | WO |
WO-2020173298 | Sep 2020 | WO |
Number | Date | Country | |
---|---|---|---|
20230163470 A1 | May 2023 | US |