Patent Grant
9444198
The present application claims priority from Japanese Patent Applications No. 2014-041723 filed on Mar. 4, 2014, and No. 2014-054057 filed on Mar. 17, 2014, the content of which is hereby incorporated by reference into this application.
The present invention relates to a communication module and a communication module connector.
In a server, a network device, and others, a semiconductor chip (IC chip) and a plurality of communication modules are mounted on a substrate generally called a motherboard. Here, the throughput of the semiconductor chip (IC chip) has been rapidly improved with line thinning of a semiconductor manufacturing process. With the improvement in the throughput of the semiconductor chip, increase in speed of digital signals inputted to and outputted from the semiconductor chip has been advanced year after year. That is, increase in the speed of the digital signals exchanged between the semiconductor chip and the communication module has been advanced year after year. It has been expected that the speed of digital signals inputted to and outputted from a next-generation semiconductor chip and communication module becomes 25 Gbit/sec, and expected that the speed of digital signals inputted to and outputted from a next-next-generation semiconductor chip and communication module becomes 50 Gbit/sec.
However, high-speed digital signals have a large transmission loss in electrical transmission. In other words, high-speed digital signals have severe signal degradation during transmission. For example, in the case of the high-speed digital signals of 25 Gbit/sec, a loss of about 0.8 dB/cm occurs on electric wiring formed on a general printed board. Even on electric wiring formed on a sophisticated printed board for high-speed signals, a loss of about 0.4 dB/cm occurs.
Under these circumstances as described above, it is required to mount a lot of communication modules with high density on a portion in vicinity of the semiconductor chip.
However, a LGA (Land Grid Array) structure that has been conventionally used as a communication module mount structure has high cost and is inconvenient (that is, it is difficult to attach/detach the communication module).
An object of the present invention is to provide a small-sized and convenient communication module connector for achieving the high-density mounting of communication modules, and provide a communication module with the connector.
In one aspect of the present invention, a communication module connector is configured of a plug connector and a receptacle connector into which the plug connector is inserted. The plug connector has an insertion convex portion including: an end surface; two outer side surfaces facing in parallel to each other across the end surface; and a first tapered surface connecting each of the outer side surfaces and the end surface. The receptacle connector has an insertion concave portion into which the insertion convex portion is inserted, the insertion concave portion including: an insertion port; two inner side surfaces facing in parallel to each other across the insertion port; and a second tapered surface connecting each of the inner side surfaces and an edge of the insertion port. Each of the outer side surfaces of the insertion convex portion has a plurality of first connection terminals arranged in parallel to each other along longitudinal directions of these outer side surfaces, and each of the inner side surfaces of the insertion concave portion has a plurality of second connection terminals arranged in parallel to each other in contact with the first connection terminals. And, the first tapered surface has a width which is twice as large as a width of the second tapered surface or larger.
In another aspect of the present invention, a communication module connector is configured of a plug connector and a receptacle connector into which the plug connector is inserted. The plug connector has an insertion convex portion, and the receptacle connector has an insertion concave portion into which the insertion convex portion is inserted. Two outer side surfaces of the insertion convex portion which are in parallel to each other have a plurality of first connection terminals arranged in parallel to each other along longitudinal directions of these outer side surfaces, and two inner side surfaces of the insertion concave portion which are in parallel to each other have a plurality of second connection terminals arranged in parallel to each other in contact with the first connection terminals. Each of the first connection terminals and the second connection terminals extends along an inserting direction of the insertion convex portion into the insertion concave portion. An upper-side end portion of the second connection terminal in the inserting direction is positioned higher than any other part of the second connection terminal in the same direction, and the second connection terminal does not have a part positioned at the same height in the inserting direction. In a state in which the plug connector and the receptacle connector are connected to each other, a direct distance along the inserting direction from a lower-side end portion of the second connection terminal in the inserting direction to an upper-side end portion of the first connection terminal in the inserting direction in contact with the second connection terminal is 6.0 mm or smaller.
In still another aspect of the present invention, a communication module includes a plug connector to be connected to a receptacle connector. The plug connector has an insertion convex portion to be inserted into an insertion concave portion provided to the receptacle connector, the insertion convex portion including: an end surface; two outer side surfaces facing in parallel to each other across the end surface; and a first tapered surface connecting each of the outer side surfaces and the end surface. The insertion concave portion of the receptacle connector includes: an insertion port into which the insertion convex portion is inserted; two inner side surfaces facing in parallel to each other across the insertion port; and a second tapered surface connecting each of the inner side surfaces and an edge of the insertion port. A plurality of first connection terminals to be connected to a plurality of second connection terminals arranged on the inner side surfaces of the insertion concave portion are arranged on the outer side surfaces of the insertion convex portion, respectively, and the first tapered surface has a width twice as large as a width of the second tapered surface or larger.
In still another aspect of the present invention, a communication module includes a plug connector to be connected to a receptacle connector. The plug connector has an insertion convex portion to be inserted into an insertion concave portion provided to the receptacle connector. A plurality of first connection terminals to be connected to a plurality of second connection terminals arranged on two inner side surfaces of the insertion concave portion which are in parallel to each other are arranged on two outer side surfaces of the insertion convex portion which are in parallel to each other. Each of the first connection terminals and the second connection terminals extends along a direction in which the insertion convex portion is inserted into the insertion concave portion. An upper-side end portion of the second connection terminal in the inserting direction is positioned higher than any other part of the second connection terminal in the same direction, and the second connection terminal does not have a part positioned at the same height in the inserting direction. In a state in which the plug connecter is connected the receptacle connector, a direct distance from a lower-side end portion of the second connection terminal in the inserting direction to an upper-side end portion of the first connection terminal in the inserting direction in contact with the second connection terminal is 6.0 mm or smaller.
According to the present invention, a small-sized and convenient communication module connector for achieving the high-density mounting of a communication module and a communication module with the connector are achieved.
Hereinafter, an example of embodiments of the present invention will be described in detail with reference to the drawings. A communication module 1 shown in
As shown in
Here, as another method for achieving the small size and the low cost of the connector, there is a method of directly inserting an edge connector provided to the module substrate into the receptacle connector on the motherboard with excluding the plug connector. However, in this method, it is difficult to enhance reliability of the electrical connection between the module substrate and the receptacle connector.
As shown in
As shown in
As shown in
In the following description, the outer side surface 33a of the insertion convex portion 31 is referred to as a “right outer side surface 33a”, and the outer side surface 33b thereof is referred to as a “left outer side surface 33b”. Also, in some cases, the first tapered surface 81a connecting the right outer side surface 33a and the end surface 80 is referred to as a “right-side first tapered surface 81a”, and the first tapered surface 81b connecting the left outer side surface 33b and the end surface 80 is referred to as a “left-side first tapered surface 81b”.
On the other hand, in some cases, the right outer side surface 33a and the left outer side surface 33b are collectively referred to as an “outer side surface 33”, and the right-side first tapered surface 81a and the left-side first tapered surface 81b are collectively referred to as a “first tapered surface 81”.
The receptacle connector 50 shown in
In the following description, in some cases, the inner side surface 53a of the insertion concave portion 51 is referred to as a “right inner side surface 53a”, and the inner side surface 53b is referred to as a “left inner side surface 53b”. Also, in some cases, the second tapered surface 91a connecting the right inner side surface 53a and the edge 90a of the insertion port 90 is referred to as a “right-side second tapered surface 91a”, and the second tapered surface 91b connecting the left inner side surface 53b and the edge 90a of the insertion port 90 is referred to as a “left-side second tapered surface 91b”.
On the other hand, in some cases, the right inner side surface 53a and the left inner side surface 53b are collectively referred to as an “inner side surface 53”, and the right-side second tapered surface 91a and the left-side second tapered surface 91b are collectively referred to as a “second tapered surface 91”. As shown in
In other words, the right-side first tapered surface 81a and the right outer side surface 33a have one common side (long side). Also, the right-side first tapered surface 81a and the end surface 80 have one common side (long side). Therefore, the width (Wa) of the right-side first tapered surface 81a means a distance along the right-side first tapered surface 81a between the two long sides. On the other hand, the left-side first tapered surface 81b and the left outer side surface 33b have one common side (long side). Also, the left-side first tapered surface 81b and the end surface 80 have one common side (long side). Therefore, the width (Wa) of the left-side first tapered surface 81b means a distance along the left-side first tapered surface 81b between the two long sides.
Furthermore, the right-side second tapered surface 91a and the right inner side surface 53a have one common side (long side). Also, the right-side second tapered surface 91a and the insertion port 90 have one common side (long side). Therefore, the width (Wb) of the right-side second tapered surface 91a means a distance along the right-side second tapered surface 91a between the two long sides. On the other hand, the left-side second tapered surface 91b and the left inner side surface 53b have one common side (long side). Also, the left-side second tapered surface 91b and the insertion port 90 have one common side (long side). Therefore, the width (Wb) of the left-side second tapered surface 91b means a distance along the left-side second tapered surface 91b between the two long sides.
As shown in
As shown in
While a part of each first connection terminal 34 in the longitudinal direction, the terminal extending along the inserting direction, protrudes upward from the flange portion 32, the other part of each first connection terminal 34 in the longitudinal direction protrudes downward from the flange portion 32. Therefore, while an upper-side end portion 35 of the first connection terminal 34 in the inserting direction is positioned above the flange portion 32, a lower-side end portion 36 of the first connection terminal 34 in the inserting direction is positioned below the flange portion 32. In some in cases in the following description, a part of the first connection terminal 34 in the longitudinal direction protruding upward from the flange portion 32 is referred to as an “upper portion 34a”, and the other part of the first connection terminal 34 protruding in the longitudinal direction downward from the flange portion 32 is referred to as a “lower portion 34b”.
As shown in
In the present embodiment, a plurality of pad groups each including four connection pads 37 are arranged along one side of the module substrate 5. Two outer connection pads 37 of the four connection pads 37 included in each pad group are used for grounding (G), and two inner connection pads 37 thereof are used for signals (S). In other words, in each pad group, the grounding pad, the signal pad, the signal pad, and the grounding pad are arranged in this order. The first connection terminals 34 in contact with the grounding connection pads 37 of the plurality of first connection terminals 34 are grounded, and differential signals are inputted to and outputted from the first connection terminals 34 in contact with the signal connection pads 37. That is, a pair of the first connection terminals 34 to/from which differential signals are inputted/outputted are sandwiched by the other pair of the grounded first connection terminals 34. Obviously, the description regarding the terminal arrangement is for not arrangement of low-speed signal (for example, control signal) terminals or power supply terminals but arrangement of high-speed signal terminals.
As shown in
The second connection terminals 54 each of which forms the right-side second terminal row and the left-side second terminal row extends along the inserting direction, and penetrates through the bottom portion 52 so as to reach upper and lower portions of the bottom portion 52. That is, while a part of the second connection terminal 54 in the longitudinal direction protrudes upward from the bottom portion 52 (inward from the insertion concave portion 51), the other part of the second connection terminal 54 in the longitudinal direction protrudes downward from the bottom portion 52 (outward from the insertion concave portion 51). Thus, in some cases in the following description, the part of the second connection terminal 54 protruding upward from the bottom portion 52 is referred to as an “upper portion 54a”, and the other part of the second connection terminal 54 protruding downward from the bottom portion 52 is referred to a “lower portion 54b”.
As shown in
As shown in
In the present embodiment, a plurality of pad groups each including four connection pads 57 are linearly arranged on the motherboard 100. Two outer connection pads 57 of the four connection pads 57 included in each pad group are used for grounding (G), and two inner connection pads 57 thereof are used for signals (S). In other words, in each pad group, the grounding pad, the signal pad, the signal pad, and the grounding pad are arranged in this order. The second connection terminals 54 of the plurality of second connection terminals 54, which are soldered on the grounding connection pads 57, are grounded, and differential signals are inputted to and outputted from the second connection terminals 54 soldered on the signal connection pads 57. That is, a pair of the second connection terminals 54 which differential signals are inputted to and outputted from is interposed to the other pair of the grounded second connection terminals 54.
As shown in
That is, the connection pads 37 (
The plug connector 30 connected to (inserted into) the receptacle connector 50 as described above is fixed by clips 60 shown in
Here, the second connection terminal 54 provided to the receptacle connector 50 has a straight shape. The straight shape means a shape having an upper-side end portion 55 in the inserting direction positioned higher than any other portion in the same direction as each other and not having a portion positioned at the same height in the inserting direction as shown in
In a state in which the plug connector 30 and the receptacle connector 50 are connected to each other, it is preferred that a direct distance along the inserting direction from the lower-side end portion 56 of the second connection terminal 54 in the inserting direction which has the straight shape to the upper-side end portion 35 of the first connection terminal 34 in the inserting direction in contact with the second connection terminal 54 is 6.0 mm or smaller. In other words, it is preferred that a height (H) from the lower-side end portion 56 of the second connection terminal 54 in the inserting direction to the upper-side end portion 35 of the first connection terminal in the inserting direction is 6.0 mm or smaller, and is 5.4 mm in the present embodiment.
As described above, a part of the signal transmission path between the photoelectric converting unit on the module substrate 5 and the semiconductor chip on the motherboard 100 is formed of the connector 2 (the first connection terminals 34 and the second connection terminals 54). However, a part of the signal transmission path formed of the connector 2 has poorer transmission characteristics than that of another part of signal transmission paths formed of wiring layers on the module substrate 5 and the motherboard 100. For example, at a part (hereinafter a “connector portion”) of the signal transmission path which is formed of the connector 2, it is difficult to completely match a characteristic impedance, and therefore, reflection tends to occur. Therefore, in view of suppressing signal degradation and improve transmission characteristics, it is preferred to shorten the length of the connector portion occupying the signal transmission path as much as possible. Specifically, it is preferred to set the length of the connector portion occupying the signal transmission path as a length within about one several-th of the wavelength of a signal propagating through the signal transmission path. For example, a fundamental wave of a high-speed signal of 25 Gbit/sec has a frequency of 12.5 GHz and a wavelength of 24.0 mm. On the other hand, in the present embodiment, the height (H) shown in
C1=C/(√{square root over (∈)})
C: light speed (about 30 ten thousands (three hundred thousands) Km/sec), ∈: relative permittivity
C1=f·λ,
f: frequency, λ: signal wavelength
Therefore, even if the signal wavelength in vacuum is 24.0 mm, the actual signal wavelength when propagating through the first connection terminal 34 and the second connection terminal 54 shown in
Absolutely, a multiple structure formed of the dielectric body and air (a relative permittivity about equal to that of the vacuum) is provided inside the connector 2. Therefore, the above description is for general outlines of the idea, and an effective relative permittivity (∈) can be considered as being smaller. Either way, in the present embodiment, the length of the connector portion occupying the signal transmission path is set at a length of about one several-th of the wavelength of the signal propagating through the signal transmission path, so that the signal degradation is reduced.
Note that the first tapered surface 81 having a sufficient width is provided to the insertion convex portion 31 of the plug connector 30, and therefore, ease of insertion of the insertion convex portion 31 into the insertion concave portion 51 is not degraded compared with the conventional art.
Also, in view of preventing crosstalk of electrical signals, it is preferred that a distance between the right-side first terminal row and the left-side first terminal row is sufficiently wider than a distance between two adjacent first connection terminals 34 in these terminal rows. Regarding this point, in the present embodiment, a distance (D1) between the first connection terminals 34 formed on the right outer side surface 33a and the first connection terminals 34 formed on the left outer side surface 33b shown in
Obviously, the distance (D2) shown in
Furthermore, it is preferred that an arrangement pitch (P1) of the first connection terminals 34 shown in
Still further, it is preferred that the width (W1) of the first connection terminal 34 shown in
The numerical values regarding the arrangement pitches, the distance between the connection terminals, and the width of the connection terminals are numerical values suitable for particularly achieving the transmission speed of 25 Gbit/sec or higher, a desired number of channels, highly-accurate impedance control, reduction in the manufacturing cost, etc.
Note that an effective fit length between the plug connector 30 and the receptacle connector 50 in the present embodiment is about 0.7 mm.
The present invention having the features described above is applicable to not only an optical communication module and an optical connector but also an electrical communication module and an electrical connector. Particularly, the present invention is suitable for application to an electrical communication module and an electrical connector used for a supercomputer, a data center, or others, for which extremely high reliability and high speed characteristics are required. Note that, when the present invention is applied to the electrical communication module or the electrical connector, the optical fiber 3 shown in
The present invention is not limited to the foregoing embodiments and various modifications and alterations can be made within the scope of the present invention. For example, the second tapered surface 19 shown in
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014-041723 | Mar 2014 | JP | national |
| 2014-054057 | Mar 2014 | JP | national |
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| Number | Date | Country | |
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