The present invention relates generally to communications connectors and, more specifically, to cross connect systems.
In an electrical communications system, it is sometimes advantageous to transmit information signals (e.g., video, audio, data) over a pair of conductors (hereinafter a “conductor pair” or a “differential pair” or simply a “pair”) rather than a single conductor. The signals transmitted on each conductor of the differential pair have equal magnitudes, but opposite phases, and the information signal is embedded as the voltage difference between the signals carried on the two conductors. This transmission technique is generally referred to as “balanced” transmission. When signals are transmitted over a conductor such as a copper wire in a communications cable, electrical noise from external sources such as lightning, computer equipment, radio stations, etc. may be picked up by the conductor, degrading the quality of the signal carried by the conductor. With balanced transmission techniques, each conductor in a differential pair often picks up approximately the same amount of noise from these external sources. Because approximately an equal amount of noise is added to the signals carried by both conductors of the differential pair, the information signal is typically not disturbed, as the information signal is extracted by taking the difference of the signals carried on the two conductors of the differential pair; thus the noise signal is cancelled out by the subtraction process.
Many communications systems include a plurality of differential pairs. For example, high speed communications systems that are used to connect computers and/or other processing devices to local area networks and/or to external networks such as the Internet typically include four differential pairs. In such systems, the conductors of the multiple differential pairs are usually bundled together within a cable, and thus necessarily extend in the same direction for some distance. Unfortunately, when multiple differential pairs are bunched closely together, another type of noise referred to as “crosstalk” may arise.
“Crosstalk” refers to signal energy from a conductor of one differential pair that is picked up by a conductor of another differential pair in the communications system. Typically, a variety of techniques are used to reduce crosstalk in communications systems such as, for example, tightly twisting the paired conductors (which are typically insulated copper wires) in a cable, whereby different pairs are twisted at different rates that are not harmonically related, so that each conductor in the cable picks up approximately equal amounts of signal energy from the two conductors of each of the other differential pairs included in the cable. If this condition can be maintained, then the crosstalk noise may be significantly reduced, as the conductors of each differential pair carry equal magnitude, but opposite phase signals such that the crosstalk added by the two conductors of a differential pair onto the other conductors in the cable tends to cancel out. While such twisting of the conductors and/or various other known techniques may substantially reduce crosstalk in cables, most communications systems include both cables and communications connectors that interconnect the cables and/or connect the cables to computer hardware. Unfortunately, the communications connector configurations that were adopted years ago generally did not maintain the conductors of each differential pair a uniform distance from the conductors of the other differential pairs in the connector hardware. Moreover, in order to maintain backward compatibility with connector hardware that is already in place, the connector configurations have, for the most part, not been changed. As a result, many current connector designs generally introduce some amount of crosstalk.
In particular, in many conventional connectors, for backward compatibility purposes, the conductive elements of a first differential pair in the connector are not equidistant from the conductive elements that carry the signals of a second differential pair. Consequently, when the conductive elements of the first pair are excited differentially (i.e., when a differential information signal is transmitted over the first differential pair ), a first amount of signal energy is coupled (capacitively and/or inductively) from a first conductive element of the first differential pair onto a first conductive element of the second differential pair and a second, lesser, amount of signal energy is coupled (capacitively and inductively) from a second conductive element of the first differential pair onto the first conductive element of the second differential pair. As such, the signals induced from the first and second conductive elements of the first differential pair onto the first conductive element of the second differential pair do not completely cancel each other out, and what is known as a differential-to-differential crosstalk signal is induced on the second differential pair. This differential-to-differential crosstalk includes both near-end crosstalk (NEXT), which is the crosstalk measured at an input location corresponding to a source at the same location, and far-end crosstalk (FEXT), which is the crosstalk measured at the output location corresponding to a source at the input location. NEXT and FEXT each comprise an undesirable signal that interferes with the information signal. In many connector systems, a plurality of differential pairs will be provided, and differential-to-differential crosstalk may be induced between various of these differential pairs.
A second type of crosstalk, referred to as differential-to-common mode crosstalk, may also be generated as a result of, among other things, the conventional connector configurations. Differential-to-common mode crosstalk arises where the first and second conductors of a differential pair, when excited differentially, couple unequal amounts of energy on both conductors of another differential pair where the two conductors of the victim differential pair are treated as the equivalent of a single conductor. This crosstalk is an undesirable signal that may, for example, negatively effect the overall channel performance of the communications system.
Cross-connect wiring systems such as, for example, 110-style and other similar cross-connect wiring systems are well known and are often seen in wiring closets terminating a large number of incoming and outgoing wiring systems. Cross-connect wiring systems commonly include index strips mounted on terminal block panels which seat individual wires from cables. A plurality of 110-style punch-down wire connecting blocks are mounted on each index strip, and each connecting block may be subsequently interconnected with either interconnect wires or patch cord connectors encompassing one or more pairs. A 110-style wire connecting block has a dielectric housing containing a plurality of double-ended slotted beam insulation displacement contacts (IDCs) that typically connect at one end with a plurality of wires seated on the index strip and with interconnect wires or flat beam contact portions of a patch cord connector at the opposite end.
Two types of 110-style connecting blocks are most common. The first type is a connecting block in which the IDCs are generally aligned with one another in a single row (see, e.g., U.S. Pat. No. 5,733,140 to Baker, III et al., the disclosure of which is hereby incorporated herein in its entirety). The second type is a connecting block in which the IDCs are arranged in two rows and are staggered relative to each other (see, e.g., GP6 Plus Connecting Block, available from Panduit Corp., Tinley Park, Ill.). In either case, the IDCs are arranged in pairs within the connecting block, with the pairs sequenced from left to right, with each pair consisting of a positive polarized IDC designated as the “TIP” and a negatively polarized IDC designated as the “RING.”
The staggered arrangement results in lower differential-to-differential crosstalk levels in situations in which interconnect wires (rather than patch cord connectors) are used. In such situations, the aligned type 110-style connecting block relies on physical separation of its IDCs or compensation in an interconnecting patch cord connector to minimize unwanted crosstalk, while the staggered arrangement, which can have IDCs that are closer together, combats differential-to-differential crosstalk by locating each IDC in one pair approximately equidistant from the two IDCs in the adjacent pair nearest to it; thus, the crosstalk experienced by the two IDCs in the adjacent pair is essentially the same, with the result that its differential-to-differential crosstalk is largely canceled.
These techniques for combating crosstalk have been largely successful in deploying 110-style connecting blocks in channels supporting signal transmission frequencies under 250 MHz. However, increased signal transmission frequencies and stricter crosstalk requirements have identified an additional problem: namely, differential-to-common mode crosstalk. This problem is discussed at some length in co-pending and co-assigned U.S. patent application Ser. No. 11/044,088, filed Mar. 25, 2005, the disclosure of which is hereby incorporated herein in its entirety. In addition, differential-to-differential crosstalk levels generally increase with increasing frequency, and conventional 110-style cross connect systems may not provide adequate differential-to-differential crosstalk cancellation at frequencies above 250 MHz.
Pursuant to embodiments of the present invention, communications connector are provided. These connectors include a housing having an upper end and a lower end. The upper end of the housing includes a plurality of slits that define a plurality of pillars. First through fourth pairs of tip and ring insulation displacement contacts (IDCs) mounted in the housing. Each of the IDCs is substantially planar, and each IDC has an upper end that has a first slot, a lower end that has a second slot and an intermediate portion between the upper end and the lower end, the lower end being offset from the upper end. The first slot of each IDC is aligned with a respective one of the slits. The housing further includes through slots that are separated by dividers, where each of the through slots is sized to receive the upper end of a respective one of the IDCs, and each slit of the plurality of slits exposes opposed edges of the first slot of a respective one of the IDCs.
In some embodiments, the communication connector is mounted on a terminal block such that the first slot and the second slot of each IDC are on a first side of the terminal block. In some embodiments, the tip IDCs may be aligned in a first row within the housing and the ring IDCs may be aligned in a second row within the housing. The intermediate portion of each IDC may be received by the lower end of the housing. At least portions of the lower end of each of the IDCs may extend outside the housing through one or more openings in the lower end of the housing.
In some embodiments, the IDCs of each pair of IDCs may cross over each other. Moreover, the upper end of a first IDC of the first pair of IDCs may be substantially equidistant from the upper ends of both IDCs of the second pair of IDCs and may be substantially equidistant from the upper ends of both IDCs of the third pair of IDCs. The first slot and the second slot of each IDC may also be generally parallel and non-collinear.
Pursuant to further embodiments of the present invention, communications connectors are provided that include a dielectric housing that includes a first row of through slots and a second row of through slots. The housing further includes a plurality of dividers that separate respective ones of the through slots in the first row from corresponding through slots in the second row. At least four pairs of substantially planar tip and ring IDCs are mounted in the housing such that each IDC is at least partly received within a respective one of the through slots, with the tip IDCs received within the through slots in the first row of through slots and the ring IDCs received within the through slots in the second row of through slots. Each of the IDCs has an upper end that has a first wire receiving slot and a lower end that has a second wire receiving slot, the first wire receiving slot and the second wire receiving slot of each IDC being generally parallel and non-collinear. An upper end of the housing includes a plurality of slits that define a plurality of pillars, where each slit of the plurality of slits exposes inner edges of the first wire receiving slot of a respective one of the IDCs.
In some embodiments of these connectors, the upper end of a first IDC of the first pair of IDCs may be substantially equidistant from the upper ends of both IDCs of the second pair of IDCs. The first IDC of each of the pairs of IDCs may also cross over the second IDC of its respective pair of IDCs. The upper and lower ends of the IDCs of the first pair of IDCs and the upper and lower ends of the IDCs of the second pair of IDCs may also be located to self-compensate for crosstalk between the IDCs of the first and second pairs of IDCs.
The present invention will be described more particularly hereinafter with reference to the accompanying drawings. The invention is not intended to be limited to the illustrated embodiments; rather, these embodiments are intended to fully and completely disclose the invention to those skilled in this art. In the drawings, like numbers refer to like elements throughout. Thicknesses and dimensions of some components may be exaggerated for clarity.
Spatially relative terms, such as “under”, “below”, “lower”, “over”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “under” or “beneath” other elements or features would then be oriented “over” the other elements or features. Thus, the exemplary term “under” can encompass both an orientation of over and under. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Well-known functions or constructions may not be described in detail for brevity and/or clarity.
As used herein the expression “and/or” includes any and all combinations of one or more of the associated listed items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Where used, the terms “attached”, “connected”, “interconnected”, “contacting”, “mounted” and the like can mean either direct or indirect attachment or contact between elements, unless stated otherwise.
Communications connectors according to embodiments of the present invention will now be described with respect to
As shown in
As is shown in
An exemplary connecting block 22 may include a main housing 40, two locking members 48 and eight IDCs 24a-24h. These components are described below with respect to
Referring now to
As is illustrated in
As can be seen in
The IDCs 24a-24h can be divided into TIP-RING IDC pairs as set forth in Table 1 below, where by convention, the TIP is the positively polarized terminal and the RING is the negatively polarized terminal. Each of the RINGS of the IDC pairs are in one row, and each of the TIPS of the IDC pairs are in the other row.
As is shown in
As is best seen in
As a consequence of this configuration, the IDCs can self-compensate for differential-to-common mode crosstalk. The opposite proximities on the upper and lower ends of the TIP and RING IDCs of one pair to the adjacent pair can compensate the capacitive crosstalk generated between the pairs. The presence of the crossover in the signal-carrying path defined by the IDCs can compensate for the inductive crosstalk generated between the pairs. At the same time the arrangement of the IDCs at the upper end 32 and the lower end 30 enables the IDCs to self-compensate for differential-to-differential crosstalk by locating each IDC in one pair approximately equidistant from the two IDCs in the adjacent pair nearest to it. Because both the differential-to-common mode crosstalk as well as the differential-to-differential crosstalk between pairs are compensated, the connecting block 22 can provide improved crosstalk performance, particularly at elevated frequency levels.
In a number of cross-connect systems, the electrical performance of the system may be optimized when the connecting blocks 22 are terminated with punch down wires. When the connecting block 22 is instead terminated using patch plugs 28, the electrical performance of the connecting block 22 may degrade. As a result, in some systems, it is necessary to impose more restrictive cable length restrictions or other restrictions on the cross-connect system to ensure that the performance of the cross-connect system complies with applicable standards when some or all of the connecting blocks 22 are terminated using patch plugs 28 as opposed to punch down wires.
Pursuant to further embodiments of the present invention, self-compensating cross-connect systems are provided that include balanced plugs so as to have low differential-to-differential and low differential-to-common mode crosstalk when patch plugs are used in the cross-connect system. As a result, the additional cable length restrictions that may be necessary with conventional cross-connect systems when such systems are used in conjunction with patch plugs may be reduced or eliminated.
As shown in
In particular, as shown in
The patch plug 210 may include a dielectric housing 220. The dielectric housing may be formed of two pieces which snap together and capture plug contacts 224a-224h. The housing may be molded from a polycarbonate resin or other suitable material. The housing may include slots or other structure that is configured to receive and hold plug contacts 224a-224h in place. The plug contacts 224a-224h may be factory-installed and firmly embedded in the housing. Each conductor of the four differential pairs in the cord terminates into a respective one of the IDCs provided at the respective IDC regions 226a-226h of the plug contacts 224a-224h. The conductors of the differential pairs are connected so that the differential pair relationship in the cable is maintained in the plug. The housing 220 may also include other conventional features such as a strain relief mechanism, a retainment latch, alignment flanges and the like which are known to those of skill in the art and thus will not be discussed further herein.
In the particular embodiment of the patch plug 210 of
Those skilled in this art will appreciate that connecting blocks, IDCs, patch plugs and plug contacts according to embodiments of the present invention may take other forms. For example, the components of the connecting block and plug housings may be replaced with a wide variety of different housing shapes and/or configurations. The number of pairs of IDCs and/or plug contacts may differ from the four pairs illustrated herein. Likewise, the IDCs and/or plug contacts may be unevenly spaced. The IDCs may, for example, lack the brace 36 in the slots that receive conductors. Also, the IDCs may lack the engagement recesses or may include some other structure (perhaps a tooth or nub) that engages a portion of the mounting substrate to anchor the IDCs. Also, IDCs as described above may be employed in connecting blocks of the “aligned” type or “staggered” type having no pair crossovers discussed above or in another arrangement. Furthermore, the upper sections 32 and the lower sections 30 of the IDCs may be physically separated form each other and mounted to a printed wiring board in arrays similar to
In some embodiments of the present invention, the connecting block 22 may also include one or more parasitic conductive loops as disclosed and described in detail in co-pending U.S. patent application Ser. No. 11/369,457, filed on Mar. 7, 2006, the contents of which are incorporated by reference herein as if set forth in its entirety.
The foregoing is illustrative of the present invention and is not to be construed as limiting thereof. Although exemplary embodiments of this invention have been described, those skilled in the art will readily appreciate that many modifications are possible in the exemplary embodiments without materially departing from the novel teachings and advantages of this invention. Accordingly, all such modifications are intended to be included within the scope of this invention as defined in the claims. The invention is defined by the following claims, with equivalents of the claims to be included therein.
This application claims priority as a continuation of U.S. patent application Ser. No. 11/734,887, filed Apr. 13, 2007, now U.S. Pat. No. 7,503,798, which in turn claims priority as a continuation-in-part application of U.S. patent application Ser. No. 11/154,836, filed Jun. 16, 2005, now U.S. Pat. No. 7,223,115, which in turn claims priority from U.S. Provisional Patent Application Ser. No. 60/687,112, filed Jun. 3, 2005, the disclosures of each of which are hereby incorporated by reference herein in their entireties.
Number | Name | Date | Kind |
---|---|---|---|
4127312 | Fleischhacker et al. | Nov 1978 | A |
4359257 | Lopinski et al. | Nov 1982 | A |
4470655 | Kalka et al. | Sep 1984 | A |
4475786 | Root et al. | Oct 1984 | A |
4655528 | Groft | Apr 1987 | A |
4897041 | Heiney et al. | Jan 1990 | A |
5199899 | Ittah | Apr 1993 | A |
5226835 | Baker et al. | Jul 1993 | A |
5399106 | Ferry | Mar 1995 | A |
5683268 | Drach et al. | Nov 1997 | A |
5722850 | White | Mar 1998 | A |
5730608 | Legrad | Mar 1998 | A |
5762516 | Itoga et al. | Jun 1998 | A |
5779504 | Dominiak et al. | Jul 1998 | A |
5961340 | Littlejohn et al. | Oct 1999 | A |
5961341 | Knowles et al. | Oct 1999 | A |
5961342 | Daoud | Oct 1999 | A |
6065994 | Hashim et al. | May 2000 | A |
6107578 | Hashim | Aug 2000 | A |
6247974 | Jenner et al. | Jun 2001 | B1 |
6288334 | Hennum | Sep 2001 | B1 |
6309240 | Daoud | Oct 2001 | B1 |
6494723 | Yamane et al. | Dec 2002 | B2 |
6592395 | Brown et al. | Jul 2003 | B2 |
6612880 | Arnett et al. | Sep 2003 | B2 |
6666706 | Jones et al. | Dec 2003 | B1 |
6716054 | Denovich et al. | Apr 2004 | B1 |
6729899 | Aekins et al. | May 2004 | B2 |
6878004 | Oh | Apr 2005 | B2 |
7223115 | Hashim et al. | May 2007 | B2 |
20060292920 | Hashim et al. | Dec 2006 | A1 |
Number | Date | Country | |
---|---|---|---|
20090137154 A1 | May 2009 | US |
Number | Date | Country | |
---|---|---|---|
60687112 | Jun 2005 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11734887 | Apr 2007 | US |
Child | 12362764 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11154836 | Jun 2005 | US |
Child | 11734887 | US |