The present invention relates to phased array antenna systems, and more particularly to a longitudinally compliant, internally cooled phased array antenna system in which a cooling medium is flowed through an interior area of a core component to cool the core component and other electronic components supported on the core component.
Phased array antennas are used in a variety of commercial and military applications. Typically, these antennas include hundreds of transmit/receive radiating elements that are supported adjacent one surface of a core component. Typically, the core component is made from a thermally conductive material such as aluminum. Also supported on the core component is a plurality of ceramic chip carrier boards that support a plurality of monolithic microwave integrated circuits (MMICs), phase shifters and other components. These components generate heat which is radiated through thermally conductive standoffs that are used to support the ceramic chip carrier boards closely adjacent the core component. In previously developed systems, the core component itself is supported on a cold plate. The cold plate has internally formed channels or tubes integrally formed with it to circulate a fluid through the cold plate. The fluid helps to draw heat from the core component, which in turn enables the ceramic chip carrier boards to be cooled.
While the above arrangement has proven to be successful in many applications, it would nevertheless be desirable to provide even more efficient cooling of the ceramic chip carrier and its components. Increased cooling ability is expected to become important as phased array antennas support even greater numbers of radiating elements and associated MMICs, phase shifters, etc., that will generate even greater amounts of heat that will need to be dissipated.
Thus, there remains a need to even further improve the cooling of a phased array module using a cooling medium, but which does not significantly complicate the construction of a phased array antenna, nor which limits the number of radiating/reception elements that may be employed or otherwise interferes with mounting of the ceramic chip carrier boards on a module core component.
The present invention is directed to a phased array antenna system in which a cooling medium is circulated through an elongated core component of the system to even more efficiently cool the electronic components of the antenna system during use. The core component also includes a leaf spring-like structure formed at a lower portion of the core component that allows the lower portion to flex slightly, relative to the remainder of the core component, when the core component is secured to a printed wiring board subassembly. This enables excellent electrical contact to be maintained with the printed wiring board subassembly along the full length of the core component.
In one preferred implementation the core component forms an elongated mandrel having both a cooling medium carrying channel formed inside, as well as a hollowed out area for allowing air to circulate within the inside area of the mandrel. The core component has a length sufficient to support a plurality of electronic component boards in side-by-side fashion, on opposing side surfaces of the mandrel.
In one preferred implementation the core component is formed from a solid block of aluminum. The leaf spring-like structure is formed by removing material from an interior area of the mandrel, as well as from opposing side portions, such that a plurality of U-shaped leaf spring-like sections of material are formed. The U-shaped leaf spring-like sections of material enable one end portion of the mandrel to be compliant and thus to flex slightly along its length as the mandrel is secured to a printed wiring board. A multi-layer flexible interconnect circuit assembly is coupled to the one end of the mandrel. The compliant section of the mandrel ensures that the multi-layer flexible interconnect circuit assembly makes excellent contact with conductive traces on a printed wiring board, along its full length, once the mandrel is secured to the printed wiring board. This ensures electrical communication between contacts on the printed wiring board and circuit traces formed on the flexible interconnect circuit assembly.
The features, functions, and advantages can be achieved independently in various embodiments of the present inventions or may be combined in yet other embodiments.
The present invention will become more fully understood from the detailed description and the accompanying drawings, wherein:
The following description of the preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Referring to
Referring to
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With further reference to
The circulator subassemblies 32 each comprise four channel open (i.e., quad) circulators that are commercially available. The circulator subassemblies 32 are in electrical communication with associated ceramic chip carrier subassembly boards 30. Referring to
Referring further to
Referring further to
While the mandrel 28 of
Each of the ceramic chip carrier boards 30 are preferably secured via thermally conductive adhesive to the mandrel 28. Suitable electrically conductive adhesives are commercially available.
Referring further to
Referring further to
The system 10 of the present invention thus enables an elongated core component of a phased array antenna module to be secured along its full length to a printed circuit assembly while ensuring that proper electrical contact is made along the full length of the core component with the printed wiring board to which it is secured. The internal cooling passageway incorporated into the mandrel 28 allows even more efficient cooling of the ceramic chip carrier boards used with phased array antenna systems, since the cooling medium is flowed very close to the source of the heat being generated in the module (i.e., the ceramic chip carrier boards). The use of a single length of thermally conductive material (for example, aluminum) to form the mandrel further eliminates the need for seals or gaskets to be employed, if the mandrel was to be formed in two or more independent sections and then secured together to form a single mandrel assembly.
While various preferred embodiments have been described, those skilled in the art will recognize modifications or variations which might be made without departing from the inventive concept. The examples illustrate the invention and are not intended to limit it. Therefore, the description and claims should be interpreted liberally with only such limitation as is necessary in view of the pertinent prior art.
Number | Name | Date | Kind |
---|---|---|---|
4806941 | Knochel et al. | Feb 1989 | A |
5008678 | Herman | Apr 1991 | A |
5023624 | Heckaman et al. | Jun 1991 | A |
5136304 | Peters | Aug 1992 | A |
5184141 | Connolly et al. | Feb 1993 | A |
5219377 | Poradish | Jun 1993 | A |
5276455 | Fitzsimmons et al. | Jan 1994 | A |
5434581 | Raguenet et al. | Jul 1995 | A |
5488380 | Harvey et al. | Jan 1996 | A |
5539420 | Dusseux et al. | Jul 1996 | A |
5557291 | Chu | Sep 1996 | A |
5675345 | Pozgay et al. | Oct 1997 | A |
5825333 | Kudoh et al. | Oct 1998 | A |
5854607 | Kinghorn | Dec 1998 | A |
5886671 | Riemer et al. | Mar 1999 | A |
5923289 | Buer et al. | Jul 1999 | A |
5982250 | Hung et al. | Nov 1999 | A |
5990835 | Kuntzsch et al. | Nov 1999 | A |
6018659 | Ayyagari et al. | Jan 2000 | A |
6154176 | Fathy et al. | Nov 2000 | A |
6166705 | Mast et al. | Dec 2000 | A |
6211824 | Holden et al. | Apr 2001 | B1 |
6232919 | Marumoto et al. | May 2001 | B1 |
6249439 | DeMore et al. | Jun 2001 | B1 |
6297774 | Chung | Oct 2001 | B1 |
6297775 | Haws et al. | Oct 2001 | B1 |
6320547 | Fathy et al. | Nov 2001 | B1 |
6396440 | Chen | May 2002 | B1 |
6407704 | Franey et al. | Jun 2002 | B1 |
6424313 | Navarro et al. | Jul 2002 | B1 |
6429816 | Whybrew et al. | Aug 2002 | B1 |
6504724 | Serizawa et al. | Jan 2003 | B2 |
6617510 | Schreiber et al. | Sep 2003 | B2 |
6687969 | Dando | Feb 2004 | B1 |
6698091 | Heston et al. | Mar 2004 | B1 |
6700052 | Bell | Mar 2004 | B2 |
6718815 | Fantini | Apr 2004 | B2 |
6749459 | Urbaniak et al. | Jun 2004 | B2 |
6750539 | Haba et al. | Jun 2004 | B2 |
6952345 | Weber et al. | Oct 2005 | B2 |
7092255 | Barson et al. | Aug 2006 | B2 |
7110260 | Weber et al. | Sep 2006 | B2 |
7129908 | Edward et al. | Oct 2006 | B2 |
7187342 | Heisen et al. | Mar 2007 | B2 |
20020003497 | Gilbert et al. | Jan 2002 | A1 |
20020018019 | Fourdeux et al. | Feb 2002 | A1 |
20040151876 | Tanielian | Aug 2004 | A1 |
20050134514 | Navarro | Jun 2005 | A1 |
Number | Date | Country |
---|---|---|
0 889 542 | Jan 1999 | EP |
0 889 543 | Jan 1999 | EP |
0 910 134 | Apr 1999 | EP |
1 094 541 | Apr 2001 | EP |
1 381 083 | Jan 2004 | EP |
10-270935 | Sep 1998 | JP |
WO 9934477 | Jul 1999 | WO |
WO 0039893 | Jul 2000 | WO |
WO 0209236 | Jan 2002 | WO |
WO 0223966 | Mar 2002 | WO |
Number | Date | Country | |
---|---|---|---|
20070035448 A1 | Feb 2007 | US |