Claims
- 1. A composite clay material, comprising:
- a) a clay mineral having an interlayer section;
- b) an onium ion having 6 or more carbon atoms, bonding to said clay mineral by an ionic bond for expanding said interlayer section and rendering said interlayer section compatible with an organic molecule; and
- c) a first guest molecule as said organic molecule, having a polar group in a min chain or a side chain thereof or both, being at least partially incorporated into said expanded interlayer section and bonded to said clay mineral through hydrogen bonding between said clay mineral and said polar group; and a second guest molecule without a polar group as said organic molecule being at least partially incorporated into said expanded interlayer section,
- said first guest molecule having a molecular length equal to or smaller than that of said organic onium ion, and said second guest molecule having a molecular length equal to or greater than that of said organic onium ion, wherein said first guest molecule is an olefin or a paraffin, and said second guest molecule is a non-polar oligomer or a non-polar polymer.
- 2. The composite clay material of claim 1, wherein 10 wt % of a total molecular amount of said first guest molecule is incorporated into said interlayer section of said clay mineral.
- 3. The composite clay material of claim 1, wherein said polar group of said first guest molecule is at least one selected from the group consisting of hydroxyl, halogen, carboxyl, anhydrous carboxylic acid, thiol, epoxy and amino.
- 4. A method for producing a composite clay material, comprising:
- a) incorporating an organic onium ion into an interlayer section of a clay mineral by contacting said onium ion with said clay mineral and forming an ionic bond therebetween for expanding said interlayer section and rendering said interlayer section compatible with an organic molecule, said organic onium ion having 6 or more carbon atoms; and
- b) contacting said rendered interlayer section of said clay mineral with a first guest molecule and a second guest molecule, and forming a hydrogen bonding between said rendered interlayer section and said first guest molecule for further rendering said rendered interlayer section hydrophobic so that said second guest molecule is at least partially incorporated into said further rendered interlayer section of said clay mineral, said first guest molecular having a molecular length equal to or smaller than that of said organic onium ion and a polar group therein, said second guest molecule without a polar group having a molecular length larger than that of said organic onium ion.
- 5. The method of claim 4, wherein said first guest molecule first contacts said rendered interlayer section and, subsequently, said second guest molecule contacts said further rendered interlayer section.
- 6. The method of claim 5, wherein said first guest molecule and said second guest molecule are simultaneously brought into contact with said rendered interlayer section.
- 7. The method of claim 5, wherein said first guest molecule and said second guest molecule are dissolved in a solvent in contacting said rendered clay mineral.
- 8. The method of claim 5, wherein said first guest molecule and said second guest molecule are heated into a softened or molten state in contacting said rendered clay mineral.
- 9. A blend material comprising the composite clay material of claim 1, and a resin material, wherein said composite clay material is mixed with a resin material which is formed of an oligomer or a polymer of the same or different type of said second guest molecule.
Priority Claims (3)
Number |
Date |
Country |
Kind |
7-163016 |
Jun 1995 |
JPX |
|
7-188648 |
Jun 1995 |
JPX |
|
7-201592 |
Jul 1995 |
JPX |
|
Parent Case Info
This application is a division of application Ser. No. 08/656,864 filed on May 30, 1996, now U.S. Pat. No. 5,973,053.
US Referenced Citations (6)
Foreign Referenced Citations (3)
Number |
Date |
Country |
36 32 865 |
Apr 1987 |
DEX |
38 06 548 |
Sep 1988 |
DEX |
38 10 006 |
Oct 1988 |
DEX |
Non-Patent Literature Citations (3)
Entry |
Database WPI, Derwent Publications, AN-78-78801A, JP-A-53 109 545, Sep. 25, 1978. |
Chemical Abstracts, vol. 115, No. 24, Dec. 16, 1991, AN 259248v, Yoshiyuki Sugahara et al. |
Chemcial Abstracts, vol. 114, No. 24, Jun. 17, 1991, AN 2299B8s, Eduardo Ruiz-Hitzky et al. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
656864 |
May 1996 |
|