Claims
- 1. A composite metallic material comprising:
a metallic material substrate; and a high polymer thin layer having a fine pattern formed on at least one surface of the substrate by self-organization.
- 2. The composite metallic material as recited in claim 1, wherein the high polymer thin film is a film formed by drying hydrophobic organic solvent solution of a high polymer compound.
- 3. The composite metallic material as recited in claim 1, wherein the fine pattern is a fine pore structure with a number of arranged pores.
- 4. The composite metallic material as recited in claim 2, wherein the fine pattern is a fine pore structure with a number of arranged pores.
- 5. The composite metallic material as recited in claim 3 or 4, wherein the pore has a diameter of 0.01 to 50 μm.
- 6. The composite metallic material as recited in any one of claims 3 to 5, wherein the pores are formed at intervals of 1 to 50 μm.
- 7. The composite metallic material as recited in claim 3, wherein a substance having conducting property higher than that of oxides of the metallic material substrate is filled in the pores.
- 8. The composite metallic material as recited in claim 4, wherein a substance having conducting property higher than that of oxides of the metallic material substrate is filled in the pores.
- 9. The composite metallic material as recited in any one of claims 1, 2, 3, 4, 7 and 8, wherein the metallic material substrate is made of valve-action metal.
- 10. The composite metallic material as recited in claim 9, wherein the valve-action metal is aluminum.
- 11. The composite metallic material as recited in claim 10, wherein the composite metallic material is an aluminum material for electrolytic capacitor electrodes.
- 12. A composite metallic material, comprising:
a metallic material substrate; and a number of fine spots made of material having conducting property higher than that of oxides of the metallic material substrate, the fine spots being arranged on at least one surface of the metallic material substrate.
- 13. The composite metallic material as recited in claim 12, wherein the fine spot has a diameter of 0.01 to 50 μm.
- 14. The composite metallic material as recited in claim 12 or 13, wherein the fine spots are formed at intervals of 1 to 50 μm.
- 15. The composite metallic material as recited in claim 12, wherein the metallic material substrate is made of valve-action metal.
- 16. The composite metallic material as recited in claim 15, wherein the valve-action metal is aluminum.
- 17. The composite metallic material as recited in claim 16, wherein the composite metallic material is an aluminum material for electrolytic capacitor electrodes.
- 18. A method for manufacturing a composite metallic material comprising a metallic material substrate and a high polymer thin layer having a fine pattern formed in at least one surface of the substrate by self-organization, wherein the high polymer thin film is formed by drying hydrophobic organic solvent solution of a high polymer compound.
- 19. The method for manufacturing the composite metallic material as recited in claim 18, comprising:
casting hydrophobic organic solvent solution of a high polymer compound on a surface of the metallic material substrate; evaporating the organic solvent to make dew on a surface of the solution; and evaporating minute water drops generated by the dew to thereby form a high polymer thin film having a number of arranged pores.
- 20. The method for manufacturing the composite metallic material as recited in claim 18, comprising:
casting hydrophobic organic solvent solution of a high polymer compound on another surface of a substrate other than the metallic material substrate; evaporating the organic solvent to make dew on a surface of the solution; evaporating minute water drops generated by the dew to thereby form a high polymer thin film having a number of arranged pores; removing the high polymer thin film from the another substrate; and attaching the removed high polymer thin film on a surface of the metallic material substrate.
- 21. The method for manufacturing the composite metallic material as recited in claim 19, further comprising the step of filling a substance having conducting property higher than that of oxides of the metallic material substrate in the pores.
- 22. The method for manufacturing the composite metallic material as recited in claim 20, further comprising the step of filling a substance having conducting property higher than that of oxides of the metallic material substrate in the pores.
- 23. The method for manufacturing the composite metallic material as recited in claim 21 or 22, wherein the step of filling the substance having conducting property higher than that of oxides of the metallic material substrate is performed by any one of methods consisting of a plating method, a depositing method and a immersing method.
- 24. The method for manufacturing the composite metallic material as recited in any one of claims 18 to 22, wherein the high polymer compound is amphiphilic property high polymer compound.
- 25. The method for manufacturing the composite metallic material as recited in claim 24, wherein the amphiphilic property high polymer compound is ion complex of polystyrene sulfonic acid and long chain dialkyl ammonium salt.
- 26. The method for manufacturing the composite metallic material as recited in any one of claims 18 to 22, wherein the density of the hydrophobic organic solvent solution of high polymer compound is 0.01 to 10 mass %.
- 27. The method for manufacturing the composite metallic material as recited in any one of claims 18 to 22, wherein the forming of the high polymer compound is performed in an atmosphere of high temperature and high humidity.
- 28. A method for manufacturing a composite metallic material comprising a metallic material substrate and a number of fine spots made of material having conducting property higher than that of oxides of the metallic material substrate, the fine spots being arranged on at least one surface of the metallic material substrate, the method, comprising:
disposing a high polymer thin film having a number of arranged pores on a surface of the metallic material substrate; filling a substance having a conducting property higher than that of oxides of the metallic material substrate in the pores; and thereafter; removing the high polymer thin film.
- 29. The method for manufacturing a composite metallic material as recited in claim 28, comprising:
casting hydrophobic organic solvent solution of high polymer compound on a surface of the metallic material substrate; evaporating the organic solvent to make dew on a surface of the solution; and evaporating minute water drops generated by the dew to thereby form a high polymer thin film and dispose the high polymer thin film on the metallic material substrate.
- 30. The method for manufacturing a composite metallic material as recited in claim 28, comprising:
casting hydrophobic organic solvent solution of high polymer compound on a surface of another substrate other than the metallic material substrate; evaporating the organic solvent to make dew on a surface of the solution; evaporating minute water drops generated by the dew to thereby form a high polymer thin film having a number of arranged pores; removing the high polymer thin film from the another substrate; and attaching the removed high polymer thin film on a surface of the metallic material substrate to thereby dispose it thereon.
- 31. The method for manufacturing the composite metallic material as recited in any one of claims 28 to 30, wherein the step of filling the substance having conducting property higher than that of oxides of the metallic material substrate is performed by any one of methods including a plating method, a depositing method and a immersing method.
- 32. The method for manufacturing the composite metallic material as recited in any one of claims 28 to 30, wherein the high polymer compound is an amphiphilic high polymer compound.
- 33. The method for manufacturing the composite metallic material as recited in claim 32, wherein the amphiphilic high polymer compound is ion complex of polystyrene sulfonic acid and long chain dialkyl ammonium salt.
- 34. The method for manufacturing the composite metallic material as recited in any one of claims 28 to 30, wherein the density of the hydrophobic organic solvent solution of high polymer compound is 0.01 to 10 mass %.
- 35. The method for manufacturing the composite metallic material as recited in any one of claims 28 to 30, wherein the forming of the high polymer compound is performed in an atmosphere of high temperature and high humidity.
- 36. The method for manufacturing the composite metallic material as recited in any one of claims 28 to 30, wherein the removing of the high polymer thin film is performed by melting.
- 37. A metallic material having etching pits formed in a composite metallic material, wherein the composite metallic material includes a metallic material substrate and a high polymer thin layer having a fine pattern formed in at least one surface of the substrate by self-organization, and wherein the etching pits are formed based on the fine pattern.
- 38. The metallic material as recited in claim 37, wherein the etched metallic material is an aluminum material for electrolytic capacitor electrodes.
- 39. A metallic material having etching pits, wherein a composite metallic material comprising a metallic material substrate and a number of fine spots made of material having conducting property higher than that of oxides of the metallic material substrate and arranged on at least one surface of the metallic material substrate is subjected to etching processing, whereby the etching pits are formed based on the fine spots.
- 40. The metallic material as recited in claim, wherein the etched metallic material is an aluminum material for electrolytic capacitor electrodes.
- 41. A method for manufacturing an etched metallic material having etching pits, wherein the etching pits are formed by subjecting a composite metallic material comprising a metallic material substrate and a high polymer thin layer having a fine pattern formed on at least one surface of the substrate by self-organization to etching processing without removing the high polymer thin film.
- 42. A method for manufacturing an etched metallic material having etching pits, wherein the etching pits are formed by subjecting a composite metallic material comprising a metallic material substrate and a high polymer thin layer having a fine pattern formed on at least one surface of the substrate by self-organization to initial etching processing without removing the high polymer thin film, thereafter removing the high polymer thin film and further subjecting the composite metallic material to etching processing to grow the etching pits.
- 43. The method for manufacturing the etched metallic material as recited in claim 41, wherein the etched metallic material is an aluminum material for electrolytic capacitor electrodes.
- 44. The method for manufacturing the etched metallic material as recited in claim 42, wherein the etched metallic material is an aluminum material for electrolytic capacitor electrodes.
- 45. A method for manufacturing an etched metallic material having etching pits, wherein the etching pits are formed by subjecting a composite metallic material comprising a metallic material substrate and a number of fine spots made of material having conducting property higher than that of oxides of the metallic material substrate and arranged on at least one surface of the metallic material substrate to etching processing.
- 46. The method for manufacturing the etched metallic material as recited in claim 45, wherein the etched metallic material is an aluminum material for electrolytic capacitor electrodes.
- 47. An electrolytic capacitor made of an etched metallic material having etching pits as an electrode material, wherein a composite metallic material comprising a metallic material substrate and a high polymer thin layer having a fine pattern formed on at least one surface of the substrate by self-organization is subjected to etching processing, whereby the etching pits are formed based on the fine pattern.
- 48. An electrolytic capacitor made of an etched metallic material having etching pits as an electrode material, wherein a composite metallic material comprising a metallic material substrate and a number of fine spots made of material having conducting property higher than that of oxides of the metallic material substrate and arranged on at least one surface of the metallic material substrate is subjected to etching processing, whereby the etching pits are formed based on the fine spots.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2002-17468 |
Jan 2002 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is an application filed under 35 U.S.C. §111(a) claiming the benefit pursuant to 35 U.S.C. §119(e)(1) of the filing date of Provisional Application No. 60/358,372 filed on Feb. 22, 2002 pursuant to 35 U.S.C.§111(b).
[0002] Priority is claimed to Japanese Patent Application No. 2002-17468, filed on Jan. 25, 2002 and U.S. Provisional Patent Application No. 06/358,372, filed on Feb. 22, 2002, the disclosure of which are incorporated by reference in their entireties.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60358372 |
Feb 2002 |
US |