Composite seal member for semiconductor production apparatus

Information

  • Patent Grant
  • D895076
  • Patent Number
    D895,076
  • Date Filed
    Friday, August 3, 2018
    6 years ago
  • Date Issued
    Tuesday, September 1, 2020
    4 years ago
  • Inventors
  • Original Assignees
    • Valqua, Ltd.
  • Examiners
    • Pratt; Michael A.
    Agents
    • The Webb Law Firm
Abstract
Description

1. Composite seal member for semiconductor production apparatus



1.1 : Perspective



1.2 : Front



1.3 : Back



1.4 : Left



1.5 : Right



1.6 : Top



1.7 : Bottom



1.8 : Cross-sectional



1.9 : Partial enlargement of cross-sectional view 1.8



1.10 : Reference


The present article is a composite seal member for semiconductor production apparatuses, such as chemical vapor deposition apparatuses and dry etching apparatuses; as illustrated in the reproduction 1.10, the article is composed of a first component formed of rubber occupying a major part of the article and a second component formed of a synthetic resin, and is to be inserted into the groove of a semiconductor production apparatus; the semiconductor production apparatus itself forms no part of the claimed design; the reproduction 1.8 shows a transverse cross-sectional front view taken along the horizontal center of the reproduction 1.6; and the reproduction 1.9 is an enlarged view showing a left end portion of the cross-sectional view 1.8.


The broken lines shown in Reproduction 1.10 are for the purposes of illustrating environmental structure and form no part of the claimed design.


Claims
  • The ornamental design for a composite seal member for semiconductor production apparatus, as shown and described.
Priority Claims (1)
Number Date Country Kind
2018-002526 Feb 2018 JP national
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Foreign Referenced Citations (5)
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D1612684 Sep 2017 JP
D1589474 Oct 2017 JP
D150427 Nov 2012 TW
D163769 Oct 2014 TW
D183446 Jun 2017 TW