The information provided in this section is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
The present disclosure relates to composites, and more particularly to composites with an internal sandwich construction.
The efficiency of a vehicle is impacted by the weight of the vehicle. To reduce weight, some vehicles use structural composites instead of stamped steel or aluminum.
A molded part includes a composite sandwich structure including a first substrate including a first reinforcing fiber attached to the first substrate using thread. A resin layer is arranged adjacent to the first substrate. A second reinforcing fiber is arranged adjacent to the resin layer. An over-molding resin encapsulates at least one side of the composite sandwich structure.
In other features, the second reinforcing fiber is attached to a second substrate using thread. The first reinforcing fiber is commingled with a first fiber comprising thermoplastic resin. The second reinforcing fiber is commingled with a second fiber comprising the thermoplastic resin. The first substrate and the second substrate comprise the thermoplastic resin. The first substrate including the first reinforcing fiber and the second substrate including the second reinforcing fiber are compression molded prior to encapsulation in the over-molding resin. The over-molding resin comprises the thermoplastic resin.
In other features, the first reinforcing fiber comprises a dry reinforcing fiber, the second reinforcing fiber is attached to the second substrate using thread, the second reinforcing fiber comprises a dry reinforcing fiber, and the first substrate and the second substrate are selected from a group consisting of a glass mat fabric, a transparent thermoset film, and a transparent thermoplastic film. The first substrate including the first reinforcing fiber and the second substrate including the second reinforcing fiber are infused with a thermosetting resin.
In other features, the resin layer comprises a solid resin layer selected from a group consisting of a neat polymer, a thermoplastic honeycomb, a mineral filled polymer, a particle filled polymer, a fiber filled polymer, and a glass bubble filled polymer. The first reinforcing fiber comprises one or more fibers selected from a group consisting of carbon fiber, glass fiber, basalt fiber, and combinations thereof. At least one of the first reinforcing fiber and the second reinforcing fiber includes a continuous fiber commingled with a thermoplastic fiber.
In other features, the over-molding resin includes one or more materials selected from a group consisting of polycarbonate (PC), polymethylmethacrylate (PMMA), epoxy, polyamides (PA), polyurethane, polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS), polycarbonate/acrylonitrile-butadiene-styrene/polymethylmethacrylate (PC/ABS/PMMA), poly(aryl-ether-ketone) (PAEK), poly(ether-ketone) (PEK), poly(ether-ether-ketone) (PEEK), polyphenylene sulfide (PPS), thermoplastic polyolefins (TPO), and combinations thereof.
In other features, at least one of the over-molding resin and resin in the resin layer is transparent, translucent, or semi-transparent. A coating layer is arranged on the over-molding resin. The coating layer comprises at least one of a painted layer, a scratch-resistant coating layer arranged on the over-molding resin. The second reinforcing fiber is attached to the first substrate using thread.
A method for manufacturing a molded part includes creating a composite sandwich structure by attaching a first reinforcing fiber to a first substrate using thread; arranging a resin layer adjacent to the first substrate; arranging a second reinforcing fiber adjacent to the resin layer; and encapsulating at least one side of the composite sandwich structure using an over-molding resin.
In other features, the method includes attaching the second reinforcing fiber to a second substrate using thread; commingling the first reinforcing fiber with a first fiber comprising a thermoplastic resin; and commingling the second reinforcing fiber with a second fiber comprising the thermoplastic resin. The first substrate and the second substrate comprise the thermoplastic resin.
In other features, the method includes compression molding the first substrate including the first reinforcing fiber and the second substrate including the second reinforcing fiber prior to encapsulation in the over-molding resin. The over-molding resin comprises the thermoplastic resin.
In other features, the method includes attaching the second reinforcing fiber to a second substrate using thread. The first reinforcing fiber comprises a dry fiber, the second reinforcing fiber comprises the dry fiber, and the first substrate and the second substrate are selected from a group consisting of a glass mat fabric, a transparent thermoset film, and a transparent thermoplastic film.
In other features, the method includes infusing the first reinforcing fiber, the second reinforcing fiber, the first substrate, and the second substrate with a thermosetting resin. The resin layer comprises a solid resin layer selected from a group consisting of a neat polymer, a thermoplastic honeycomb, a mineral filled polymer, a particle filled polymer, a fiber filled polymer, and a glass bubble filled polymer.
In other features, the first reinforcing fiber comprises one or more fibers selected from a group consisting of carbon fiber, glass fiber, basalt fiber, and combinations thereof. The method includes forming a coating layer comprising at least one of a painted layer, a scratch-resistant coating layer on the over-molding resin.
Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.
The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:
In the drawings, reference numbers may be reused to identify similar and/or identical elements.
While the following description relates to composite structures used in a vehicle, the composites can be used in non-vehicular applications.
A molded part according to the present disclosure includes a composite structure with an internal sandwich that is overmolded on at least one side. The composite structure with the internal sandwich improves flexural stiffness of the molded part. The internal sandwich includes first and second reinforcing fibers that are separated in a thickness direction by a central resin layer, In some examples, the resin layer is a solid resin layer including a resin fiber (e.g., a neat polymer), a resin sheet, and/or a honeycomb resin core.
In some examples, the reinforcing fibers include continuous reinforcing fibers made of at least one of carbon, glass, or basalt fibers. In some examples, the composite structure is anisotropic such that local stiffness, thermal expansion, strength, and/or other thermo-mechanical properties vary as a function of location within the molded part.
In some examples, the composite structure with the internal sandwich has local non-uniform thickness variations prior to consolidation and/or after consolidation. In some examples, the resin rich layer includes a neat polymer, a thermoplastic honeycomb (sandwich material), a mineral filled polymer, a particle filled polymer, a fiber filled polymer, a glass bubble filled polymer, or other material which provides sufficient backing support to minimize or eliminate reinforcing fiber migration during consolidation. As used herein, neat polymer refers to polymer fabrication using solvent casting involving thin film formation by dissolving the polymer in an appropriate solvent, casting the polymer/solvent solution onto a solid substrate or mold, and then evaporating out the solvent.
In some examples, one or both sides of the sandwich structure are overmolded, infused, or otherwise encapsulated by a thermoplastic or thermoset resin to form the molded part. In some examples, the infusing or over-molding resin comprises a neat polymer, a short fiber filled resin, a long fiber filled resin, a mineral filled polymer, or a combination thereof. In some examples, the composite with the sandwich structure is arranged in a first mold such as an injection mold and a first outer surface is formed. Then, the composite with the sandwich structure (and the first outer surface) is optionally arranged in a second mold and a second outer surface is formed on an opposite side thereof.
In some examples, the molded part is formed using a transparent, translucent, or semi-transparent resin material to allow light to transmit through portions of the molded panel. In other examples, the molded panel includes a sandwich construction made of polymeric composite with metallic structures (instead of reinforcing fibers) separated by a resin rich layer.
In some examples, an outer surface of the molded part is coated with one or more coating layers to enhance durability. In some examples, the coating layer includes paint, film, an ultraviolet (UV) resistant coating (e.g., polymethyl methacrylate (PMMA), and/or a hard coating layer for scratch resistance. In some examples, the hard coating layer includes Momentive AS4700F, although other hard coating layers can be used.
In some examples, the present disclosure relates to a method for manufacturing the molded part including the composite structure with the sandwich construction. The composite structure is formed by infusing a thermoset resin in a dry fiber to form a structural composite. In some examples, the dry fiber is attached by threads to a substrate.
In other features, the fiber reinforcement is commingled with a thermoplastic fiber, consolidated into a structural insert, and overmolded with a thermoplastic resin material.
In some examples, the structural insert is formed through a consolidation process under temperature and/or pressure. In some examples, the commingled fiber is stitched to a substrate prior to consolidation. In some examples, the structural insert is overmolded and fully encapsulated as a centralized layer in the thickness of the structure. In some examples, the structural insert is overmolded on a single side, with the non-exposed body panel serving as a side to be painted.
For example, a molded part according to the present disclosure includes a composite sandwich structure including a first reinforcing fiber attached to a first substrate using thread. A resin layer is arranged adjacent to the first reinforcing fiber. A second reinforcing fiber is attached to a second substrate using thread and arranged adjacent to the resin layer. An over-molding resin encapsulates at least one side of the composite sandwich structure.
In some examples, the first reinforcing fiber is commingled with a first fiber comprising thermoplastic resin. The second reinforcing fiber is commingled with a second fiber comprising the thermoplastic resin. The first substrate and the second substrate comprise the thermoplastic resin. The first reinforcing fiber, the second reinforcing fiber, the first substrate, and the second substrate are compression molded prior to encapsulation in the over-molding resin. The over-molding resin comprises the thermoplastic resin.
In some examples, the first reinforcing fiber comprises a dry reinforcing fiber. The second reinforcing fiber comprises a dry reinforcing fiber. The first substrate and the second substrate are selected from a group consisting of a glass mat fabric, a transparent thermoset film, and a transparent thermoplastic film. The first reinforcing fiber, the second reinforcing fiber, the first substrate, and the second substrate are infused with a thermosetting resin.
Referring now to
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In some examples, the substrate 52 includes a polymer sheet acting as a carrier to attach the reinforcing fibers 56 and/or the central resin layers. In some examples, the reinforcing fibers 56 include a commingled fiber such as continuous carbon fibers and polycarbonate fibers (PC). After attaching the reinforcing fibers 56, the central resin layer 70 (e.g., polycarbonate (PC) with no reinforcing fibers) is arranged on the reinforcing fibers 56. Then another reinforcing fiber is attached to the central resin layer 70.
In
In some examples, the central resin layer 70 (e.g., a neat polymer not commingled with reinforcing fibers) is laid down on top of the first reinforcing layer 50-1 prior to consolidation. In some examples, the central resin layer 70 includes a resin fiber (e.g., laid and stitched using TFP) having a thickness p in a range from 0.2 mm to 5.0 mm (e.g., 1.0 mm) after consolidation. A second reinforcing layer 50-2 of the sandwich 72 is stitched on top of central resin layer and serves a second reinforcing layer of the sandwich 72. In some examples, the total thickness c of the reinforcing fibers 56 in the second reinforcing layer after consolidation is in a range from 0.2 mm to 5.0 mm. As can be appreciated, additional layers can be used as shown in
Referring now to
In
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A sandwich 215 is created by a supporting resin layer(s) 216 arranged between the sets of metallic inserts 214. In some examples, the sets of metallic inserts 214 are mirror images. In other examples, the sets of metallic inserts 214 are not mirror images. In
While a multi-piece metallic insert is shown in
Referring now to
In some examples, the reinforcing fibers include one or more fibers selected from a group consisting of carbon, glass, basalt, flax, hemp, pineapple, and cellulose. In some examples, first fibers (selected from a group consisting of carbon, glass, basalt, flax, hemp, pineapple, and cellulose) are commingled with second fibers selected from a group consisting of polycarbonate, nylon, polyetheretherketone (PEEK), polyetherimide (PEI), polyphenylene sulfide (PPS), polyester, polyethylene, and polypropylene in order to consolidate the fiber preform. In some examples, the plurality of reinforcing fibers has a shape selected from the group consisting of cylindrical, flat, or both cylindrical and flat. In some examples, the reinforcing fibers are in the form of dry fibers that are encapsulated in a thermoset or thermoplastic resin to form a structural composite.
In some examples, the resin includes one or more materials selected from a group consisting of polycarbonate (PC), polymethylmethacrylate (PMMA), epoxy, polyamides (PA), polyurethane, polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS), polycarbonate/acrylonitrile-butadiene-styrene/polymethylmethacrylate (PC/ABS/PMMA), poly(aryl-ether-ketone) (PAEK), poly(ether-ketone) (PEK), poly(ether-ether-ketone) (PEEK), polyphenylene sulfide (PPS), thermoplastic polyolefins (TPO), and combinations thereof. In some examples, the resin may be a thermoset resin or a thermoplastic resin that is substantially transparent when free of fibers or opaque.
In some examples, the composite is painted or an ultraviolet coating is applied. In other examples, the composite is covered with film. In some examples, the composite panel is formed using a transparent, translucent, or semi-transparent resin material to allow light to transmit through portions of the composite panel. In some examples, the structural insert is encapsulated in resin mixed with short fibers, long fibers, and/or one or more minerals.
The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and/or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.
Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”
In the figures, the direction of an arrow, as indicated by the arrowhead, generally demonstrates the flow of information (such as data or instructions) that is of interest to the illustration. For example, when element A and element B exchange a variety of information but information transmitted from element A to element B is relevant to the illustration, the arrow may point from element A to element B. This unidirectional arrow does not imply that no other information is transmitted from element B to element A. Further, for information sent from element A to element B, element B may send requests for, or receipt acknowledgements of, the information to element A.