Claims
- 1. A composition comprising a mixture of:
- a first sealing liquid including
- an organic film forming resin component, from about 1 to about 40 percent by weight;
- an organic solvent selected from the group consisting of mono or dialkyl ethers of ethylene glycol and mixtures thereof, from about 1 to about 10 percent by weight;
- an alkyd resin, from about 1 to about 40 percent by weight;
- a plasticizer, from about 1 to about 2 percent by weight;
- emulsifying agents, from 1 to 5 percent by weight; and
- water, remainder;
- a second sealing liquid including
- a lacquer component;
- hexavalent chromium; and
- water,
- wherein the first sealing liquid is mixed with the second sealing liquid in a volumetric ratio of first liquid:second liquid of from about 1-4:4-1.
- 2. The composition of claim 1 wherein said organic film forming resin component comprises styrene/acrylic copolymer.
- 3. The composition of claim 2 wherein said organic solvent comprises ethylene glycol monobutyl ether.
- 4. The composition of claim 3 wherein said plasticizer comprises N-methylpyrrolidone.
- 5. The composition of claim 4 wherein said emulsifying agents comprise polyethylene glycol condensates of the formula H(OCH.sub.2 CH).sub.n OH that vary in weight from about 200 to 10,000.
- 6. The composition of claim 1 wherein the first sealing liquid is in an amount about 61 percent by volume, and the second sealing liquid is in an amount about 19.6 percent by volume.
- 7. Composition comprising water in an amount of about 79 percent by weight, 2-butoxyethanol in an amount of about 5.7 percent by weight, N-methylpyrrolidone in an amount of about 0.5 percent by weight, a styrene/acrylic copolymer in an amount of about 8 percent by weight, an alkyd resin in an amount of about 6 percent by weight, the remainder comprising polyethylene glycol based surfactant, carboxylic acid, polyethylene wax, and hexavalent Cr.
- 8. Sealing composition comprising:
- 1) a first sealing composition comprising, in aqueous emulsion,
- a) an organic film forming resin;
- b) an organic solvent; and
- c) alkyd resin, and
- 2) a second sealing component comprising lacquer and hexavalent chromium; said first 1) and second 2) component being mixed in a volumetric ratio of about 1-4:4-1.
- 9. Sealing composition comprising:
- 1) a first scaling component comprising, in aqueous emulsion,
- a) 1-40 wt % of an organic film forming resin;
- b) 1-10 wt % of an organic solvent; and
- c) 1-40 wt % of alkyd resin; and
- 2) a second scaling component comprising lacquer and hexavalent chromium; said first 1) and second 2) components being mixed in a volumetric ratio of about 1-4:4-1.
Parent Case Info
This is a divisional of application Ser. No. 08/682,928 filed on Jul. 16, 1996, now U.S. Pat. No. 5,704,995.
US Referenced Citations (20)
Foreign Referenced Citations (3)
Number |
Date |
Country |
291606 |
Nov 1988 |
EPX |
489427 |
Jun 1992 |
EPX |
2136454 |
Sep 1984 |
GBX |
Non-Patent Literature Citations (1)
Entry |
Proc. AESF Annu. Tech. Conf. (1986), 73 rd (Sess.F), Paper F-5, Lindemann et al. |
Divisions (1)
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Number |
Date |
Country |
Parent |
682928 |
Jul 1996 |
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