This is a division of application Ser. No. 07/813,960, filed Dec. 24, 1991, now U.S. Pat. No. 5,314,003.
Number | Name | Date | Kind |
---|---|---|---|
4117302 | Earle et al. | Sep 1978 | |
4269868 | Livsey | May 1981 | |
4300474 | Livsey | Nov 1981 | |
4323756 | Brown et al. | Apr 1982 | |
4474861 | Ecer | Oct 1984 | |
4627148 | Imahashi et al. | Dec 1986 | |
4675065 | Gordon | Jun 1987 | |
4724472 | Sugimoto et al. | Feb 1988 | |
4746390 | Badalec et al. | May 1988 | |
4810525 | Morita et al. | Mar 1989 | |
4818562 | Arcella et al. | Apr 1989 | |
4845335 | Andrews et al. | Jul 1989 | |
4861407 | Volkmann et al. | Aug 1989 | |
4863538 | Deckard | Sep 1989 | |
4938816 | Beaman et al. | Jul 1990 | |
4944817 | Bourell et al. | Jul 1990 | |
5053195 | MacKay | Oct 1991 | |
5124175 | Miracky et al. | Jun 1992 | |
5147587 | Marcus et al. | Sep 1992 | |
5155324 | Deckard et al. | Oct 1992 | |
5156697 | Bourell et al. | Oct 1992 | |
5170930 | Dolbear et al. | Dec 1992 |
Entry |
---|
Colin A. Mackay, "Solder Creams And How To Use Them", reprint from Electronic Packaging & Production, Feb. 1981. |
Colin A. Mackay, "Some Causes Of Problems With Existing SMT Solder Creams And Possible Improvements", IEPS 6th Annual Conference, pp. 157-167, Nov. 1986. |
Colin A. Mackay, "Using Statistical Methods To Evaluate And Compare Screen Printing And Solder Cream Parameters", ASM International, 2nd Ann. Microelectronic Packaging, pp. 295-303, Apr. 1989. |
Carl R. Deckard, "Part Generation By Layerwise Selective Sintering", Thesis presented to the Faculty of the Graduate School of The University of Texas at Austin in Partial Fulfillment of the Requirements for the Degree of Master of Science in Mechanical Engineering, pp. 1-50, May 1986. |
Number | Date | Country | |
---|---|---|---|
Parent | 813960 | Dec 1991 |