Claims
- 1. A composition, comprising:
a polyphenylene ether resin of the formula 14wherein R1 is an aliphatic or aromatic residue; n is 0 to about 10; each of R2, R3, and R4 is independently hydrogen, alkyl, or aryl; j has an average value less than 49; each Q1 is independently halogen, primary or secondary lower alkyl, phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and each Q2 is independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and a resin selected from the group consisting of polyamides, polyesters, polyarylene sulfides, polycarbonates, polyetherimides, polyarylenes, polyolefins, functionalized polyolefins, polysulfones, and polyethersulfones.
- 2. The composition of claim 1, wherein j has an average value less than 34.
- 3. The composition of claim 1, wherein n is zero.
- 4. The composition of claim 1, wherein R2 is methyl or hydrogen, R3 is hydrogen, and R4 is hydrogen.
- 5. The composition of claim 1, wherein each Q1 is methyl and each Q2 is hydrogen.
- 6. The composition of claim 1, wherein the polyphenylene ether resin comprises 2,6-dimethyl-1,4-phenylene ether units and 2,3,6-trimethyl-1,4-phenylene ether units.
- 7. The composition of claim 1, wherein the polyphenylene ether resin has an intrinsic viscosity of about 0.08 to about 0.25 dl/g as measured in chloroform at 25° C.
- 8. The composition of claim 1, wherein the polyphenylene ether resin has an intrinsic viscosity of about 0.08 to about 0.1 6 dl/g as measured in chloroform at 25° C.
- 9. The composition of claim 1, further comprising styrene.
- 10. A composition, comprising:
a polyphenylene ether resin of the formula 15wherein R1 is an aliphatic or aromatic residue; n is 0; R2 is hydrogen or methyl; R3 and R4 are hydrogen; j has an average value less than 49; each Q1 is methyl; and each Q2 is independently hydrogen or methyl; wherein the polyphenylene ether resin has an intrinsic viscosity of about 0.10-0.30 deciliter/gram, as measured in chloroform at 25° C.; and a resin selected from the group consisting of polyamides, polyesters, polyarylene sulfides, polycarbonates, polyetherimides, polyarylenes, polyolefins, functionalized polyolefins, polysulfones, and polyethersulfones.
- 11. A composition, comprising:
a polyphenylene ether resin of the formula 16wherein R1 is an aliphatic or aromatic residue; n is 0; R2 is hydrogen or methyl; R3 and R4 are hydrogen; j has an average value less than 34; each Q1 is methyl; and each Q2 is independently hydrogen or methyl; wherein the polyphenylene ether resin has an intrinsic viscosity of about 0.10-0.25 deciliter/gram, as measured in chloroform at 25° C.; and a polyolefin or functionalized polyolefin.
- 12. A curable composition, comprising:
a polyphenylene ether resin of the formula 17wherein R1 is an aliphatic or aromatic residue; n is 0 to about 10; each of R2, R3, and R4 is independently hydrogen, alkyl, or aryl; j has an average value less than 49; each Q1 is independently halogen, primary or secondary lower alkyl, phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and each. Q2 is independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and a thermosetting resin selected from the group consisting of epoxy, phenolic, alkyds, polyester, polyimide, polyurethane, mineral filled silicone, bis- maleimides, cyanate esters, vinyl, and benzocyclobutene resins.
- 13. The composition of claim 12, further comprising styrene.
- 14. A curable composition, comprising:
a polyphenylene ether resin of the formula 18wherein R1 is an aliphatic or aromatic residue; n is 0; R2 is hydrogen or methyl; R3 and R4 are hydrogen; j has an average value less than 49; each Q1 is methyl; and each Q2 is independently hydrogen or methyl; wherein the polyphenylene ether resin has an intrinsic viscosity of about 0.10-0.30 deciliter/gram, as measured in chloroform at 25° C.; and a thermosetting resin selected from the group consisting of epoxy, phenolic, alkyds, polyester, polyimide, polyurethane, mineral filled silicone, bis-maleimides, cyanate esters, vinyl, and benzocyclobutene resins.
- 15. The composition of claim 14, further comprising styrene.
- 16. A curable composition, comprising:
a polyphenylene ether resin of the formula 19wherein R1 is an aliphatic or aromatic residue; n is 0; R2 is hydrogen or methyl; R3 and R4 are hydrogen; j has an average value less than 34; each Q1 is methyl; and each Q2 is independently hydrogen or methyl; wherein the polyphenylene ether resin has an intrinsic viscosity of about 0.10-0.25 deciliter/gram, as measured in chloroform at 25° C.; and an epoxy thermosetting resin.
- 17. The composition of claim 16, further comprising styrene.
- 18. A cured composition, comprising the reaction product of:
a polyphenylene ether resin of the formula 20wherein R1 is an aliphatic or aromatic residue; n is 0 to about 1 0; each of R2, R3, and R4 is independently hydrogen, alkyl, or aryl; j has an average value less than 49; each Q1 is independently halogen, primary or secondary lower alkyl, phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and each Q2 is independently hydrogen, halogen, primary or secondary lower alkyl, phenyl, haloalkyl, hydrocarbonoxy or halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms; and a thermosetting resin selected from the group consisting of epoxy, phenolic, alkyds, polyester, polyimide, polyurethane, mineral filled silicone, bis-maleimides, cyanate esters, vinyl, and benzocyclobutene resins.
- 19. An article comprising the composition of claim 1.
- 20. An article comprising the composition of claim 18.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a division of U.S. application Ser. No. 09/683,352 filed Dec. 18, 2001, which is a division of U.S. application Ser. No. 09/61 3,112 filed Jul. 10, 2000.
Divisions (2)
|
Number |
Date |
Country |
| Parent |
09683352 |
Dec 2001 |
US |
| Child |
10063152 |
Mar 2002 |
US |
| Parent |
09613112 |
Jul 2000 |
US |
| Child |
09683352 |
Dec 2001 |
US |