| Number | Date | Country | Kind |
|---|---|---|---|
| 1008041 | Jan 1998 | NL |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/NL99/00029 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO99/36368 | 7/22/1999 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 4076917 | Swift et al. | Feb 1978 | A |
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| 5143582 | Arkens et al. | Sep 1992 | A |
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| 6037284 | Holstein et al. | Mar 2000 | A |
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| 6387496 | Van Benthem et al. | May 2002 | B1 |
| 6392006 | Van Benthem et al. | May 2002 | B1 |
| Number | Date | Country |
|---|---|---|
| 516375 | Dec 1992 | EP |
| 596088 | Aug 1997 | EP |
| 791087 | Aug 1998 | EP |
| 9206047 | Apr 1992 | WO |
| Entry |
|---|
| Patent Abstract No. XP-002101047; G. M. Dulitskaya et al.; Solvent-free thermo-reactive lacquer—contg. unsatd. oligo-ester-imide(s), for impregnating electrical windings binders for plastics; Oct. 22, 1980; 1 p. |
| European Patent Office—Patent Abstracts of Japan; Mikuni Hiroyuki; Polymerizable Imide Compound and Photocurable Composition; Nov. 14, 1995; 1 p. |