Patent Application
20240217144
The invention relates to a compression molding device and a compression molding method.
As an example of a resin sealing device and a resin sealing method in which a workpiece with an electronic component mounted on a substrate is sealed with a sealing resin (simply referred to as “resin” in the following) and the workpiece is processed into a molded article, a resin sealing device and a resin sealing method by using compression molding is known.
Compression molding is a technique for performing resin sealing through an operation in which a predetermined amount of resin is supplied to a sealed region (cavity) provided in a sealing die formed by including an upper die and a lower die, and a workpiece is provided in the sealed region to be clamped by using the upper die and the lower die. As an example, a technique of sandwiching a workpiece in which an electronic component (specifically, a semiconductor chip) is wire-bonded onto a substrate (specifically, a lead frame) by using resin to perform molding is known (Patent Document 1: Japanese Laid-open No. H09-008179).
In general, a technique of mounting resin (e.g., resin in granular or liquid form) onto a substrate to be transported into the sealing die in a case where compression molding is performed on a workpiece in which an electronic component is wire-bonded to a substrate (generally a resin substrate, etc.) by using a sealing die having a cavity in an upper die is known. At this time, with the movement (positional displacement) of the resin, an issue that the resin may contact a wire of the workpiece and deform the wire may arise. Comparatively, a technique in which resin is mounted on a substrate after the substrate is moved into a sealing die is also known (see the second embodiment and FIGS. 4 and 5 of Patent Document 2: Japanese Laid-open No. 2004-179284). However, in the case of practicing such technique, the issue that the resin contacts a wire of a workpiece and deform the wire may also occur.
In addition, a technique that, in the case of performing compression molding on a workpiece in which multiple electronic components form a matrix and each resin is mounted with respect to each electronic component is known. At this time, an issue as follows may occur: when the resins are mounted on the substrate in order after the substrate is transported into a sealing die, the thermal history due to the heat from the heated sealing die is different between the resin at an early stage of the process and the resin at a later stage of the process.
In view of the above, an objective of the invention is to provide a compression molding device and a compression molding method capable of preventing deformation of electronic components and the like, mounted on a substrate due to positional displacement of resin during transport, and capable of preventing variation in molding quality.
The invention solves the above issue by using, as an embodiment, a solution as follows.
A compression molding device according to an embodiment uses a sealing die including an upper die and a lower die, and seals a substrate on which an electronic component is mounted by using a block-shaped resin to process the substrate into a molded article. The compression molding device is required to include: a resin welding mechanism, welding the resin to a predetermined position of the substrate.
Accordingly, at the time of transporting the workpiece and the resin into the sealing die, it can be arranged that the resin is welded to the predetermined position of the substrate. Therefore, an issue that the positional displacement of the resin R on the substrate at the time of transport occurs, and the resin contacts and deforms the electronic component (e.g., a wire-bonded location, etc.) can be solved.
In addition, in the case where compression molding is performed on a workpiece in which multiple electronic components are disposed on the substrate to form a matrix, at the stage before the workpiece is transported into the sealing die, respective resins can be mounted (welded, in the embodiment) to the respective electronic components on the substrate. Therefore, an issue of the variation in molding quality due to difference in thermal history, which may occur in the case where the resins are mounted in order after the substrate is transported into the sealing die can be solved. In addition, since the process of mounting the resin on the substrate and the pressing process (a process of closing the die) can be performed in parallel, there is no influence on tact.
In addition, in the case where compression molding is performed on a workpiece in which a substrate with a hole, such as a lead frame, is used, a resin supply method for transporting the substrate into the sealing die in a state in which the resin is held on the substrate can be realized.
The resin welding mechanism may also include: a substrate heating part, heating the substrate; and a transport and pressing part, mounting the resin to the predetermined position of the substrate in a state of being heated to a predetermined temperature, and pressing and welding the resin. In this way, by placing the resin onto the substrate heated to a temperature lower than the resin curing temperature, an effect that the surface of the resin is melt to be stuck to the substrate can be attained. Therefore, resin can be fixed to the substrate with a hole.
In addition, the resin welding mechanism may include: a resin heating part, heating the resin; and a transport and pressing part, mounting the resin in a state of being heated to a predetermined temperature to the predetermined position of the substrate, and pressing and welding the resin. In this way, by placing the resin heated to a temperature lower than the resin curing temperature onto the substrate, an effect that the surface of the resin is melt to be stuck to the substrate can be attained. Therefore, resin can be fixed to the substrate with a hole.
In addition, as the resin, a resin which has a cylindrically columnar shape or a square columnar shape, and in which an accommodation recess or an accommodation hole having an inner diameter and a depth able to accommodate the electronic component is bored into a lower surface may be used. In this way, the resin can be welded onto the substrate by covering the electronic component from the top and surrounding the periphery of the electronic component.
In addition, as the resin, multiple resins may be used, and the resins may include a resin which has a cylindrically columnar shape or a square columnar shape and in which an accommodation recess or an accommodation hole having an inner diameter and a depth able to accommodate the electronic component is bored into a lower surface. In this way, detailed adjustments can be made depending on the type (specifically, the shape) of the workpiece, so as to optimize resin arrangement.
In a compression molding method according to an embodiment, a sealing die including an upper die and a lower die is used, and a substrate on which an electronic component is mounted is sealed by using a block-shaped resin to process the substrate into a molded article. The compression molding method is required to include: a resin welding process, welding the resin to a predetermined position of the substrate.
In a compression molding method according to another embodiment, a sealing die including an upper die and a lower die is used, and a substrate on which an electronic component is mounted is sealed by using a block-shaped resin to process the substrate into a molded article. The compression molding method is required to include: using, as the resin, a resin which has a cylindrically columnar shape or a square columnar shape and in which an accommodation recess or an accommodation hole having an inner diameter and a depth able to accommodate the electronic component is bored into a lower surface, and in the sealing die, placing the resin at a predetermined position of the substrate and performing compression molding. In this way, since the resin is placed on the substrate in the sealing die, an issue such as the positional displacement of the resin during transport does not arise as compared with the case where the resin is placed at a stage before the workpiece is transported into the sealing mold. Therefore, the molding quality can be prevented from deteriorating.
In a compression molding method according to another embodiment, a sealing die including an upper die and a lower die is used, and a base board on which an electronic component is mounted is sealed by using a block-shaped resin to process the base board into a molded article. The compression molding method is required to include: using, as the resin, a resin which has a plate shape with a predetermined thickness and in which an accommodation recess or an accommodation hole having an inner diameter and a depth able to accommodate the electronic component is bored into a lower surface. In this way, in the case where compression molding is performed on the workpiece in which multiple electronic components are disposed and form a matrix on the substrate, etc., by using the plate-shaped resin, the resin can be mounted on the substrate in one process. Therefore, it is possible to simplify and reduce the time of the process.
According to the invention, the issue that, at the time of transporting the workpiece, the position of the resin may be displaced on the substrate to deform the electronic component, etc., can be solved. In addition, for a workpiece in which multiple electronic components are mounted on the substrate, by mounting corresponding resins before the workpiece is transported into the sealing die, the issue that molding quality varies due to difference in thermal history among the resins can be solved.
In the following, a first embodiment of the invention will be described in detail with reference to the drawings.
The compression molding device 1 according to the embodiment is a device performing resin molding on a workpiece (molded article) W by using a sealing die 202 having an upper die 204 and a lower die 206. In the following, as the compression molding device 1, an example of a compression molding device in which a workpiece W on which a resin R is mounted is held by the lower die 206, a cavity 208 (including a portion of a die surface 204a) provided at the upper die 204 is covered by a release film (which may be simply referred to as “film” in the following) F to perform a clamp operation between the upper die 204 and the lower die 206 and perform resin sealing on the workpiece W by using the resin R is described.
Firstly, the workpiece W as a molding target has a configuration in which an electronic component Wb is mounted on a substrate Wa. More specifically, examples of the substrate Wa may include a lead frame, a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a wafer, etc., formed in a plate shape and an elongated rectangular shape (may also be in a circular shape). In addition, examples of the electronic component Wb may include a semiconductor chip, a MEMS chip, a passive element, a capacitor, a coil, a heat discharge plate, a conductive member, a spacer, etc.
As examples of the mounting process through which the electronic component Wb is mounted on the substrate Wa, examples may include mounting by wire bonding, flip-chip mounting, etc. Alternatively, in a case of a configuration in which the substrate Wa (carrier plate made of glass or metal) is peeled off from the molded article after resin molding, the electronic component Wb may also be attached by using an adhesive tape having thermal releasability or a ultraviolet curable resin cured through ultraviolet irradiation.
Here, an example of the workpiece W is shown in
Then, as examples of a film F, a film material with high thermal resistance, peeling easiness, flexibility, and stretchability may be used as appropriate, such as polytetrafluoroethylene (PTFE), polytetrafluoroethylene polymer (ETFE), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. In the embodiment, a roll-like film is used as the film F. As a modified example, it may also be configured that a strip-shaped film is used (not shown).
Here, for the resin R according to the embodiment, a thermally curable resin (e.g., a filler-containing epoxy resin, etc.) formed to be block-like (lump-like) is used (details of which will be described in the following). As an example, the curing temperature of the resin R is about 100° ° C. to 200° C., and the temperature at which a surface portion starts melting is about 60° C. Nevertheless, the resin R is not limited thereto, and may also be a resin other than a thermally curable epoxy resin.
In the following, the outline of the compression molding device 1 according to the embodiment is described. As shown in
In the embodiment, from left to right in the left-right direction, the supply unit 100A, the press unit 100B, and the storage unit 100C are arranged side-by-side in order. An arbitrary number of guide rails 100D are linearly provided across the respective units, a first loader 210 transporting the workpiece W and the resin R and a second loader 212 transporting the molded article are movably provided between predetermined units along the guide rails 100D.
In the compression molding device 1, the overall configuration can be changed by changing the configurations of the units. For example, the configuration shown in
Then, the supply unit 100A included in the compression molding device 1 is described.
The supply unit 100A includes a supply magazine 102 storing multiple workpieces W and a preparation table 104 for mounting the workpiece W supplied from the supply magazine 102. For the supply magazine 102, a conventional stack magazine, slit magazine, etc., may be used. In addition, as a part for supplying (transporting) the workpiece W from the supply magazine 102 to the preparation table 104, a conventional pusher or transport rails, etc., are provided (not shown).
Moreover, the supply unit 100A includes: a resin supply part 106 storing and supplying multiple resins R; and a resin welding mechanism 110 welding the resin R to a predetermined position of the substrate Wa in the workpiece W (details of which will be described in the following).
Moreover, the supply unit 100A includes the first loader 210 transporting the workpiece W and the resin R. The first loader 210 has a holding mechanism for the workpiece W provided on the lower surface of the first loader 210. As an example, in the holding mechanism, a conventional mechanism (e.g., a configuration having holding claws for sandwiching, a configuration having a suction hole in communication with a suction device for sucking, etc.) is used (not shown).
Here, as an example of the resin welding mechanism 110 according to the embodiment, as indicated by a symbol 110A in
Meanwhile, the transport and pressing part 114 is configured to hold the block-like resin R supplied (transported) from the resin supply part 106 and be movable in a horizontal direction and a vertical direction. Therefore, it is possible to hold the resin R by using the transport and pressing part 114, pressing the resin R against the substrate Wa in the state of being heated to the predetermined temperature, and welding the resin R to the predetermined position of the substrate Wa. Here,
According to the configuration, by mounting the resin R to the substrate Wa heated to a temperature lower than the resin curing temperature, the surface of the resin R can be melted and stuck to the substrate Wa. Therefore, even for the workpiece W in which the substrate Wa having a through hole on a substrate surface, as exemplified by a lead frame, is used, the resin R can be mounted and fixed (welded) onto the workpiece W (that is, the substrate Wa). In addition, even in the case where compression molding is performed on such workpiece W having the through hole, like the case where the workpiece does not have the through hole, a resin supply method for transporting the substrate into the sealing die 202 in a state in which the resin R is held on the workpiece W (on the substrate Wa) can be realized.
In addition, at the time of transporting the workpiece W and the resin R into the sealing die 202, through the state in which the resin R is welded to the predetermined position of the substrate Wa, it is possible to solve issues as follows. Specifically, the issue that, at the time of transport, a positional displacement of the resin R on the substrate Wa occurs, and the resin R contacts and deforms the electronic component Wb (specifically, a portion of the wire of the electronic component Wb wire-bonded onto the substrate Wa) can be solved. In addition, at the stage before the workpiece W is transported into the sealing die 202, the respective resins R can be mounted (welded, in the embodiment) to the respective electronic components Wb on the substrate Wa. Therefore, the issue of the variation in molding quality due to difference in thermal history, which may occur in the case where the resins R are mounted in order after the substrate Wa is transported into the sealing die 202, can be solved. In addition, since the process of mounting the resins R on the substrate Wa and the pressing process (a process of closing the die) can be performed in parallel, there is no influence on tact.
As another example of the resin welding mechanism 110, as indicated by a symbol 110B in
Here, as the resin R according to the embodiment, as shown in
Moreover, as a modified example of the resin R, as shown in
In the embodiment, it is configured that one resin R including the above configuration is used. However, the invention is not limited thereto. It may also be configured that multiple resins, with the resin R and other resins, are used (not shown). Accordingly, it is possible to make detailed adjustments depending on the type (specifically, the shape) of the workpiece W, so as to optimize resin arrangement.
Then, the press unit 100B included in the compression molding device 1 is described.
The press unit 100B includes the sealing die 202. The sealing die 202 has a pair of dies (such as multiple die blocks, die plates, die pillars, etc., or those to which other components are assembled that are formed of alloy tool steel) that are opened and closed. A conventional configuration may be adopted for the sealing die 202.
In the embodiment, in the pair of dies, the one on the upper side in the vertical direction is set as the upper die 204, and the other die on the lower side is set as the lower die 206. In the sealing die 202, the die is closed/opened as the upper die 204 and the lower die 206 move toward/away from each other. That is, the vertical direction (upper-lower direction) is set as a die opening/closing direction.
It is noted that a die-opening/closing mechanism performing die opening/closing of the sealing die 202 is configured to include: a pair of platens; multiple linking mechanisms (tie bars or pillars) to which the pair of platens are installed; and a driving source (e.g., an electric motor) and a driving transmission mechanism (e.g., a ball screw or a toggle link mechanism) able to move (lift or lower) the platens (none of which is shown).
Here, the sealing die 202 is arranged between the pair of platens in the die-opening/closing mechanism. In the embodiment, the upper die 204 is assembled to a fixed platen (platen fixed to the linking mechanism), and the lower die 206 to a movable platen (platen lifted or lowered along the linking mechanism) (not shown). However, the configuration is not limited thereto. It may also be that the upper die 204 is assembled to the movable platen, and the lower die 206 is assembled to the fixed platen, or the upper die 204 and the lower die 206 are both assembled to the movable platen.
In the following, the upper die 204 of the sealing die 202 is described. As shown in
Here, as a specific configuration example of the periphery of the cavity 208, the cavity piece 226 is fixed and assembled to the lower surface of the upper plate 222 via a cavity block 234. The cavity piece 226 and the cavity block 234 may also be an integral component. Meanwhile, the clamper 228 is configured in an annular shape to surround the cavity piece 226, and the clamper 228 is spaced apart (floating) with respect to the lower surface of the upper plate 222 by using a biasing member 232 and assembled to be movable in the upper-lower direction. The cavity piece 226 forms a deep part (bottom part) of the cavity 208, and the clamper 228 forms a side part of the cavity 208. Here, the outer diameter dimension of the cavity piece 226 in a plan view is configured to be smaller than the outer diameter dimension of the cavity 208 in a plan view.
In addition, in the embodiment, a suction mechanism (not shown) that sucks and holds the film F supplied from a film supply mechanism 250 (to be described afterwards) at the upper die 204 is provided. Accordingly, it is possible to suck and hold the film F at a die surface 204a including the inner surface of the cavity 208.
In addition, in the embodiment, an upper die heating mechanism heating the upper die 204 to a predetermined temperature is provided. The upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a controller, a power source, etc., (none of which is shown), and performs heating and heating control. As an example, the heater is configured as being built in the upper plate 222 or a die base (not shown) accommodating the upper plate 222, and mainly heats the entire upper die 204 and the resin R. Accordingly, the upper die 204 is adjusted and heated to the predetermined temperature (e.g., 100° C. to 200° C.).
In addition, in the embodiment, the film supply mechanism 250 transporting (supplying) the film F that is roll-like and has no opening (hole) on the sheet surface into the sealing die 202 is provided. The film supply mechanism 250 is configured to include an unwinding part 252 and a winding part 254 and transport the film F from the unwinding part 252 toward the winding part 254. Accordingly, the film F is supplied to the sealing die 202 disposed between the unwinding part 252 and the winding part 254.
Then, the lower die 206 of the sealing die 202 is described. As shown in
In addition, in the embodiment, a workpiece holding mechanism holding the workpiece W at a predetermined position on the upper surface of the plate 238 is provided. As an example, the workpiece holding mechanism is in communication with the suction device via a suction path arranged by penetrating through the plate 238 and the lower plate 224 (not shown). Accordingly, it is possible to suck and hold the workpiece W at a die surface 206a (referring to the upper surface of the plate 238 here). As the workpiece holding mechanism, in place of the sucking mechanism or together with the sucking mechanism, it may also be configured to provide holding claws sandwiching the outer circumference of the workpiece W.
In addition, in the embodiment, a lower die heating mechanism heating the lower die 206 to a predetermined temperature is provided. The lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a controller, a power source, etc., (none of which is shown), and performs heating and heating control. As an example, the heater is configured as being built in the lower plate 224 or a die base (not shown) accommodating the lower plate 224, and mainly heats the entire lower die 206 and the workpiece W. Accordingly, the lower die 206 is adjusted and heated to the predetermined temperature (e.g., 100° C. to) 200° ° C.
Then, the storage unit 100C included in the compression molding device 1 is described.
The storage unit 100C includes: a storage table 304, in which the molded article sealed with resin is mounted; and a storage magazine 302, storing multiple molded articles. For the storage magazine 302, a conventional stack magazine, slit magazine, etc., may be used. In addition, as a part for storing (transporting) the molded article from the storage table 304 to the storage magazine 302, a conventional pusher or transport rails, etc., are provided (not shown).
In addition, the storage unit 100C includes the second loader 212 transporting the molded article. The second loader 212 has a holding mechanism for the molded article provided on the lower surface of the second loader 212. As an example, in the holding mechanism, a conventional mechanism (e.g., a configuration having holding claws for sandwiching, a configuration having a suction hole in communication with a suction device for sucking, etc.) is used (not shown).
Then, an operation of performing resin sealing by using the compression molding device 1 according to the embodiment (i.e., a compression molding method according to the embodiment) is described. Here, the case where the workpiece W in which multiple electronic components Wb (semiconductor chips, for example) are loaded onto (mounted to) the substrate Wa (a lead frame, for example) to form a matrix is held at the lower die 206, and resin molding is collectively performed is adopted as an example.
Firstly, a heating process (upper die heating process) of adjusting and heating the upper die 204 to the predetermined temperature (e.g., 100° C. to 200° C.) by using the upper die heating mechanism is performed. Then, a process (lower die heating process) of adjusting and heating the lower die 206 to the predetermined temperature (e.g., 100° ° C. to 200° C.) by using the lower die heating mechanism is performed.
Then, a process of supplying the workpiece W from the supply magazine 102 and mounting the workpiece W onto the preparation table 104 is performed. Preceding or following such process, a process of transporting (sending out) the film F from the unwinding part 252 to the winding part 254 by using the film supply mechanism 250, and supplying the film F to the predetermined position (the position between the upper die 204 and the lower die 206) in the sealing die 202 to suck and hold the film F on the die surface 204a including the inner surface of the cavity 208 is performed.
Then, a process of supplying multiple resins R from the resin supply part 106 and a resin welding process of welding the resins R to the predetermined positions of the substrate W in the workpiece W are performed. Here, as an example of the resin welding process, processes as follows are included and implemented (see
Here, the resin welding process may include the following as appropriate: a process of fitting, into the substrate Wa, the resins R which have a cylindrically columnar shape or a square columnar shape and in which the accommodation recesses (or accommodation holes) Ra having an inner diameter and a depth able to accommodate the electronic components Wb are bored into the lower surfaces, so that the electronic components Wb are accommodated in the accommodation recesses (or accommodation holes) Ra; and a process of welding the outer edges of the accommodation recesses (or accommodation holes) Ra on the lower surfaces of the resins R to the positions surrounding the electronic components Wb in the substrate Wa. Accordingly, the resins R can be welded onto the substrate Wa by covering the electronic components Wb from the top and surrounding the peripheries of the electronic components Wb.
Here, as another example of the resin welding process, processes as follows may be included and implemented: a resin heating process of heating the resins R to the predetermined temperature (temperature that the resin R is not completely melted (e.g., 60° C.); and a transport and pressing process of mounting the resins R in the state of being heated to the predetermined temperature to the predetermined position of the substrate Wa and pressing and welding the resins R. With such configuration as well, the same effect as the above configuration example can be attained.
Then, a process of transporting, by using the first loader 210, the workpiece W in the state in which the resins R are welded into the sealing die 202, and holding the workpiece W at the predetermined position of the lower die 206 is performed. It may also be that, before transporting the workpiece W into the sealing die 202 by using the first loader 210, a process of heating the workpiece W in advance may be further included and performed.
In the subsequent process, by performing the same process as the conventional compression molding process, the sealing die 202 is closed, two workpieces W are clamped by the upper die 204 and the lower die 206, and a process of heating and pressurizing the resins R with respect to the workpieces W is performed. Accordingly, the resins R are thermally cured, and resin sealing (compression molding) is completed. Then, a process of opening the sealing die 202 and separating the molded article and the film F is performed. Then, a process of transporting the molded article from the sealing die 202 is performed by using the second loader 212. In addition, by transporting the film F from the unwinding part 252 to the winding part 254 by using the film supply mechanism 250, a process of sending out the film F having been used is performed (film discharging process).
The above are the main processes for performing resin sealing by using the compression molding device 1. However, the above order of processes is merely an example, and, as long as there is no problem, it is possible to modify the order or perform the processes in parallel. For example, in the embodiment, the compression molding device including multiple (two, for example) press units is used. Therefore, by executing the processes in parallel, it is possible to form molded articles efficiently.
In the following, a second embodiment of the invention will be described. Compared with the first embodiment, the embodiment has a difference in the process of supplying the resins R. In the following, the difference will be described.
In the first embodiment, it is configured that the resin welding process of welding the resins R to the predetermined positions of the substrate Wa in the workpiece W is performed at a stage before the workpiece W is transported into the sealing die 202. Comparatively, in the embodiment, after the state in which the workpiece W is transported into the sealing die 202 and the workpiece W is held at the predetermined position (specifically, the predetermined position in the lower die 206) is arranged, in the sealing die 202, a process of placing the resins R to the predetermined positions of the workpiece W (specifically, the substrate Wa) is performed. Then, it is configured that the die is closed and compression molding is performed. The configuration (form) of the resin R is the same as that of the first embodiment.
Accordingly, since the resins R are placed on the substrate Wa in the sealing die 202, an issue such as the positional displacement of the resins R during transport does not arise, as compared with the case where the resins R are placed at a stage before the workpiece W is transported into the sealing mold 202. Therefore, the deformation of the workpiece W (specifically, wires) that may occur due to the positional displacement of the resins R can be prevented. Regarding the process of placing (mounting) the resins R, since welding is not a required configuration, a heating mechanism or process for welding and a pressing mechanism or process are not required, and the device as well as the process can be simplified.
In the following, a third embodiment of the invention will be described. Compared with the first and second embodiments, the embodiment has a difference in the configuration of the resin R that is used. In the following, the difference will be described.
In the first embodiment, the resin R is in a configuration which has a cylindrically columnar shape or a square columnar shape and in which the accommodation recess (or accommodation hole) having an inner diameter and a depth able to accommodate the electronic component Wb is bored into the lower surface, and one resin R corresponds to one electronic component Wb.
Comparatively, it is configured to use the resin R which has a plate shape with a predetermined thickness and in which the accommodation recess (or accommodation hole) having an inner diameter and a depth able to accommodate the electronic component Wb is bored into the lower surface.
As a specific operation example, the resin R is mounted onto the substrate Wa so that multiple electronic components Wb are respectively accommodated in corresponding accommodation recesses (or accommodation holes). Here,
Accordingly, for example, in the case where compression molding is performed on the workpiece W in which multiple electronic components Wb are disposed and form a matrix on the substrate Wa, etc., the resin R can be mounted on the substrate Wa in one process by using the plate-shaped resin. Therefore, it is possible to simplify and reduce the time of the process.
As described above, according to the invention, the following issue can be solved: at the time of transporting the workpiece, the position of the resin may be displaced on the substrate to deform the electronic component, etc. In addition, for a workpiece in which multiple electronic components are mounted on the substrate, if a configuration of mounting corresponding resins before the workpiece is transported into the sealing die is further provided, the issue that molding quality varies due to difference in thermal history among resins can be solved. Therefore, molding quality can be stabilized (high quality can be maintained).
The invention is not limited to the above embodiments, and can be modified in various ways without departing from the scope of the invention. For example, in the above embodiments, a configuration in which multiple cavities are provided in the upper die is described as an example. However, the invention is not limited thereto. The invention is also applicable to a configuration in which one cavity is provided in the upper die.
Also, in the above embodiments, a compression molding device including cavities in the upper die is described as an example. However, the invention is also applicable to a compression molding device including cavities in the lower die. In such case, it suffices as long as the resin is welded to be transported into the sealing die, so as not to drop with respect to the lower surface of the workpiece.
In addition, in the above embodiments, a workpiece in which electronic components are mounted on the substrate through wire bonding mounting is described as an example. However, the invention is also applicable to a workpiece in which electronic components are mounted on the substrate through flip-chip mounting.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-127895 | Aug 2021 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/013050 | 3/22/2022 | WO |
