The present disclosure relates to a Compute-In-Memory (CIM) device and a passive voltage amplifier circuit for a differential Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) thereof.
In the case of the conventional Von Neumann structure, a processor and memory are separated, and the processor leads data stored in the memory to perform an operation, so there is a limit to improve energy efficiency and operation speed according to data access and transmission. In addition, recently, due to the development of artificial neural network technology, Multiply-Accumulation (MAC) operation between input data and weights in Deep Neural Network (DNN) has to be performed on a large scale, and thus there is a need for a technique to improve the energy efficiency and operation speed.
A Compute-In-Memory (CIM) or In-Memory Compute (IMC) structure has been proposed to maximize efficiency by performing the operation using the memory that stores the data. In such a CIM structure, the memory storing the data directly performs the operation without transmitting data to the processor, so it is possible to perform the operation at low power and high speed by overcoming the limit of the conventional Von Neumann structure.
The analog CIM structure performs the Multiply-Accumulation (MAC) operation in the analog domain (current, voltage, time) and quantizes the final calculated result using an Analog-to-Digital Converter (ADC). Generally, the ADC consumes a lot of power and occupies a large area, which reduces TOPS/W. In addition, the analog CIM structure must have an output ratio suitable to ensure accuracy. The output ratio is expressed as “Input precision×(accumulation number)/ADC precision”. In general, even with the same output ratio, a structure with a larger accumulation number is highly accurate. However, there is a large overhead of power and area in high-bit ADC that quantize more operations. Therefore, reducing the accumulation number and precision of the ADC can help reduce the power and area of the entire ADC, thereby securing TOPS/W.
and the MAC operation result is output.
The ADC converts an analog voltage output through the global bit line (GBL) into a digital value. Since a sense amplifier (SA) for conversion should have a small offset, it must have a large operating power and a large area.
In the operation of the ADC, the reference voltage Vref switches as many times as the number of bits of the ADC, and the sense amplifier (SA) operates as many times as the number of bits of the ADC. Therefore, as the number of bits of the ADC increases, the power overhead increases, so it is required to reduce the number of the ADC and the number of operations.
The structure of
Embodiments of the present disclosure propose a CIM device capable of reducing the number of ADCs required per global bit line (GBL) and reducing the precision of the ADCs, and a passive voltage amplifier circuit for a differential SAR ADC of the CIM device.
In the case of the conventional ADC, the area and energy efficiency are limited by requiring high ADC precision to ensure target accuracy. In an embodiment of the present disclosure, a passive voltage amplifier capable of securing the area and energy efficiency compared to the conventional structure by reducing ADC precision while securing target accuracy through an effect of more closely quantizing even with the same ADC precision is proposed.
Embodiments of the present disclosure propose a CIM device capable of implementing a low-area and low-power CIM structure through a smaller number of ADCs and a smaller ADC precision compared to the conventional CIM structure, and a passive voltage amplifier circuit for a differential SAR ADC of the CIM device.
The technical problem to be solved is not limited to the above-mentioned technical problems, and other technical problems not mentioned may be clearly understood by those skilled in the art from the following description.
A Compute-In-Memory (CIM) device according to the present disclosure to solve the technical problem includes first to fourth global bit lines (GBLs) each configured to be divided into two sub-global bit lines having the same capacitance; first to fourth switches each configured to be connected between the sub-global bit lines of each of the first to fourth global bit lines; and a switching circuit configured to generate a differential input voltage for a differential Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) by reflecting a corresponding bit position from an output voltage of each of the first to fourth global bit lines, the differential SAR ADC being configured to receive the differential input voltage to generate a digital signal.
The first to third global bit lines may be GBLs corresponding to remaining bits except for a most significant bit, and the fourth global bit line may be a GBL corresponding to the most significant bit.
The switching circuit may generate the first voltage of the differential input voltage by reflecting the bit position from the output voltage of each of the first to third global bit lines, and generate the second voltage of the differential input voltage by reflecting the bit position from the output voltage of the fourth global bit line.
The switching circuit may include a fifth switch configured to have one end connected to the first global bit line; a sixth switch configured to have one end connected to the second global bit line; a seventh switch configured to have one end connected to the third global bit line; an eighth switch configured to have one end connected to the fourth global bit line;
The first to fourth switches may be connected, the fifth to eighth switches may be blocked, and the ninth to twelfth switches may be blocked in operations of a Digital-to-Analog Convert (DAC) and a Multiply-Accumulate (MAC), the third switch may be blocked, and the seventh switch may be connected in order to reflect the bit position, then the third switch may be connected, and the seventh switch may be blocked, then the second switch may be blocked, the third switch may be blocked, the fifth to eighth switches may be connected, and the eleventh and twelfth switches may be blocked.
The differential input voltage may be composed of a first voltage and a second voltage, and the differential SAR ADC may include a passive voltage amplifier circuit . . . configured to output the differential voltage amplified by a difference between the first voltage and the second voltage to a comparator.
The passive voltage amplifier circuit may include a first input terminal where the first voltage is input; a second input terminal where the second voltage is input; a first output terminal; a second output terminal; a first 2:1 MUX; a second 2:1 MUX; a first capacitor configured to be connected between an output of the first 2:1 MUX and the first output terminal; a second capacitor configured to be connected between an output of the second 2:1 MUX and the second output terminal; a first switch configured to be connected between the first input terminal and the first output terminal; and a second switch configured to be connected between the second input terminal and the second output terminal, wherein the first input terminal is connected to a “1” input of the first 2:1 MUX and a “0” input of the second 2:1 MUX, and the second input terminal is connected to a “0” input of the first 2:1 MUX and a “1” input of the second 2:1 MUX.
The control input of the first 2:1 MUX and the control input of the second 2:1 MUX are configured so that the same control signal is applied.
The first voltage may be a voltage corresponding to a MAC operation result of remaining bits except for a most significant bit, and the second voltage may be a voltage corresponding to a MAC operation result of the most significant bit.
The first output terminal may be connected to a (+) input of a comparator, and the second output terminal may be connected to a (−) input of the comparator.
The first switch and the second switch are connected and the “0” is each applied to the control input of the first 2:1 MUX and the control input of the second 2:1 MUX, such that the second voltage may be output as the output of the first 2:1 MUX, the first voltage may be output as the output of the second 2:1 MUX, the first voltage may be output as the first output terminal, and the second voltage may be output as the second output terminal, and then the first switch and the second switch may be blocked, and the “1” is each applied to the control input of the first 2:1 MUX and the control input of the second 2:1 MUX, such that the first voltage may be output as the output of the first 2:1 MUX, and the second voltage may be output as the output of the second 2:1 MUX, and the differential voltage amplified by a difference between the first voltage and the second voltage may be output through the first output terminal and the second output terminal by coupling each of the first capacitor and the second capacitor.
A passive voltage amplifier circuit for a differential SAR ADC of a CIM device according to the present disclosure to solve the technical problem may include a first input terminal where a first voltage of a differential input voltage is input; a second input terminal where a second voltage of the differential input voltage is input; a first output terminal; a second output terminal; a first 2:1 MUX; a second 2:1 MUX; a first capacitor configured to be connected between an output of the first 2:1 MUX and the first output terminal; a second capacitor configured to be connected between an output of the second 2:1 MUX and the second output terminal; a first switch configured to be connected between the first input terminal and the first output terminal; and a second switch configured to be connected between the second input terminal and the second output terminal, wherein the first input terminal is connected to a “1” input of the first 2:1 MUX and a “0” input of the second 2:1 MUX, and the second input terminal is connected to a “0” input of the first 2:1 MUX and a “1” input of the second 2:1 MUX
The control input of the first 2:1 MUX and the control input of the second 2:1 MUX are configured so that the same control signal is applied.
The first voltage may be a voltage corresponding to a MAC operation result of remaining bits except for a most significant bit, and the second voltage may be a voltage corresponding to a MAC operation result of the most significant bit.
The first output terminal may be connected to a (+) input of a comparator, and the second output terminal may be connected to a (−) input of the comparator.
The first switch and the second switch are connected and the “0” is each applied to the control input of the first 2:1 MUX and the control input of the second 2:1 MUX, such that the second voltage may be output as the output of the first 2:1 MUX, the first voltage may be output as the output of the second 2:1 MUX, the first voltage may be output as the first output terminal, and the second voltage may be output as the second output terminal, and then the first switch and the second switch may be blocked, and the “1” is each applied to the control input of the first 2:1 MUX and the control input of the second 2:1 MUX, such that the first voltage may be output as the output of the first 2:1 MUX, and the second voltage may be output as the output of the second 2:1 MUX, and the differential voltage amplified by a difference between the first voltage and the second voltage may be output through the first output terminal and the second output terminal by coupling each of the first capacitor and the second capacitor.
According to embodiments of the present disclosure, the number of ADCs required per global bit line (GBL) may be reduced, and the precision of the ADCs may be reduced.
In the embodiment of the present disclosure, the bit positioning can be implemented in the analog domain using charge sharing and switching control thereby securing the area and energy efficiency.
In the embodiment of the present disclosure, the area and energy efficiency may be secured compared to the conventional structure by reducing ADC precision while securing target accuracy through an effect of more closely quantizing even with the same ADC precision.
The embodiments of the present disclosure may implement the low-area and low-power CIM structure through a smaller number of ADCs and a smaller ADC precision compared to the conventional CIM structure.
The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.
Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. In the following description and the accompanying drawings, substantially the same components are represented by the same reference numerals, and a duplicate description will be omitted. In addition, in describing the present disclosure, if it is judged that the detailed description of the related known function or configuration may unnecessarily obscure the gist of the present disclosure, the detailed description thereof will be omitted.
The SIM device according to the embodiment of the present disclosure includes first to fourth global bit lines (GBLs) 11, 12, 13, and 14. For convenience, a cell array connected to each global bit line (GBL) is omitted. Each global bit line (GBL) corresponds to a bit position. For example, the first global bit line 11 corresponds to a x4 bit position, the second global bit line 12 corresponds to a x2 bit position, the third global bit line 13 corresponds to a x1 bit position, and the fourth global bit line 14 corresponds to a x8 bit position. That is, the fourth global bit line 14 corresponds to the most significant bit, and the first to third global bit lines 11, 12, 13 correspond to the remaining bits except the most significant bit.
The first to fourth global bit lines 11, 12, 13, and 14 are each divided into two sub-global bit lines having the same capacitance. That is, the number of cell columns connected to each sub-global bit line of one global bit line is the same. The first global bit line 11 is divided into two sub-global bit lines 11_1 and 11_2. The second global bit line 12 is divided into two sub-global bit lines 12_1 and 12_2. The third global bit line 13 is divided into two sub-global bit lines 13_1 and 13_2. The fourth global bit line 14 is divided into two sub-global bit lines 14_1 and 14_2.
In each global bit line, the switch is connected between the sub-global bit lines That is, the first switch S1 is connected between the sub-global bit lines 11_1 and 11_2, the second switch S2 is connected between the sub-global bit lines 12_1 and 12_2, the third switch S3 is connected between the sub-global bit lines 13_1 and 13_2, and the fourth switch S4 is connected between the sub-global bit lines 14_1 and 14_2.
A switching circuit 30 is provided between the first to fourth global bit lines 11, 12, 13, and 14 and a differential Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) 20. The switching circuit 30 reflects the corresponding bit position from an output voltage of each of the first to fourth global bit lines 11, 12, 13, and 14 to generate a differential input voltage for the differential SAR ADC 20. The differential SAR ADC 20 receives the differential input voltage from the switching circuit 30 to generate a digital signal. Specifically, the switching circuit 30 generates the first voltage of the differential input voltage by reflecting the bit position from the output voltage of each of the first to third global bit lines 11, 12, and 13, and generates the second voltage of the differential input voltage by reflecting the bit position from the output voltage of the fourth global bit line 14. The first voltage is input to the (+) terminal of the differential SAR ADC 20, and the second voltage is input to the (−) terminal of the differential SAR ADC 20.
The switching circuit may include the fifth to fourteenth switches S5 to S14. The fifth switch S5 has one end connected to the first global bit line 11, the sixth switch S6 has one end connected to the second global bit line 12, the seventh switch S7 has one end connected to the third global bit line 13, and the eighth switch S8 has one end connected to the fourth global bit line 14. The ninth switch S9 is connected between the other end of the fifth switch S5 and the other end of the sixth switch S6. The tenth switch S10 is connected between the other end of the sixth switch S6 and the other end of the seventh switch S7. The eleventh switch S11 is connected between the other end of the sixth switch S6 and VDD. The twelfth switch S12 is connected between the other end of the eighth switch S8 and VDD. The thirteenth switch 13 is connected between the other end of the fifth switch S5 and the (+) terminal of the differential SAR ADC 20. The fourteenth switch S14 is connected between the other end of the eighth switch S8 and the (−) terminal of the differential SAR ADC 20.
Referring to
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Then, although not shown, when the thirteenth switch S13 and the fourteenth switch S14 are connected, the first voltage corresponding to the MAC operation result of the first to third global bit lines 11, 12, and 13 is applied to the (+) terminal of the differential SAR ADC 20, and the second voltage corresponding to the MAC operation result of the fourth global bit line 14 is applied to the (−) terminal of the differential SAR ADC 20.
According to the embodiment of the present disclosure, the result of the MAC operation may be obtained by reflecting the bit position of the weight without an additional capacitor, so that the circuit area may be reduced. In addition, compared to the conventional technology that requires an ADC for each row (global bit line), since one ADC is provided in four rows, the number of ADCs is reduced by 75% to reduce power consumption and area.
On the other hand, if the entire operation result value is rearranged widely using a voltage amplifier, the effect of being more densely quantized within the same ADC precision may be obtained. In other words, more quantization operation values may be quantized with a smaller ADC precision without deterioration in accuracy. In this case, if the quantization range of the SAR ADC is doubled, the interval of the ADC itself becomes the same before and after the amplification. Therefore, the quantization range of the SAR ADC may be set to be the same as before the amplification, and the quantization interval of the ADC may be adjusted by clipping the output values exceeding the range. The adjustment of the clipping range is possible through the adjustment of the reference voltage of the SAR ADC and the unit capacitance of the CDAC (capacitive DAC). Therefore, it is possible to improve the TOPS/W and TOPS/mm2 with a smaller ADC precision while securing the accuracy by setting the quantization range of the SAR ADC to be the same as before the amplification while widely rearranging the entire operation result value through voltage amplification.
Referring to
The differential SAR ADC receives a differential input voltage composed of a first voltage Vinp and a second voltage Vinn. The first voltage Vinp is a voltage corresponding to the MAC operation result of the remaining bits (x1, x2, and x3) except for the most significant bit, and the second voltage Vinn is a voltage corresponding to the MAC operation result of the most significant bit (x8).
The passive voltage amplifier circuit receives the first voltage Vinp and the second voltage Vinn and outputs a differential voltage amplified by the difference between the first voltage Vinp and the second voltage Vinn to the (+) and (−) inputs of the comparator 25.
The passive voltage amplifier circuit according to an embodiment includes a first input terminal inp where the first voltage Vinp is input, a second input terminal inn where the second voltage Vinn is input, a first output terminal outp and a second output terminal outn that outputs the differential voltage amplified by a difference between the first voltage Vinp and the second voltage Vinn, a first 2:1 MUX 23, a second 2:1 MUX 24, a first capacitor C1 connected between an output of the first 2:1 MUX 23 and the first output terminal outp, a second capacitor C2 connected between an output of the second 2:1 MUX 24 and the second output terminal outn, a first switch SC1 connected between the first input terminal inp and the first output terminal outp, and a second switch SC2 connected between the second input terminal inn and the second output terminal outn. The first input terminal inp is connected to a “1” input of the first 2:1 MUX 23 and a “0” input of the second 2:1 MUX 24, and the second input terminal inn is connected to a “0” input of the first 2:1 MUX 23 and a “1” input of the second 2:1 MUX 24, The control input of the first 2:1 MUX 23 and the control input of the second 2:1 MUX 24 are connected to each other, so that the same control signal is applied. The first output outp is connected to the (+) input of the comparator 25, and the second output outn is connected to the (−) input of the comparator 25.
Referring to
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According to the embodiment of the present disclosure, it is possible to amplify the differential input voltage by two times without the additional voltage supply and damage to the conventional output voltage range. Therefore, it is possible to rearrange the entire operation result value widely, and it is possible to obtain an effect of being more densely quantized within the same ADC precision. According to embodiments of the present disclosure, bit positioning may be performed in an analog domain through a local switch. Therefore, there is no need for digital logic such as digital shift and adder, and thus area and energy efficiency may be improved. In addition, since the precision of the ADC may be reduced at the same accumulation number by using a passive voltage amplification circuit, it is possible to use an ADC with a smaller precision while securing the target accuracy. As described above, according to embodiments of the present disclosure, it is possible to implement a low-area and a low-power CIM structure through a smaller number of ADCs and a smaller ADC precision compared to the conventional CIM structure.
The above description is only illustrative of the technical idea of the present disclosure, and any person skilled in the art to which the present disclosure pertains will be able to make various modifications and variations without departing from the essential characteristics of the present disclosure. Therefore, the embodiments disclosed herein are for the purpose of describing the technical idea of the present disclosure rather than limiting the technical idea, and the scope of the technical idea of the present disclosure is not limited by these embodiments. The scope of the present disclosure should be interpreted by the following claims, and all technical ideas within the equivalent range should be interpreted as being included in the scope of the present disclosure.
Number | Date | Country | Kind |
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10-2024-0006255 | Jan 2024 | KR | national |