Patent Application
20150312675
The subject matter herein generally relates to an audio processing system for a computer.
On plugging into a jack in a motherboard, a high-class earphone can generate a better sound effect than a common earphone, owing to additional optimization operations having performed on the received audio signal from the jack by itself.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently coupled or releasably coupled. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The present disclosure is described in relation to a computer with a motherboard providing better user experience in spite of kinds of audio producing device.
In one embodiment, the connector 104 can have a first state and a second state. The connector 104 can be at the first state when an audio producing device 30 (e.g. an earphone) is plugged into the connector 104. Alternatively, the connector 104 can be at the second state when the connector 104 has no device to be connected. In one embodiment, the connector 104 can output a first connection signal (e.g. a low-voltage level signal) when the connector 104 is at the first state, the connector 104 can output a second connection signal (e.g. a high-voltage level signal) when the connector 104 is at the second state.
The MCU chip 106 is configured to receive the first connection signal or the second connection signal, and can output a corresponding control signal to the DSP chip 100 through a bus 105. For example, the MCU chip 106 can output a first control signal when the first connection signal is received from the connector 104, the MCU chip 106 can output a second control signal when the second connection signal is received from the connector 104. In an illustrated embodiment, the MCU chip 106 can output the first control signal or the second control signal to the DSP chip 100 through an inter-integrated circuit (I2C) bus or a system management bus (SMBus).
The DSP chip 100 can receive the first audio signal, and perform the optimization operation on the first audio signal, to generate the second audio signal. The device 30 can receive the second audio signal from the connector 104. In one embodiment, the first audio signal may not be converted to the second audio signal when the DSP chip 100 receives the second control signal.
In one embodiment, the interface controller 108 can further output the selection signal to the MCU chip 106. The MCU chip 106 can suspend the communication between the MCU chip 106 and the DSP chip 100 for a certain time when the interface controller 108 outputs the selection signal to the DSP chip 100. The DSP chip 100 can store a last state of the control signal before the communication between the MCU chip 106 and the DSP chip 100 resumed.
While the disclosure has been described by way of example and in terms of a preferred embodiment, it is to be understood that the disclosure is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the range of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201410166189.1 | Apr 2014 | CN | national |
