(a) Field of the Invention
The present invention relates to heat dissipation within a computer housing unit. It provides premium thermal solutions, while concealing the power source near the upper region of the chassis.
(b) Description of the Prior Art
Under normal operation, the internal components of the-computer will produce a large amount of heat energy. In order to prevent the heat from accumulating, which would seriously affect the electronic components from operating normally, heat dissipating devices are used to maintain the internal temperature of the computer at a definite predetermined operating temperature. However, most computer chassis on the market only come with one or a few fans to blow away the high temperature air flow to assist in removing or expelling the heat. Nevertheless, those fans are unable to effectively expel the heat to the outside air. After the system has been operating for a period of time, the internal air will have gradually risen, affecting the efficiency and stability of the computer system. Hence, there is a need for improvement in heat dissipation.
Accordingly, the primary objective of the present invention lies in providing a bottom panel and one of the side panels of a computer chassis with ventilation holes. In addition, a partition panel is used to form an air passage in the upper portion of the computer housing; moreover, the partition panel also provides the function of hiding the power supply and its wires to give the computer case a more aesthetic appeal. Furthermore, heat removal fans are positioned to face outward in the upper and rear portion of the computer housing, thereby enabling the lower portion of the computer chassis to form negative air pressure that draws air upwards from the bottom panel. The hot air inside the computer enclosure is then expelled outwards, thus strengthening the thermal solutions.
Detailed drawings and descriptions are provided below to fully explain the above technological methods of the invention.
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In conclusion, according to the above description of the embodiment of the present invention, the new computer housing heat dissipating configuration of the present invention is able to effectively improve the cooling presence of said enclosure.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention, and that a wide variety of modifications may be affected pending on the person's skill level.