Patent Application
20140283909
1. Technical Field
The present disclosure relates to electronic assemblies and methods for manufacturing the same; and more particularly to a concentrating photovoltaic chip assembly, a method for manufacturing the chip assembly, and a concentrating photovoltaic assembly having the chip assembly.
2. Description of Related Art
Typical solar power systems include a large amount of photovoltaic panels. The most important component of the photovoltaic panel is a photovoltaic chip. The photovoltaic chip is mounted on a substrate to form a solar receiver, which converts solar energy into electric energy. Many solar power systems have the photovoltaic chip mounted on a direct bonded copper (DBC) substrate. In addition, the photovoltaic chip is electrically connected to the DBC by gold wires. The DBC substrate and gold wires are somewhat expensive, and mass production of the solar power system is time consuming. These factors result in high production costs.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like reference numerals indicate the same or similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one.”
Referring also to
The photovoltaic chip 5 is used to convert solar energy into electric energy. In the embodiment, the photovoltaic chip 5 is a solar cell. The protective diode 3 prevents the photovoltaic chip 5 from short-circuiting when a plurality of the concentrating photovoltaic chip assemblies 100 are mounted on the PCB 9 and connected in series. In another embodiment, the photovoltaic chip 5 is a chip comprising a plurality of photovoltaic diodes.
The lower lead frame 13 comprises a lower lead frame body 133 and a lower lead terminal 131. A top surface of the lower lead frame body 133 is used to support and electrically connect to both an electrode of the photovoltaic chip 5 and an electrode of the protective diode 3. A bottom surface of the lower lead frame body 133 is mounted on the PCB 9. The lower lead terminal 131 is electrically connected to external components through a wire.
The lower lead terminal 131 comprises a lower connection portion 1311 and a lower extending part 1313. The lower connection portion 1311 is used to connect the lower lead frame body 133 to the lower extending part 1313. A first end of the lower connection portion 1311 is connected to one end of the lower lead frame body 133. The lower connection portion 1311 extends obliquely from the lower lead frame body 133. The lower extending part 1313 is used as a solder point for electrically connecting to an external circuit through a wire. The lower extending part 1313 is connected to a second end of the lower connection portion 1311, and is substantially parallel to the lower lead frame body 133.
The upper lead frame 11 comprises an upper lead frame body 115 and an upper lead terminal 111. A light inlet window 113 is defined in the upper lead frame body 115. External light easily passes through the light inlet window 113 and strikes the photovoltaic chip 5, which is mounted between the upper lead frame 11 and the lower lead frame 13. The upper lead frame body 115 connects an electrode of the photovoltaic chip 5 and an electrode of the protective diode 3 in series. The upper lead terminal 111 is connected to external components by a wire.
The upper lead terminal 111 comprises an upper connection portion 1111 and an upper extending part 1113. The upper connection portion 1111 connects the upper lead frame body 115 to the upper extending part 1113. A first end of the upper connection portion 1111 is connected to one end of the upper lead frame body 115. The upper connection portion 1111 extends obliquely from the upper lead frame body 115. The upper extending part 1113 is used as a solder point for electrically connecting to an external circuit. The upper extending part 1113 is connected to a second end of the upper connection portion 1111, and is substantially parallel to the upper lead frame body 115.
In assembly, the photovoltaic chip 5 and the protective diode 3 are arranged side by side between the upper lead frame 11 and the lower lead frame 13, with the photovoltaic chip 5 and the protective diode 3 being spaced from each other. The photovoltaic chip 5 and the protective diode 3 are mounted on and are electrically connected to the top surface of the lower lead frame body 133 by joining material 7. The upper lead frame body 115 is mounted on and is electrically connected to top surfaces of the photovoltaic chip 5 and the protective diode 3 by the joining material 7, such that the light inlet window 113 is located directly above the photovoltaic chip 5. That is, the photovoltaic chip 5 faces toward the light inlet window 113. Thereby, the photovoltaic chip 5 and the protective diode 3 are assembled in series by the lower lead frame 13 and the upper lead frame 11. As a result, in use of the concentrating photovoltaic chip assembly 100, the photovoltaic chip 5 outputs electric energy via the upper lead terminal 111, and the lower lead terminal 131 is electrically connected to an external circuit.
In the embodiment, the joining material 7 is solder. In other embodiments, the joining material 7 is conductive adhesive.
Referring to
In step S510, joining material 7 is applied on a top surface of the lower lead frame body 133 of the lower lead frame 13.
In step S520, the photovoltaic chip 5 and the protective diode 3 are coupled to the top surface of the lower lead frame body 133 by the joining material 7.
In step S530, joining material 7 is applied on the photovoltaic chip 5 and the protective diode 3.
In step S540, the upper lead frame 11 is coupled to the photovoltaic chip 5 and the protective diode 3 by the joining material 7, such that the light inlet window 113 is located directly above the photovoltaic chip 5. Accordingly, external light can pass through the light inlet window 113 and strike a surface of the photovoltaic chip 5.
In step S550, the upper lead frame 11, the lower lead frame 13, the photovoltaic chip 5, and the protective diode 3 are fixed (bonded) together by treating the joining material 7. In the embodiment, when solder is used as the joining material 7, the process of fixing the upper lead frame 11, the lower lead frame 13, the photovoltaic chip 5, and the protective diode 3 together is performed by reflow soldering. When conductive adhesive is used as the joining material 7, the process of fixing the upper lead frame 11, the lower lead frame 13, the photovoltaic chip 5, and the protective diode 3 together is performed by curing the conductive adhesive.
In step S560, any residual joining material 7 is removed.
In summary, in the embodiment, the lower lead frame body 133 supports the photovoltaic chip 5 and the protective diode 3. The photovoltaic chip 5 and the protective diode 3 are assembled in series by the lower lead frame body 133 and the upper lead frame body 115. The lower lead terminal 131 and the upper lead terminal 111 are electrically connected to the external circuit. Therefore the structure described above not only saves on the costs of gold wires and direct bonded copper, but also reduces the time required for mass production.
Although the features and elements of the present embodiments are described in particular combinations, each feature or element can be used alone or in other various combinations within the principles of the present embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013100976103 | Mar 2013 | CN | national |
