Patent Application
20090159127
The present invention relates to a concentration solar cell chip packaging structure, and more particularly, to a method for forming a concentration solar cell chip packaging structure with shortened processing time and improved processing quality to give the packaged solar cell increased light transmittance.
There are only limited resources available on the earth. Human beings are encountering with the difficulty and embarrassment of constantly consumed and gradually depleted energy resources. According to reports from energy-related journals, the exploitation of oil is estimated to terminate within next ten years. On the other hand, the use of nuclear energy would face the problem of nuclear waste disposal. Therefore, it has become a very important and pressing task to develop a new generation of energy sources. Among a variety of renewable energy technologies, the application of solar photovoltaic energy has received particularly wide attention and deemed as the currently available most reliable new energy source. Meanwhile, the solar photovoltaics enabling the use of sunlight as the new energy source has simple structure without the risk of causing recycled pollution. Therefore, the solar photovoltaic energy is referred to as clean energy. Among the viable photovoltaic technologies, concentration solar cell has gained a lot of attention due to its high energy conversion efficiency recently.
The above-described encapsulation structure for the solar cell chip 12 has the following disadvantages:
It is therefore tried by the inventor to develop a concentration solar cell chip packaging structure and a method for forming the same, so as to shorten the processing time, improve the processing quality, and increase the light transmittance of the packaged solar cell.
A primary object of the present invention is to provide a concentration solar cell chip packaging structure and a method for forming the same, so that the concentration solar cell chip packaging structure may be formed with shortened processing time and improved processing quality to give the packaged solar cell increased light transmittance and prolonged service life.
To achieve the above and other objects, the concentration solar cell chip packaging structure according to the present invention includes a heat sink, a thin layer of insulating material provided on a top of the heat sink, an electrically conducting plate provided on the insulating layer, at least one solar cell chip mounted on the conducting plate, a package made of a highly light-pervious and shock-absorbing polymer material encapsulating the solar cell chip and the conducting plate, and a thin layer of low-iron, high-strength, and light-pervious material attached to an outer surface of the polymer package.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
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Then, form a package 22 using a highly light-pervious and shock-absorbing polymer material to encapsulate the solar cell chip 21 and the conducting plate 20, so as to protect the structure having been completed in the above-mentioned steps for it to focus sunlight. Chip packaging technology using a polymer package has been applied in silicon processing solar cell packaging technology for more than twenty years, and provides at least the advantages of easy operation and high stability.
After the highly light-pervious and shock-absorbing polymer package 22 has been formed to encapsulate the solar cell chip 21 and the conducting plate 20, a layer of low-iron, high-strength, and light-pervious material 23 is further formed thereon. The low-iron, high-strength, and light-pervious material 23 may be a tempered glass to contain less than 0.5% of iron, so as to obtain relatively high light transmittance and to protect the highly light-pervious and shock-absorbing polymer package 22 against direct contact with external air while effectively isolate the polymer package 22 from external moisture and dust. In the present invention, the highly light-pervious and shock-absorbing polymer package 22 may be, for example, ethylene vinyl acetate (EVA).
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The conducting plate 20 supports the solar cell chip 21 thereon, and carries wires and pins (not shown) necessary for the solar cell chip packaging structure, and the solar cell chip 21 is electrically connected to the pins. The conducting plate 20 may be made of an electrically conducting metal material, such as an aluminum alloy or a copper foil. The conducting plate 20 and the necessary wires and pins carried thereon may be integrated using a metal core printed circuit board (MCPCB) by passing through a reflow oven once only.
The package 22 using a highly light-pervious and shock-absorbing polymer material encapsulates the solar cell chip 21 and the conducting plate 20. Due to the nature of the highly light-pervious and shock-absorbing polymer material, the package 22 may be formed into a variety of geometrical shapes for receiving sunlight irradiated thereon from all directions. The polymer package 22 may be, for example, ethylene vinyl acetate (EVA).
The low-iron, high-strength, and light-pervious material 23 is attached to an outer surface of the highly light-pervious and shock-absorbing polymer package 22, and may be a tempered glass to contain less than 0.5% of iron, so as to obtain relatively high light transmittance. The layer of low-iron, high-strength, and light-pervious material 23 also protects the package 22 against direct contact with external air while effectively isolates the package 22 from external moisture and dust, enabling the solar cell to have prolonged usable life.
With the above arrangements, the concentration solar cell chip packaging structure formed in the method of the present invention may be completed with simplified process, shortened processing time, and improved processing quality. Therefore, the packaged solar cell provided by the present invention has increased light transmittance and is therefore superior to the solar cell package of prior art.
The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications in the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
