The present invention relates to a concept for interfacing a first electrical circuit requiring a first supply voltage and a second electrical circuit requiring a second supply voltage different from the first supply voltage, which, in particular, can be used to interface a memory controller or a memory buffer chip with memory devices.
Pull-up and pull-down impedances are commonly used at an interface between two different types of logic devices, possibly operating at different power supply voltages. For example, in DDR2-SDRAM systems (DDR=Double Data Rate, SDRAM=Synchronous Dynamic Random Access Memory) center tapped driver pull-up and pull-down impedances in a driver circuit are usually kept equal or symmetric, as well as termination pull-up and pull-down impedances in a termination circuit. In case of a memory write operation, usually the memory controller or memory buffer makes use of a driver network to drive data towards a memory device and the memory device receives the data with a receiver or termination network. For a memory read operation the functionalities are vice versa. With that setup, a resulting common mode voltage at a receiving terminal fits to a target input reference voltage Vref, which is typically half the supply voltage of the receiving circuit.
In GDDR4-SGRAM systems (GDDR4=Graphics Double Data Rate (Version 4), SGRAM=Synchronous Graphics Random Access Memory) the setup of driver pull-up and pull-down impedances and termination impedances is implemented asymmetrically on the driver and asymrmetrically at the receiver, however requiring equal supply voltage values for both, the driving circuit and the receiving circuit.
For a reduced power dissipation, it is desirable to further reduce the supply voltage on the memory controller or the memory buffer chip, like an advanced memory buffer (AMB), while keeping a higher supply voltage on the memory components.
In accordance with embodiments, the present invention provides an apparatus for interfacing a first circuit requiring a first supply voltage and a second circuit requiring a second supply voltage different from the first supply voltage, the apparatus comprising a driver circuit having a driver network comprising driver supply voltage terminals connected to controllable switches, the controllable switches comprising resistive elements or being separated from resistive elements, a receiver circuit having a receiving network comprising a resistive element and receiver supply voltage terminals and a connection line connecting the driver circuit and the receiving circuit, wherein the controllable switches have two switch configurations, a first switch configuration resulting in a high voltage on the connection line and a second switch configuration resulting in a low voltage on the connection line, wherein the resistive elements in the driver network and the receiver network have values so that a sum of the high voltage and the low voltage is equal to the second supply voltage within a range of 10% of the second supply voltage when the first supply voltage is applied to the driver supply voltage terminals and when the second supply voltage is applied to the receiver supply voltage terminals.
In a further aspect, the present invention is providing a system comprising a first circuit having a first voltage supply for supplying a first supply voltage, a second circuit having a second voltage supply for supplying a second supply voltage being different from the first supply voltage and an interface interfacing the first circuit and the second circuit, the interface comprising a driver circuit having a driver network comprising resistive elements and driver supply voltage terminals connected to controllable switches, a receiver circuit having a receiving network comprising a resistive element and receiver supply voltage terminals, a connection line connecting the driver circuit and the receiver circuit, wherein the controllable switches have two switch configurations, a first switch configuration resulting in a high voltage on the connection line and a second switch configuration resulting in a low voltage on the connection line, wherein the resistive elements in the driver network and the receiver network are designed to have values so that a sum of the high voltage and the low voltage is equal to the second supply voltage within a range of 10% of the second supply voltage when the first supply voltage is applied to the driver supply voltage terminals and when the second supply voltage is applied to the receiver supply voltage terminals.
In yet a further aspect the present invention is providing a method for interfacing a first circuit using a first supply voltage and a second circuit requiring a second supply voltage different from the first supply voltage, the method comprising a step of switching controllable switches in a driver circuit having a driver network comprising driver supply voltage terminals connected to controllable switches, the controllable switches comprising resistive elements or being separated from resistive elements, the switches having two switch configurations, a first switch configuration resulting in a high voltage on a connection line connecting the driver circuit and a receiver circuit having a receiver network comprising a resistive element and receiver supply voltage terminals, and a second switch configuration resulting in a low voltage on the connection line, wherein resistive elements in the driver network and the receiver network are designed to have values so that a sum of the high voltage and the low voltage is equal to the second supply voltage within a range of 10% of the second supply voltage when the first supply voltage is applied to the driver supply voltage terminals and when the second supply voltage is applied to the second supply voltage terminals.
In the following, preferred embodiments of the present invention will be described with respect to the accompanying drawings, in which:
Before the concept and the embodiments of the present invention are described in more detail referring to
The first resistive element RONDrvUp 102 of the driver circuit 100 is connected between the connection line 130 and a first terminal of the first controllable switch 106, the switch 106 being connected to the first supply voltage VDDQDrv 110 with a second terminal. The second resistive element RONDrvDn 104 of the driver circuit is connected between the connection line 130 and a first terminal of the second controllable switch 108, the second switch 108 being connected to a first reference potential VSSDrv 112 with a second terminal. Thereby, the first reference potential VSSQDrv 112 may, e.g., equal a ground potential. The third resistive element RTTUp 122 of the receiver network 120 is connected between the connection line 130 and the second supply voltage VDDQRev 126. The fourth resistive element RTTDn 124 of the receiver network 120 is connected between the connection line 130 and a second reference potential VSSQRev 128. The second reference potential VSSQRev 128 may also be equal to the ground potential.
The way the connection line 130 is connected between the resistive elements RTTUp 122 and RTTDn 124 is commonly referred to as center-tapped termination.
The driver network 100 and the receiver network 120 together with the connection line 130 are, for instance, used in memory systems comprising DDR2-SDRAM memory chips and a memory controller or buffer chip, both supplied with the same supply voltage, i.e., VDDQDrv=VDDQRev. As aforementioned, the first reference potential VSSQDrv 112 and the second reference potential VSSQRev 128 may correspond to the ground potential GND in such memory systems. For this reason, in DDR2-SDRAM systems, the driver pull-up impedance RONDrvUp 102 and driver pull-down impedance RONDrvDn 104 are kept equal as well as the termination pull-up impedance RTTup 122 and the termination pull-down impedance RTTDn 124, respectively. With this setup, the resulting common mode voltage obtained on the connection line 130 on the receiver side fits to a target reference voltage Vref, which is half the supply voltage VDDQRev 126 of the receiver circuit 120.
In GDDR4-SGRAM systems, within the individual chips, i.e., the memory chips and the memory controller or buffer chip, different driver pull-up and pull-down impedances are used. This is shown on the left of
The left of
A block diagram of a circuit working as a driver network as well as a receiver network is depicted on the right of
The right of
As can be seen on the right of
In case the output enable signal 204 is put to logical “low”, the two transistors 206 and 210 are disabled while the PMOS transistor 214 is enabled, i.e. switched in an “ON”-state. In this case the depicted circuit on the right of
The setup depicted in
As has been explained referring to
In accordance with the present invention, the reduction of the supply voltage on the memory controller or the buffer chip can be achieved by an asymmetric setup of the pull-up and pull-down resistances of a driver network and a receiver network.
In accordance with an aspect of the present invention, an apparatus for interfacing a first circuit using a first supply voltage and a second circuit using a second supply voltage, different from the first supply voltage, is provided. According to embodiments the apparatus comprises a driver circuit having a driver network comprising driver supply voltage terminals connected to controllable switches, the controllable switches comprising resistive elements for being separated from resistive elements. The apparatus further comprises a receiver circuit having a receiver network comprising a resistive element and receiver supply voltage terminals, as well as a connection line connecting the driver circuit and the receiving circuit, wherein the controllable switches have two switch configurations, a first switch configuration resulting in a high voltage on the connection line and a second switch configuration resulting in a low voltage on the connection line, wherein the resistive elements in the driver network and the receiver network have values so that a sum of the high voltage and the low voltage is equal to the second supply voltage within a range of 10% of the second supply voltage when the first supply voltage is applied to the driver supply voltage terminals and when the second supply voltage is supplied to the driver supply voltage terminals and when the second supply voltage is applied to the receiver supply voltage terminals.
As well as the circuit depicted in
According to embodiments of the present invention, the receiver network 320 comprises a third resistive element RTTUp 322 serving as a pull-up impedance and a fourth resistive element RTTDn 324 serving as a pull-down impedance. As already explained referring to
Regarding the embodiment of the present invention schematically depicted in
In the following, the term “asymmetric termination towards a supply voltage” has the following two meanings.
Firstly, an impedance RONDrvUp or RTTUp being connected to a supply voltage VDDQDrv or VDDQRev has a higher or lower impedance than the impedance RONDrvUp or RTTDn being connected to the reference or ground potential VSSQDrv or VSSQRev. This means that the impedances differ more from each other than the usually present tolerances of, e.g., ±10% or ±20%. Hence, no tolerance-based difference is meant but an intended difference. This setup is also being referred to as “moderately asymmetric”.
Secondly, only a single termination impedance being connected to a supply voltage or reference potential is used. No second termination impedance is used in this setup, which will be referenced to as “asymmetric”.
When transmitting or driving data from e.g. a memory controller or buffer chip with a low first supply voltage VDDQDrv 310 to a memory device with a higher second supply voltage VDDQRev 326, a push-pull output driver is used, as indicated by
When transmitting or driving data from a memory device with a higher first supply voltage VDDQDrv 310 to a memory controller or buffer chip with a lower second supply voltage VDDQRev 326 (VDDQDrv>VDDQRev), also a push-pull output driver is used at the memory device, according to the depicted setup in
On the basis of the first supply voltage VDDQDrv 310 and the second supply voltage VDDQRev 326 being different from each other, the optimisation goal for the impedances for resistive elements 302, 304, 322 and 324 is a common mode voltage Vref, equal to approximately half of the receiving circuit's supply voltage VDDQRev 326. The common mode voltage value Vref can be computed according to
with Vlo and Vhi being the voltage levels corresponding to a logical “low” signal and a logical “high” signal on the connection line 130, respectively. Whether a logical low signal or a logical high signal is transmitted, is controlled by the positions of the controllable switches 106 and 108. A logical low signal is transmitted from the driver circuit 300 to the receiver circuit 320 when switch 106 is in “open”-position or high-impedance position and switch 108 is in “closed” position or low-impedance position. Then the low voltage level Vlo, can be computed according to the following formula:
In contrast, a logical “high” signal can be transmitted from the driver circuit 300 to the receiver circuit 320 by closing the controllable switch 106 or putting it in low-impedance position and leaving the controllable switch 108 open or putting it in high-impedance position. Then the following voltage level will be apparent on the connection line 130:
A voltage swing Vswing depends on the high voltage and the low voltage according to
V
swing
=V
hi
−V
lo (4)
According to an embodiment of the present invention, the switches 106 and 108 as well as the pull-up resistive elements 302 and 322 and the pull-down resistive elements 304 and 324 can be implemented by ON-resistances of transistors as described before, referring to
An effective termination resistance of the center-tapped receiver circuit 320 depicted in
As described above, the common mode voltage level Vref can be optimized by an asymmetric termination or a moderate asymmetric termination on the receiving side. Further optimization of the common mode level can be done by additionally using asymmetric or moderate asymmetric push-pull output drivers, e.g., with a high impedance pull-up path and a low impedance pull-down path or vice versa.
The necessary accuracy for the driver and termination impedances or resistive values can be achieved via state-of-the-art calibration methods. As already mentioned before, a resistive element of the driver network and/or the receiver network and a controllable switch can be implemented by a transistor, when the value of the resistive element is the On-resistance of the transistor, according to embodiments of the present invention. The On-resistance is thereby controllable by the current or voltage at the controlling terminal of the transistor controlling the resistance of a drain-source- or a collector-emitter-path.
Of course, the resistive elements of the driver network 300 and/or the receiver network 320 can also be formed by discrete resistors.
If the resistive elements 302 and 304 and the controllable switches 106 and 108 are implemented by transistors, controlling terminals of the transistors are, e.g., being controlled on the basis of a data signal 202 to be transmitted towards the receiver circuit 320 and the data enabling signal 204 enabling a transmission of the data signal 202.
In general, receiver networks according to embodiments of the present invention may also have switches, similar to the switches 106 and 108 of the driver networks, to connect resistances RTTUp or RTTUp to VDDQRev or VSSQRev, respectively. In the description of the present invention however, these switches are assumed to be statically in low impedance state while being in receive mode.
In the following, referring to
According to an aspect of the present invention, the first supply voltage VDDQDrv 310 is smaller than the second supply voltage VDDQRev 326, the resistance of the first resistive element RONDrvUp 302 equals the resistance of the second resistive element RONDrvDn 304 within a range of 10%, preferred within a range of 5% and more preferred within a range of 3% of the resistance of the first resistive element and the receiving network 420 is designed such that the third resistance RTTUp 322 between the connection line 130 and the second supply voltage VDDQRev 326 is smaller than a fourth resistance between the connection line 130 and the ground potential VSSQRev 328. In
Values for the supply voltages VDDQDrv 310, VDDQRev 326 and the resistive elements RONDrvUp 302, RONDrvDn 304 and RTTUp 322 according to an embodiment of the present invention can be found in the following table.
Setting and Values:
VDDQ
Drv=1.20 V±20%
VDDQ
Rev=1.80 V±20%
VSSQDrv=VSSQRev=0 V
RON
DrvUp=20 Ω±20%
RON
DrvDn=20 Ω±20%
RTT
Up=60 Ω±20%
RTTDn=infinite
Inserting the nominal values of the supply voltages and the resistive values into the afore-mentioned equations (1) to (3) the high voltage Vhi, the low voltage Vlo, in the common mode reference voltage Vref can be computed to
Vhi=1.35 V
Vlo=0.45 V
Vref=0.90 V.
In a further embodiment of the present invention, the resistance of the first resistive element RONDrvUp 302 is larger than the resistance of the second resistive element RONDrvDn 304. This embodiment can be seen as a moderate asymmetric push/pull driver and asymmetric termination. According to his embodiment of the present invention, the values for the supply voltages and the resistive elements can be found in the following table.
Setting and Values:
VDDQ
Drv=1.20 V±20%
VDDQ
Rev=1.80 V±20%
VSSQDrv=VSSQRev=0 V
RON
DrvUp=44 Ω±20%
RON
DrvDn=20 Ω±20%
RTT
Up=75 Ω±20%
RTTDn=infinite
Vhi=1.42 V
Vlo=0.38 V
Vref=0.90 V
Hence,
Setting and Values:
VDDQ
Drv=1.20 V±20%
VDDQ
Rev=1.80 V±20%
VSSQDrv=VSSQRev=0 V
RON
DrvUp=20 Ω±20%
RON
DrvDn=20 Ω±20%
RTT
Up=50 Ω±20%
RTT
Dn=300 Ω±20%
Vhi=1.31 V
Vlo=0.49 V
Vref=0.90 V
According to another aspect of the present invention, if the memory device works as a driver in
Setting and Values:
VDDQ
Drv=1.80 V±20%
VDDQ
Rev=1.20 V±20%
VSSQDrv=VSSQRev=0 V
RON
DrvUp=30 Ω±20%
RON
DrvDn=30 Ω±20%
RTT
Up=240 Ω±20%
RTT
Dn=48 Ω±20%
Vhi=1.11 V
Vlo=0.09 V
Vref=0.60 V
Values for supply voltages and resistive values related to a symmetric push/pull driver according to
Setting and Values:
VDDQ
Drv=1.80 V±20%
VDDQ
Rev=1.20 V±20%
VSSQDrv=VSSQRev=0 V
RON
DrvUp=20 Ω±20%
RON
DrvDn=20 Ω±20%
RTTUp=infinite
RTT
Dn=40 Ω±20%
Vhi=1.20 V
Vlo=0.00 V
Vref=0.60 V
According to yet another aspect of the present invention, the first supply voltage VDDQDrv 310 is larger than the second supply voltage VDDQRev 326, the resistance of the first resistive element RONDrvUp 302 is larger than the resistance of the second resistive element RONDrvDn 304 and the receiving network 620 is designed such that a third resistance between the connection line 130 and the second supply voltage VDDQRev 326 is larger than the fourth resistance RTTDn 324 between the connection line 130 and the ground potential VSSQRev 328.
Values for supply voltages and resistive values related to this moderate asymmetric push/pull driver according to
Setting and Values:
VDDQ
Drv=1.80 V±20%
VDDQ
Rev=1.20 V±20%
VSSQDrv=VSSQRev=0 V
RON
DrvUp=25 Ω±20%
RON
DrDn=20 Ω±20%
RTTUp=infinite
RTT
Dn=50 Ω±20%
Vhi=1.20 V
Vlo=0.00 V
Vref=0.60 V
It shall be noted that the presented driver network configurations and receiver network configurations in this disclosure are only examples and by no means constitute a full set of possible configurations for supply voltages and resistive values. According to further embodiments of the present invention also moderate asymmetric push/pull driver and moderate asymmetric termination configurations are possible.
It shall also be noted that both the memory device and the memory controller or buffer chip can serve as driving circuits as well as receiving circuits, depending on whether data is written from a memory controller or buffer chip towards the memory device or data is read from the memory device towards the memory controller or buffer chip. In the first case, the memory controller or buffer chip is on the driving side, whereas in the second case the memory controller or buffer chip is on the receiving side.
The basic concept of the present invention is to compensate asymmetric supply voltage values with asymmetric termination pull-up/pull-down impedances and/or with asymmetric output driver pull-up/pull-down impedances. While maintaining the common mode reference voltage VRef at the receiving device at the required value VDDQRev/2 interface power can be significantly reduced, since e.g. a reduced supply voltage on a memory controller or buffer chip can reduce power. The asymmetric termination resistors have small or even no shoot-through current, hence saving power.
Depending on certain implementation requirements of the inventive methods, the inventive methods can be implemented in hardware or software. The implementation can be performed using a digital storage medium, in particular a disk, a DVD or a CD having electronically readable control signals stored thereon, which cooperate with a programmable computer system such that the inventive methods are performed. Generally, the present invention is, therefore, a computer program product with a program code stored upon a machine-readable carrier, the program code being operative for performing the inventive methods when the computer program product runs on a computer. In other words, the inventive methods are, therefore, a computer program having a program code for performing at least one of the inventive methods when the computer program runs on a computer.