Claims
- 1. An apparatus for use in substrate polishing, comprising:a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad; and a support arm for supporting the conditioner head above the polishing pad surface to be conditioned, the support and having a fluid channel extending essentially longitudinally therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and the fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned.
- 2. The apparatus of claim 1, wherein the fluid channel comprises a tube for receiving the rinsing fluid and a tube for receiving air.
- 3. The apparatus of claim 2, wherein the tube for receiving the rinsing fluid is coupled to one or more water jets.
- 4. The apparatus of claim 1, wherein the support arm is coupled to a base and the fluid channel extends through the base.
- 5. The apparatus of claim 1, wherein the fluid channel is constructed to supply air to a fluid cavity, wherein the build-up and release of air pressure within the fluid cavity extends and retracts the conditioner head toward and away from the polishing pad surface to enable the end effector to condition the surface of the polishing pad.
- 6. The apparatus of claim 1, wherein the end effector includes a diamond-impregnated surface.
- 7. The apparatus of claim 1, wherein a surface of the end effector includes teeth.
- 8. The apparatus of claim 1, wherein a surface of the end effector includes recesses.
- 9. An apparatus for use in substrate polishing, comprising:a conditioner head constructed to receive an end effector for conditioning a surface of a substrate polishing pad; a support arm extending horizontally over the surface of the polishing pad and having one end coupled to the conditioner head for supporting the conditioner head above the polishing pad surface to be conditioned, the support arm having a channel constructed to convey fluid; and a pneumatic driver coupled between the support arm and the conditioner head and constructed to receive fluid through the support arm channel and thereby to apply an actuating force to extend and retract the conditioner head toward and away from the polishing pad surface, whereby an end effector attached to the conditioner head can condition the surface of the polishing pad.
- 10. The apparatus of claim 9 wherein the driver is coupled between the support arm and the conditioner head to apply an actuating force to the conditioner head from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned.
- 11. The system of claim 9 further comprising a fluid line that extends through the support arm to supply rinsing fluid to the polishing pad surface.
- 12. A method for use in substrate polishing, comprising:providing a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad; supporting the conditioner head above the polishing pad surface to be conditioned with a support arm that extends horizontally over the surface of the polishing pad; and supplying pneumatic pressure through the support arm to a pneumatic driver coupled between the conditioner head and the support arm to apply an actuating force to extend and retract the conditioner head toward and away from the polishing pad surface to enable an end effector attached to the conditioner head to condition the surface of the polishing pad.
- 13. The method of claim 12 wherein the conditioner head is driven with an actuating force that lies along a line from a position that is substantially normal to the polishing pad surface to be conditioned.
- 14. An apparatus for use in substrate polishing, comprising:a machine base; a rotatable substrate carrier constructed to receive a substrate for polishing; a rotatable platen mounted on the machine base to support a polishing pad for polishing a surface of the substrate; a conditioner head constructed to receive an end effector for conditioning a surface of the polishing pad; a support arm having one end mounted on the machine base and another end coupled to the conditioner head to support the conditioner head above the polishing pad surface to be conditioned; and a driver coupled between the conditioner head and the support arm to apply, from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned, an actuating force for extending and retracting the conditioner head toward and away from the polishing pad surface, whereby an end effector attached to the conditioner head can condition the surface of the polishing pad.
- 15. The apparatus of claim 14 wherein the driver is pneumatically-driven.
Parent Case Info
This application is a con't of Ser. No. 08/890,781 filed Jul. 11, 1997, now U.S. Pat. No. 6,036,583.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0 774 323 A2 |
May 1997 |
EP |
0 770 455 A1 |
May 1997 |
EP |
Continuations (1)
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Number |
Date |
Country |
Parent |
08/890781 |
Jul 1997 |
US |
Child |
09/479046 |
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US |