The present disclosure herein relates to a conditioner of a chemical mechanical polishing apparatus, and more particularly, to a conditioner of a chemical mechanical polishing apparatus, which evenly supplies slurry to a substrate mounted on a carrier head by evenly dispersing slurry over a platen pad of a polishing platen through exact introduction of a predetermined normal force into the platen pad.
Generally, a Chemical Mechanical Polishing (CMP) process is known as a standard process for polishing the surface of a substrate such as a wafer for fabricating a semiconductor including a polishing layer, by counter-rotating the substrate and the polishing platen.
The polishing platen 10 is attached with the platen pad 11 formed of a polytex material for polishing the wafer w, and rotates due to the rotation of a shaft 12.
The polishing head 20 is disposed over the platen pad 11 of the polishing platen 10, and includes a carrier head 21 gripping the wafer w, and a polishing arm 22 performing a reciprocating motion within a predetermined distance while rotating the carrier head 21.
The conditioner 30 finely cuts the surface of the platen pad 11 such that numerous fine foaming pores serving to contain slurry mixed with abrasives and chemical materials are not blocked, and thus smoothly supplies the slurry filled in the fine foaming pores of the platen pad 11 to the wafer w gripped by the carrier head 21.
For this, the conditioner 30 includes a motor and a gear box therein such that a shaft 33 connected to the holder 32 is rotated, in a state where a holder 32 is gripping a conditioning disk 31 contacting the platen pad 11 during the conditioning process. A cylinder is installed in the housing 34 to apply a downward force 31p to the conditioning disk 31 by pneumatic pressure. An arm 35 extending from the housing 34 performs a sweep motion to finely cut the foaming pores over the wide area of the platen pad 11. For the fine cutting of the platen pad 11, the conditioning disk 31 may include diamond particles attached on the surface thereof contacting the platen pad 11. Also, the shaft 33 may be rotated by a driving motor (not shown) installed outside the housing 34.
Thus, in the typical chemical mechanical polishing apparatus, the wafer w to be polished rotates while being attached to the carrier head 21 by vacuum pressure and pressed on the platen pad 11, and at the same time, the platen pad 11 rotates. In this case, slurry supplied from a slurry supplying unit 40 may be supplied to the wafer w that rotates while being fixed on the polishing head 20, in a state where the slurry is contained in numerous foaming pores that is formed in the platen pad 11. Since pressure is continuously applied to the platen pad 11, openings of the foaming pores are gradually clogged to obstruct the slurry from being smoothly supplied into the wafer w.
In order to overcome such a limitation, the conditioner 30 includes a cylinder applying a pressure toward the platen pad 11, rotating the conditioning disk 31 while applying a pressure to the conditioning disk 31 attached with particles such as diamond particles of high hardness. At the same time, the conditioner 30 performs a sweep motion to continuously perform fine cutting on the openings of the foaming pores that are distributed over the whole area of the platen pad 11. Thus, slurry contained in the foaming pores over the platen pad 11 can be smoothly supplied to the wafer w.
In this case, if the conditioning disk 31 of the conditioner 30 is not pressurized with an adequate force, the openings of the foaming pores of the platen pad 11 may not be opened to obstruct slurry from being smoothly supplied to the wafer w. If the conditioning disk 31 is pressurized with an excessive force, the openings of the platen pad 11 may be opened but the lifespan of the platen pad 11 may be shortened to reduce the economic efficiency.
Although the vertical force of the conditioning disk 31 is controlled by the cylinder such that a predetermined force is applied, the normal force that is substantially applied on the surface of the platen pad 11 may be lost at an intermediate path, for example, a joint of the conditioner 30 that transmits the normal force, or a desired normal force may not be transmitted due to an error of the normal force that may be caused by a cylinder used for a long time. Accordingly, there is a limitation in that slurry contained in numerous foaming pores of the platen pad 11 is not smoothly delivered to the wafer.
The present disclosure provides a conditioner of a chemical mechanical polishing apparatus, which evenly supplies slurry to a substrate mounted on a carrier head by evenly dispersing slurry on a platen pad of a polishing platen through exact introduction of a predetermined normal force into the platen pad.
The present disclosure also provides a conditioner of a chemical mechanical polishing apparatus, which secures enough lifespan of a platen pad and smoothly supplies slurry to a substrate such as a wafer through uniform fine cutting over the platen pad using a conditioner, by detecting that a relatively large normal force is applied to a specific side of a conditioning disk during the rotation thereof, and allowing the normal force to be uniformly applied to the whole of the conditioning disk.
Embodiments of the inventive concept provide conditioners of chemical mechanical polishing apparatuses for polishing a substrate over a platen pad that rotates, the conditioner including: a disk holder securing a conditioning disk that finely cuts a surface of the platen pad; a piston rod delivering a normal force to the disk holder; a housing covering at least a portion of the piston rod; and a load sensor installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.
In some embodiments, the piston rod may be located on the same axis as a center of rotation of the conditioning disk.
In other embodiments, the load sensor may be interposed between the piston rod and the disk holder.
In still other embodiments, the conditioner may further include: a shaft upwardly spaced from the piston rod; a cylinder surrounding the shaft and the piston rod such that a pneumatic pressure chamber is formed between the shaft and the piston rod, rotating together with the shaft and the piston rod, and having a step at an outer circumferential surface thereof, the step delivering a force to the load sensor in an upper direction. Here, the load sensor may be installed to be supported by the housing, and a reaction force of the normal force delivered to the cylinder through the step of the cylinder may be delivered to the load sensor.
In even other embodiments, the load sensor may be disposed at a side of an outer circumference of the cylinder, and a bearing may be installed therebetween to allow a relative rotational displacement.
In yet other embodiments, delivering of the normal force to the load sensor by the step may include delivering a shearing force via the bearing.
In further embodiments, the load sensor may measure the normal force from a strain caused by receiving the normal force.
In still further embodiments, the load sensor may include a load cell.
In even further embodiments, the load sensor may include a strain gauge having an electric resistance varying according to the strain to measure the normal force using the strain gauge.
In yet further embodiments, the conditioner may further include a controller for controlling the normal force applied to the piston rod to reach a predetermined value if there is a difference between a value of the normal force measured by the load sensor and the predetermined value.
In much further embodiments, the load sensor may be divided into two or more segments such that the segments measure normal forces around the piston rod, respectively.
In still much further embodiments, the piston rod may be formed in plurality, and if there is a deviation among the normal forces measured by the segments of the load censor, the conditioner may further include a controller for controlling the deviation of the normal forces to become smaller than a predetermined value.
In other embodiments of the inventive concept, conditioning methods of a chemical mechanical polishing process for fining cutting an upper surface of a platen pad using a plurality of pores containing slurry include: rotating a platen pad while contacting a substrate to be polished; rotating a conditioning disk having particles having a hardness enough to finely cut the platen pad while apply a downward pressure to the conditioning disk through a piston rod; and measuring a normal force that is applied to the conditioning disk through the piston rod.
In some embodiments, the measuring of the normal force may include measuring the normal force using a load value sensed by a load sensor when a pressurizing part of the piston rod located on the same axis as a center of rotation of the conditioning disk applies a pressure to the load sensor fixed at a housing that covers at least a portion of the piston rod.
In other embodiments, the measuring of the normal force may include measuring the normal force by measuring a reaction force delivered to the load sensor when the piston rod located on the same axis as a center of rotation of the conditioning disk applies a pressure to a disk holder to allow the reaction force facing upward and generated by a normal force that contacts the conditioning disk with the platen pad to be delivered to a cylinder surrounding the piston rod and then delivered to the load sensor located around an outer circumference of the cylinder by a step formed on an outer circumferential surface of the cylinder.
In still other embodiments, the method may further include adjusting a magnitude of the normal force delivered through the piston rod when there is a difference between a value of the normal force measured in the measuring of the normal force and a predetermined value.
The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:
Exemplary embodiments of the inventive concept will be described below in more detail with reference to the accompanying drawings. The inventive concept may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art.
Hereinafter, a chemical mechanical polishing apparatus according to an embodiment of the inventive concept will be described in detail with reference to the accompanying drawings. For explanation of the inventive concept, however, a detailed description of known functions or configurations will be omitted to clarify the point of the inventive concept.
As shown in
In the conditioner 100 configured as above, the normal force 130y generated in the actuator 130 may be directly delivered to the conditioning disk 111 through the disk holder 112, and may be directly measured by the load sensor 140. Accordingly, although the normal force 130y generated in the actuator 130 is different from a predetermined value, and slight gaps exist at joints between housing members 122, 122, and 123 because the conditioner 100 is formed to have an arm shape, the normal force applied to the platen pad 11 by the conditioning disk 111 may be uniformly maintained by the controller for controlling the normal force 130y generated in the actuator 130 to be a predetermined value.
On the other hand, as shown in
In the conditioner 100′ configured as above, the normal force 130y′ generated by the actuator 130′ may be delivered to the piston rod 113 on the same axis as the conditioning disk 111. The normal force 130y′ generated in the actuator 130 may have the same direction as the normal force 130y introduced to the conditioning disk 111. However, an incalculable portion of the normal force 130y′ may be lost at joints of a housing 120 during delivery of the normal force 130y′ applied on the pivot to the conditioning disk 111.
However, in the conditioner 100′ of the inventive concept, a load sensor 140 may be located in the piston rod 113 that delivers the normal force 130y. The load sensor 140 may directly measure the normal force 130y introduced into the disk holder 112. A controller (not shown) may control the normal force 130y′ generated in the actuator 130′ located on the pivot, based on the above measured value. Accordingly, the normal force 130y having a predetermined magnitude may be constantly delivered to the disk holder 112.
Thus, in the conditioners 100 and 100′ according to the embodiments, the normal force 130y introduced to the conditioning disk 111 may be directly measured. As shown in
Since the piston rod 113 shown in
As shown in
That is, a protrusion 112p′ formed on the shaft 112a of the disk holder 112 may protrude only at a position spaced from the bottom so as to counter-rotate with respect to the load sensor 140 when the load sensor 140 is installed. Although not shown, thrust bearings may be installed on the upper surface and the undersurface of the load sensor 140 to allow a relative rotational displacement while receiving an axial force. Also, although not shown, each outer circumferential surface of the load sensor 140 may be fixed on a housing 120 to restrain an absolute rotational displacement.
Accordingly, each of segments 140a, 140b, 140c and 140d of the load sensor 140 may measure a component of the normal force 130y applied to the disk holder 112 in a state where the segments 140a, 140b, 140c and 140d do not rotate, according to the rotation angle. Thus, the load sensor 140 may detect an eccentric load that is significantly imposed on one side during the rotation of the conditioning disk 111. When an eccentric load imposed on one side is detected, if the piston rod 113 is divided into segments, the deviation of normal forces applied to each segment of piston rod 113 may be controlled to allow the normal force 130y applied by the conditioning disk 111 to be uniformly distributed over the entire area.
A pinion 251 that is rotated by the driving motor 250 may engage with a gear 252 fixed on the outer circumference of the shaft 232. Thus, the shaft 232 may be rotated by the driving motor 250.
As shown in
The normal force of the piston rod 213 that applies a pressure in a downward direction may be delivered to the disk holder 212 through a medium member 212a. The conditioning disk 211 gripped by the disk holder 212 may serve to apply a pressure on the platen pad 11.
The shaft 232 of the conditioner 200 may be rotated by the pinion 251 of the driving motor 250. The cylinder 238 airtightly coupled to the shaft 232 using a sealing ring 238a may rotate together with the shaft 232.
If the disk holder 212 applied with a pressure while being rotated by the driving motor 250 moves downward to contact the conditioning disk 211 with the platen pad 11, the normal force applied to the disk holder 212 may act as a reaction force that faces upward. In this case, if the platen pad 11 is approximated to a rigid body, the reaction force may act with the same magnitude as the normal force applied to the disk holder 212.
Due to the reaction force caused by the normal force that pushes the conditioning disk 211 downwardly, an upward displacement may be generated at the cylinder 238, the piston rod 213, and the shaft 232 that rotate. In this case, a step 238s may be formed on the outer wall of the cylinder 238 as shown in
Here, the load sensor 240 disposed to surround the cylinder 238 may be fixed while being supported by a housing 221. That is, since the load sensor 240 stands still without rotating, a signal line from the load sensor 240 may be connected to an external signal processing device without a slip ring. Since the cylinder 238 rotates due to driving of the motor 250, and the load sensor 240 stands still without rotating, a bearing 249 including a pair of ball bearings or roller bearings vertically spaced from each other by a spacer 248 may be disposed between the load sensor 240 and the cylinder 238.
The inner race of the bearing 248 may be located over the step 238s of the cylinder 238 to move upward together according to upward lifting of the cylinder 238. Also, the outer race of the bearing 249 may be fixed on the inner circumferential surface of the load sensor 240 by a press fit, delivering an upward displacement of the cylinder 238 to the inner race of the bearing 249 by a ball or roller of the bearing 249.
That is, the upward reaction force generated by the normal force that is applied to the disk holder 212 by the piston rod 213 may cause the upward movement of the cylinder 238. A pair of bearings 249 may move upward according to the upward movement of the cylinder 238, and a displacement thereof may be delivered to the outer race of the bearing 249 by the ball or roller of the bearing 249. Subsequently, the normal force applied to the conditioning disk 111 through the piston rod 213 may act as a shearing force on the inner circumferential surface of the load sensor 240. Accordingly, the reaction force may be measured from a shear strain acting on the inner circumferential surface of the load sensor 240 by a strain gauge or a load cell.
As shown in
By measuring the normal force applied to the conditioning disk 111 from the reaction force, a signal from a load sensor 240 can be stably received without a slip ring while moving a cylinder 238 of an actuator 230 close to a disk holder 212.
As described above, the inventive concept provides a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof, including: a disk holder securing a conditioning disk that finely cuts a surface of the platen pad; a piston rod delivering a normal force to the disk holder; a housing covering at least a portion of the piston rod; and a load sensor installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force. According to embodiments of the inventive concept, the platen pad can be finely cut evenly over the whole surface thereof by the conditioner to secure enough lifespan of the platen pad and smoothly supply slurry to the substrate such as a wafer, by maintaining the normal force introduced to the conditioning disk at a predetermined constant value.
Accordingly, the inventive concept has an advantage effect of evenly supplying slurry to a substrate mounted on a carrier head by exactly introducing a predetermined normal force over the plate pad and evenly dispersing slurry to be coated on the platen pad of a polishing platen.
Also, the inventive concept can secure enough lifespan of the platen pad and smoothly supply slurry to the substrate such as a wafer through uniform fine cutting over the platen pad using a conditioner, by detecting that a relatively large normal force is applied to a specific side of a conditioning disk during the rotation thereof, and allowing the normal force to be uniformly applied to the whole of the conditioning disk.
The above-disclosed subject matter is to be considered illustrative and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true spirit and scope of the inventive concept. Thus, to the maximum extent allowed by law, the scope of the inventive concept is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.
Number | Date | Country | Kind |
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10-2010-0043466 | May 2010 | KR | national |
This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2010-0043466, filed on May 10, 2010, the entire contents of which are hereby incorporated by reference.