Conditioning ink jet orifices

Information

  • Patent Grant
  • 6533376
  • Patent Number
    6,533,376
  • Date Filed
    Friday, January 29, 1999
    25 years ago
  • Date Issued
    Tuesday, March 18, 2003
    21 years ago
Abstract
Conditioning an ink jet orifice by illuminating the orifice with radiation from a laser to remove contaminants and smooth rough surfaces.
Description




FIELD OF THE INVENTION




This invention relates to conditioning ink jet orifices.




BACKGROUND OF THE INVENTION




In ink jet printing, ink is ejected from a narrow orifice in the direction of a substrate. In one type of ink jet printing, known as drop on demand printing, the ink is ejected in a series of droplets. The droplets may be produced and controlled using a piezoelectric ink jet head which has a large number of orifices, each of which is separately controllable to selectively eject ink at desired locations, or pixels, of the image. For example, an ink jet head may have 256 orifices that have a spacing for a printing resolution of 100 pixels (dots) per inch (dpi) or more. This dense array of orifices allows complex, highly accurate images to be produced.




The quality of the images suffers, however, if one or more of the orifices becomes obstructed. For example, a partially obstructed orifice may alter the direction, size, or stability of the droplets. A fully obstructed orifice reduces print quality by causing gaps in the image.




SUMMARY OF THE INVENTION




In an aspect, the invention features conditioning an ink jet orifice by illuminating the orifice with radiation. In another aspect, the invention features conditioning an ink jet orifice using a printing station arranged to permit the print head to print an image on a substrate, and a radiation source arranged to illuminate the orifice. In another aspect, the invention features conditioning an ink jet orifice using a testing station arranged to test the operation of the orifice, and a radiation source arranged to illuminate the orifice.




Embodiments may include one or more of the following. The radiation is selected to remove organic contaminant material. The organic material is selected from the group consisting of ink, polymer, and protein. The radiation is selected.to smooth regions of the ink jet head proximate the orifice. The radiation is UV radiation. The radiation is provided by an excimer laser. The excimer laser has a wavelength of about 248 nm and a fluence of about 0.3 to about 1.5 Joule/cm


2


, e.g., about 0.5 Joule/cm


2


.




Embodiments may also include one or more of the following. The radiation,is focused to a focal point. The radiation is selected to remove contamination to a depth inside the orifice no greater than about 15 μm. The focal point is inside the orifice. The radiation has a beam diameter smaller than the width of the orifice. The radiation impinges the orifice at an angle with respect to the axis of the orifice. A coolant is used in proximity with the orifice. The coolant is gas. An ozone-forming gas and radiation at a select wave length are used to form ozone.




Embodiments may also include one or more of the following. The orifice is in a plate fabricated from metal, polymer, or ceramic. The orifice has a diameter of about 70 μm or less, e.g., about 15 to about 50 μm. The plate has a plurality of orifices separated by about 0.015 inch or less, e.g., about 0.004 to about 0.012 inch. The ink jet orifice is an ink jet orifice for a piezoelectric drop on demand ink jet head.




Embodiments may include one or more of the following. The operation of the orifice is tested by jetting a test image. The image is visually inspected or electronically inspected. A transport arrangement transports the orifice between a printing station to an illuminating station including the source of radiation and a testing station. The transport arrangement includes a rail system.




Embodiments may include one or more of the following advantages. For example, print head orifices can be quickly, efficiently, and inexpensively cleared of obstructions, such as those arising during manufacture or use. The conditioning can greatly improve the manufacturing yield of print heads. For example, print heads rejected for droplet instability or orifice obstructions may be recovered by radiation conditioning. Heads that develop obstructions in use, e.g., dried ink obstructions, can be quickly and easily conditioned without the need to replace the head or orifice plate. Print heads can also be conditioned even if they do not have an obstruction, to smooth rough surfaces and sharp corners adjacent to the orifice, which can improve droplet formation and jetting characteristics. Print heads can also be radiation conditioned to remove conformal coatings.




Further advantages, aspects, and features, follow.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a front perspective view of an ink jet print head and

FIG. 1



a


is a back perspective view of an ink jet print head;





FIG. 2

is a perspective sectional view of an ink jet print head;





FIG. 3

is a perspective view of a system for conditioning ink jet orifices;





FIG. 4A

is a cross section of an orifice prior to conditioning;





FIG. 4B

is a cross section of the orifice in

FIG. 4A

, during irradiation;





FIG. 4C

is a cross section of the orifice in

FIG. 4A

, after conditioning;





FIG. 5

is a schematic perspective view of another system for conditioning ink jet orifices;





FIG. 6

is a cross section of an orifice contaminated with a fiber, during irradiation;





FIG. 7

is a schematic view of illumination of an orifice;





FIG. 8

is a schematic view of illumination of an orifice using a particular optical arrangement;





FIG. 9

is a schematic view of illuminating an orifice using another optical arrangement;





FIG. 10

is a schematic view of illuminating an orifice using another optical arrangement;





FIG. 11

is a schematic view of illuminating an orifice using another optical arrangement; and





FIG. 12

is a schematic view of illuminating an orifice using another optical arrangement.











DESCRIPTION OF THE PREFERRED EMBODIMENTS




Referring to

FIGS. 1-2

, a piezoelectric ink jet print head


10


includes jetting modules


11


and an orifice plate


12


with an array


13


of orifice openings


14


. The orifice plate


12


is mounted on a manifold


16


, attached to a collar


18


. The ink jet print head


10


is controlled by electrical signals conveyed by flexprints


20


.




Referring particularly to

FIG. 2

, in operation, ink flows from a reservoir (not shown) into a passage


22


, which leads to deaerator


24


. Deaerated ink is conveyed through a passage


32


to a pressure chamber


34


from which it is ejected on demand through an orifice passageway


36


and a corresponding orifice opening


14


in the orifice plate


12


in response to selective actuation of the adjacent portion


38


of a piezoelectric plate


40


. Passages


32


,


34


, and


36


are formed in a plate


41


made of carbon. Carbon plate


41


is bonded to orifice plate


12


on one side, and piezoelectric plate


40


on the other side. The orifice plate is made out of metal (e.g., stainless steel, nickel, gold), ceramic (e.g., glass, alumina, zirconia), or polymer (e.g., polyimide (Kapton), PEEK). Ink jet print heads of this type are described in more detail in Moynihan et al., U.S. Pat. No. 5,640,184 and Hine et al., U.S. Pat. No. 5,771,052, which describes a modular arrangement. The entire contents of these patents are incorporated herein by reference. An example is the 256 jet, 600 dpi, CCP-256 print head available from Spectra, Inc., Hanover, N. H.




Referring to

FIG. 3

, the ink jet print head


10


is conditioned at a conditioning station


42


. An assembled ink jet print head, or the orifice plate/carbon plate portion, or just the orifice plate, is placed, orifice plate facing upward, on a stage


44


of an x-y table


46


. The stage includes blocks


47


, held by clamps


49


, arranged to maintain the print head in a stable condition without contacting the face of the orifice plate. A laser


48


generates a beam


50


. The beam


50


passes through a mask


52


to produce a beam


40


of desired size and shape and a mirror


54


deflects the beam


40


which passes through a focusing lens


41


and impinges on the ink jet print head


10


. The beam


40


conditions the print head by removing contamination on the surface of the orifice plate, in the orifice opening


14


, in the orifice passageway


36


and/or below the orifice. The beam may also be of a sufficient intensity to condition the orifice plate by smoothing surfaces proximate the orifice.




Referring to

FIG. 4A

, prior to conditioning, contamination


56


may adhere to the edges of orifice opening


14


and may also be disposed inside the orifice passageway. Contamination is typically organic in nature. It may be composed of residual ink, e.g., wax based hot melt inks or ink varnish. It may also be epoxy used in manufacturing the ink jet print head. Under manufacturing conditions, atomized epoxy may settle on or around the orifice. Contamination may also be proteinaceous, such as skin cells sloughed from workers at a manufacturing site. Contamination may also include a conformal coating. Contamination may also include natural or synthetic clothing fibers. The hot surfaces of the print head can cause contaminants to melt and oxidize. This oxidation process may result in the thermal attachment of the contaminant to print head orifices, yielding poor jetting performance.




The surface of orifice plate


12


may also have a somewhat rough morphology as a result of machining operations and orifice forming operations or as a result of rough handling. The roughness is exaggerated in

FIGS. 4A and 4B

, for illustrative purposes. The roughness may include a burr


57


which may protrude about 5 microns or more. This roughness can adversely affect the transport of ink through the orifice or droplet formation at the opening of the orifice. The periphery of the orifice may also define a sharp edge


59


which can adversely affect droplet formation. Conventional machining or rough handling of the metal plate can also leave gouges and scratches


61


on the surface of the orifice plate adjacent the orifice opening or inside the orifice.




Orifices are typically formed by either electrical discharge machining (EDM) or electroplating. In EDM, an orifice plate, e.g., made of metal, is exposed to an electrical discharge to form the orifices. This process sometimes leaves burrs, which are metal flakes that were not completely removed. The burrs typically form at the periphery of the orifice opening, standing generally parallel to the orifice axis and extending above the orifice opening. In electroplating, a substrate, such as chrome-spattered glass, on which spots of photoresist have been imaged, is plated with a metal, such as nickel. The thickness of the plated metal determines the final orifice diameter. This process can lead to sharp edges around the peripheny of the orifice opening and a rounded countersink known as a “bellmouth” at the bottom of the orifice plate.




Refer to

FIG. 4B

, to remove the contamination


56


and/or to smooth the surface of the orifice plate


12


, laser beam


50


is directed at the orifice. The energy and wavelength of the laser beam


50


is selected to condition the orifice without damaging the orifice plate or the support plate.




Referring to

FIG. 4C

, after being exposed to the laser beam


50


, the orifice plate


12


is substantially free of contamination. Also, if a beam of sufficient intensity is used, the corners of the orifice plate


12


at the edge of orifice opening


14


are rounded and the surface


58


of the orifice plate


12


is smooth in proximity to the orifice


14


. The rounded corners improve the circular symmetry of the nozzle ink meniscus at the nozzle orifice which improves the efficiency of ink ejection. Preferably, the conditioning removes or reduces burrs that protrude by an amount that is about 10% or more of the orifice diameter. Preferably, the conditioned orifice is free of burrs that protrude more than about 3 microns. More preferably, the conditioned orifice is free of burrs greater than about 2 microns.




The mechanism of contaminant removal is believed to be ablation caused by absorption of energy at the laser wavelength by the contaminant material, which leads to rapid heating followed by vaporization. The fluence of the beam and the time of exposure may be selected depending on what material is to be ablated. Exposure to the beam is also believed to locally heat the surface of the orifice plate sufficiently to create surface melting which smooths rough morphology and rounds the edges of the periphery of the orifice. A lower fluence or exposure time may be used for conditioning polymer orifice plates and a greater fluence or exposure time can be used on metal orifice plates.




The energy level on the orifice plate surface and at a given depth inside the passageway can further be controlled by focusing the beam to a focal point, and locating the focal point at a given depth with respect to the passageway. Beyond the focal point, the energy level falls off rapidly. It is typically desirable that the highest energy levels are within the first 100 micron of passageway depth, where most contaminants are typically found, and that the energy is substantially dissipated at the depth of the carbon plate to avoid damaging this component. The location of the focal point may also be scanned along the orifice axis to clean throughout a long passage, e.g. by varying the location of the lens


41


with respect to the orifice plate using a stepping motor (not shown).




In a particular embodiment, a MicroMaster, laser treatment station, which is manufactured by OPTEC and distributed by Reonetics, Nashua, N. H., is used with mounting fixtures such as clamps and blocks. The laser is an ATLEX SP excimer laser, generating a laser beam with a wavelength of 248 nm or 193 nm. The maximum pulse energy is 10 mJ at 248 nm or 5 mJ at 193 nm. It has a maximum repetition rate of 200 pulses/sec and a pulse width of 3-4 ns. The x-y table


46


is motorized with stepper motors with a stepping resolution of 1 μm; the stage


44


is 25 mm×25 mm. A sample placed on the x-y table


46


can be viewed with a camera (not shown). The camera viewing system includes a TTL-1 on-axis camera display system, a VUV-1 off-axis camera display system, and a monochrome, 2-channel, 9 inch CCTV monitor. The MicroMaster system is controlled with a Pentium computer; the computer's software package includes OPTEC Process Power system control software with CAD/CAM interface. The MicroMaster system also includes a hand-held remote laser controller. The x-y table


46


allows the accurate location of an individual orifice


14


. The video microscope system enables the user to see where the laser beam


50


impinges, as well as to observe the ablation of contamination


56


. Energy density is measured by a pyrolytic energy meter at the workpiece surface (Molectrom, Inc., Portland, Oreg.).




In a particular embodiment, the carbon plate


41


is 0.13 inch thick and the orifice plate


12


is 0.003 inch thick. The orifice opening diameter is about 0.002 inch (about 52 μm) and adjacent orifices are separated by about 0.010 inch (center to center). The orifice has a geometry (see

FIG. 4A

) that includes a region adjacent the opening with substantially vertical walls that extend about 10 μm deep into the orifice plate, which is followed by a countersink region including a conical section that expands at about 20° to a diameter of about 75 μm. The conical section is followed by a section of substantially vertical walls for the remaining thickness of the orifice plate. For conditioning a solid nickel orifice plate, the beam


40


is masked so that the size of the beam


50


impinging on the print head


10


is 0.020 inch width×0.030 inch length. The laser is operated at a pulse rate of 150 pulses/sec at a wavelength of 248 nm and fluence of about 0.5 Joule/cm


2


. The print head is stepped under the beam after 50 pulses of irradiation, at a step width of about 0.023 inch, which is about 75% of the beam width. Since the spacing of the orifices is less than the beam width, two orifices are illuminated simultaneously, and each orifice is exposed to about 100 pulses. Typically, for conditioning within the passageway, the focal point of the beam is at or slightly below the surface


58


of the orifice plate


12


. The focal point of the laser beam has a focal depth of maximum energy of about 15-25 μm. Focusing the beam at the orifice surface typically removes contamination to a depth of 7-10 μm. Focusing below the orifice surface permits deeper conditioning. For example, focusing at a depth of about 15 μm is desirable.




Referring to

FIG. 5

, in an alternative embodiment, a conditioning system is integrated with a printing system so that the head can be readily conditioned immediately before, after, or even during an interruption of a printing operation. In this arrangement ink jet print heads


10


are mounted on rails


60


, e.g., by a motor under computer control. The print heads


10


move along the rails


60


in response to signals transmitted along a flexible cable (not shown). The print heads


10


can be moved between three positions on the rails


60


.




The print heads


10


may be positioned at a printing station, including a substrate holder


62


, such as a roller, where it is used for printing, e.g., on paper (not shown). The print heads


10


may alternatively be positioned at jet function detection station


64


for testing the orifices


14


. The print heads


10


may also be positioned at a conditioning station including a laser beam


50


′ for illuminating the orifices


14


of print head


10


.




To test the orifices at the jet function detection station, print heads


10


print a test pattern on a piece of paper, e.g., with a grid. This test pattern is analyzed either visually by an operator with a loop or electronically. The test pattern can be electronically checked by an imaging system with a CCD and an x-y table. (Available from KDY, Inc., Nashua, N. H.)




If an orifice in need of conditioning is detected, the print head


10


is moved into the conditioning station. The laser beam


50


′ is directed at the defective orifice


14


by passing through a mask


52


′ and a lens


66


in the manner described in

FIGS. 4A-C

.




In other embodiments different radiation sources and/or power levels may be used. For example, an infrared source, e.g., a CO


2


laser operating at 10.6 μm or a copper vapor laser operating at 511 nm may be used. Excimer or frequency doubled Nd: YAG lasers use pulsed ultraviolet light to photochemically decompose, or ablate, material. Metals and organics are ablated at significantly different rates at ultraviolet wavelengths, so energy levels can be chosen to clean organic material while causing no damage to the surrounding metals. The penetration depth of the laser beam can also be controlled using a combination of number of pulses, etch rates and optics arrangements.




Table I provides the etch rates of various materials using a krypton fluoride excimer laser. This data was obtained for samples prepared by placing the contaminants on glass slides at 200° C. for 6 minutes to reflow and/or oxidize them.
















TABLE I











Etch Rates










(microns/pulse)










0.375




1.5







Sample




Wavelength




Joules/cm


2






Joules/cm


2






Comments











Tektronics




248 nm




1.27




1.87




Clean Etch






Hot Melt






Ink Jet






Ink


1








Coates Hot




248 nm




1.60




>3.60  




Some






Melting Ink







melting at






Jet


2









higher










fluence






Scorched




248 nm




0.75




4.00




Etch rates






Milk







Dependent










on Degree










of










Oxidation






Epon (R)




248 nm




0.93




1.87




Clean Etch






826 Epoxy


3








Trabond




248 nm




0.27




1.67




AL


2


O


3








2151







filler






Epoxy


4









Remains






Chocolate




248 nm




1.40




4.47






Caramelized




248 nm




1.20




3.20




Clean






Sugar







Etching






Packaging




248 nm




0.27




0.73




Slow






Poly-







Etching






ethylene






Hot Melt




248 nm




>0.53  




>0.53  






Ink






Varnish


5















1


Available from Tektronics, Inc., Beaverton, OR.












2


Available from Coates, Inc., Hanover, NH.












3


Available from Epon, Shell, Houston, TX.












4


Available from Tra-Con, Bedford, MA.












5


Hot melt ink varnish is highly oxidized ink residue scraped from an operating ink jet head.













Power densities in the desired operating ranges do not damage the orifice plate geometry. When irradiating solid nickel orifice plates, either as loose orifice plates or orifice plates epoxy bonded into array assemblies using the krypton fluoride laser, power densities below 0.1 Joules/cm


2


show no effect on the orifice plate; at 0.375 Joules/cm


2


slight hazing (oxidation discoloration) of the surface occurs; at 0.75 Joules/cm


2


the hazing goes away, but the surface texture appears smoother than originally; at 1.5 Joules/cm


2


the surface is etched and the lip of the orifice holes appear to round or reflow. An operating window of 0.19 to 0.75 Joules/cm


2


is preferable.




Inspection by SEM photos and optical microscopy both show little or no change to the orifice diameter or geometry. An intermediate fluence (0.75 Joules/cm


2


) appears to have a greater effect than at a higher fluence (1.5 Joules/cm


2


). At the intermediate fluence, some rounding of the exit lip is visible in SEM photos. At the higher fluence, this does not appear. The higher fluence does show discoloration and texturizing both of which are similar to oxidation seen in plasma etching in air.




These effects are more visible on loose orifice plates than on assembled print heads. It is believed that this effect is thermal and that the bonded assembly dissipates heat from the orifice quickly. Slight bending, e.g., of unbonded orifice plates, at intermediate and higher fluences may indicate excessive thermal effects. If heating is excessive, an inert gas flow or other cooling arrangement can be used to cool the workpiece.




For polymer orifice plates, lower fluence is preferable. The preferred fluence for conditioning a Kapton polymer orifice plate with a laser wavelength of 248 nm is about 0.38 Joules/cm


2


. At 0.5-0.75 Joules/cm


2


, the Kapton shows some gross distortion.




A variety of optical arrangements may be used depending on the objective, e.g., whether the cleaning is needed on the orifice plate surface or is required further into an orifice or in the countersink or bellmouth.




Referring to

FIG. 6

, a beam is sized smaller than the orifice opening to condition deep within, or even below the passageway. In this example, an orifice is contaminated by a fiber


57


. The fiber


57


may be natural or synthetic; its source may be clothing. A laser beam


65


, is focused or masked to a diameter smaller than the diameter of the orifice. In this way, a high beam density and/or long exposure time can be used to selectively ablate the fiber


57


without damaging the orifice plate


12


. This technique may be particularly beneficial for conditioning polymer orifice plates, which can be made out of e.g., polyamide, and to avoid damage to backing plates made of e.g., the carbon.




Referring to

FIGS. 7 and 8

, due to the geometry of some orifices, it may be difficult to illuminate certain areas in the orifice. In

FIGS. 7 and 8

, contaminants lodged in an area below the orifice opening known as the bellmouth may contribute to jet straightness and therefore may be conditioned. Referring particularly to

FIG. 7

, a laser


70


producing a collimated beam


71


directed on the axis of the orifice of a plate


72


may not irradiate the contamination


74


in a countersink or bellmouth region


76


. Referring to

FIG. 8

, an optical system


80


may be used to direct a beam


82


at an angle so that the contamination is illuminated and removed from the bellmouth.




Referring to

FIG. 9

, an optical arrangement


90


is provided so that a beam may be scanned around the orifice to condition the bellmouth region about its entire circumference. The arrangement includes a laser


91


, with a spatial filter and collimating lens


93


and a focusing lens


92


. The focusing lens


92


is positioned to intercept a beam


94


at a location off the lens axis


96


. The focused beam


98


is deflected at an angle into the orifice


100


. To scan the beam


98


, the lens is rotated as shown by arrows


102


. The focal length of the lens typically must be small to achieve the proper scan radius and angle of the beam. For a 54 μm orifice (orifice opening radius x=27 μm) and an angle of 45° (tan=1), the focal, f, length is 27 μm. For a 37 μm orifice, the focal length is 18.5 μm. The focal length may be adjusted to compensate for the standard deviation of the orifices on a particular plate to provide consistent exposure on each orifice.




Referring to

FIG. 10

, in another arrangement


110


, instead of using a lens to scan around the orifice, a cylindrical dielectric mirror


112


is used to deflect a beam


114


. The beam is scanned by rotating the mirror


112


as indicated by arrows


116


. Without an additional lens, this system lacks the ability to focus to a spot. But a very small beam diameter can be selected (e.g. by masking) before (or after) it is reflected at the mirror. Also, there is less attenuation with the dielectric mirror.




Referring to

FIG. 11

, a system


120


for cleaning beneath the outer surface of the orifice plate


72


is illustrated which uses a convex lens


122


that will focus at point


124


. Beyond this focal point the light will diverge. With selection of the lens the correct angular divergence can be achieved that just fits the orifice. Different lenses for orifice plates of different diameter may be used or the distance, f, from the focal point to the orifice may be changed. This arrangement requires minimal alignment upon installing heads for cleaning. For single clogs and crookeds, a convex lens using incoming collimated UV laser light, with the print head orifice positioned outside the focal point to collect the diverging beam may be used. Since conditioning is substantially line of site, for conditioning beyond the edge of the orifice and into the print head, divergence of the beam beyond the orifice entrance is desirable.




Referring to

FIG. 12

, a system


130


uses a diverging lens


132


and cylindrical lenses


134


,


136


,


138


to expand the beam


131


and expose all of (or a subset of) the orifices


141


of a print head


140


simultaneously. The system is illustrated arranged to illuminate the orifices of an oblique angle. Alternatively, the system can be arranged to illuminate the orifice plate along the axis of the orifices. This system can be used for pre-cleaning or surface cleaning, e.g., to clean heads after assembly and prior to the introduction of ink. This system could also be used in removing varnish from the outer surface of the orifice plate.




Combinations of the systems above can also be used. For example, the systems described in

FIGS. 11 and 12

can be used in combination. The system in

FIG. 12

could be used to clean the orifice plate surface first, followed by a deeper cleaning with the system in FIG.


11


.




In further embodiments, particularly for conditioning well into the orifice plate, a laser assist gas, e.g., Krypton fluorine and/or an argon fluoride laser gas charge can be used to produce radiation at 168 nm. This wavelength of UV creates ozone which would assist in etching back isotropically into organics beyond the orifice opening. Further embodiments include conditioning the ink jet head to smooth surfaces proximate the orifices, even when no contamination is present. The orifices may also be conditioned without prior inspecting or testing. For example, conditioning may occur after a given number of printing operations, without first inspection or testing the orifices. The conditioning system can also be used to clean-off conformal coatings which are vapor deposited over the entire head assembly as part of the manufacturing process. For example, it is.desirable to eliminate parylene, an organic, vapor deposited film from the region right around the orifice, because it has the tendency to shred and make the jets crooked. Before introducing ink, the parylene is removed locally by laser radiation. This enables the benefits of conformal coating as described in Moynihan, U.S. Pat. No. 4,947,184, the entire contents of which is incorporated herein by reference, without the drawbacks of having a fragile film in the nozzle.




Further embodiments are within the following claims.



Claims
  • 1. A method of conditioning an ink jet orifice by removing contaminant material, comprising:providing an ink jet orifice, providing a radiation source comprising a laser, and illuminating said orifice with radiation to remove said contaminant material.
  • 2. The method of claim 1 wherein the radiation is selected to remove organic contaminant material.
  • 3. The method of claim 2 wherein the organic material is selected from the group consisting of ink, polymer, and protein.
  • 4. The method of claim 1 wherein the radiation is selected to smooth regions of said ink jet head proximate the orifice.
  • 5. The method of claim 1 wherein the radiation is provided by an excimer laser.
  • 6. The method of claim 1 wherein said radiation is UV radiation.
  • 7. The method of claim 5 wherein the excimer laser has a wavelength of about 248 nm and a fluence of about 0.3 to about 1.5 Joule/cm2.
  • 8. The method of claim 7 wherein the fluence is about 0.5 Joule/cm2.
  • 9. The method of claim 1 wherein the radiation is focused to a focal point.
  • 10. The method of claim 9 wherein the radiation is selected to remove contamination to a depth inside the orifice no greater than about 15 μm.
  • 11. The method of claim 10 wherein said focal point is inside the orifice.
  • 12. The method of claim 1 wherein the orifice has a width and the radiation has a beam diameter smaller than the width of said orifice.
  • 13. The method of claim 12 wherein the orifice defines an axis therethrough and the radiation impinges said orifice at an angle with respect to the axis of said orifice.
  • 14. The method of claim 1 further comprising using a coolant in proximity with said orifice.
  • 15. The method of claim 14 wherein said coolant is a gas.
  • 16. The method of claim 1 comprising utilizing an ozone-forming gas and radiation at a wavelength selected to form ozone.
  • 17. The method of claim 1 wherein the orifice is in a plate fabricated from metal, polymer, or ceramic.
  • 18. The method of claim 17 wherein the orifice has a diameter of about 70 μm or less.
  • 19. The method of claim 18 wherein the plate has a plurality of orifices separated by about 0.15 inch or less.
  • 20. The method of claim 1 wherein said ink jet orifice is an ink jet orifice for a piezoelectric drop on demand ink jet head.
  • 21. The method of claim 1 comprising:testing the operation of said orifice.
  • 22. The method of claim 21 comprising:testing by jetting a test image.
  • 23. The method of claim 22 comprising:visually inspecting said image.
  • 24. The method of claim 22 comprising:electronically inspecting said image.
  • 25. A system for conditioning an ink jet head including an ink jet orifice by removing contaminant material, comprising:a printing station arranged to permit said print head to print an image on a substrate, and a radiation source comprising a laser arranged to illuminate said orifice to remove said contaminant material.
  • 26. The system of claim 25 wherein the radiation is sufficient to remove organic contaminant material.
  • 27. The system of claim 25 wherein the radiation is sufficient to smooth regions of said ink jet head proximate the orifice.
  • 28. The system of claim 25 wherein the radiation source is an excimer laser.
  • 29. The system of claim 25 further comprising:a testing station arranged to test orifice performance.
  • 30. The system of claim 25 or 29 comprising:a transport arrangement to transport said orifice from the printing station to an illuminating station including said source of radiation.
  • 31. The system of claim 30 wherein said transport arrangement transports said print head between said printing station, testing station, and conditioning station.
  • 32. The method of claim 31 wherein said transport arrangement includes a rail system.
  • 33. A system for conditioning including an ink jet orifice by removing contaminant material, comprising:a testing station arranged to test orifice performance, and a radiation source comprising a laser arranged to illuminate said orifice to remove said contaminant material.
  • 34. The system of claim 33 wherein the radiation is sufficient to remove organic contaminant material.
  • 35. The system of claim 33 wherein the radiation is sufficient to smooth regions of said ink jet head proximate the orifice.
  • 36. The system of claim 33 wherein the radiation source is an excimer laser.
  • 37. The system of claim 33 comprising:a transport arrangement to transport said orifice from the testing station to an illuminating station including said source of radiation.
  • 38. A method of conditioning an ink jet orifice by smoothing regions of an ink jet head proximate the orifice, comprising:providing an ink jet head comprising an ink jet orifice, providing a radiation source comprising a laser, and illuminating said orifice with radiation to smooth regions of said ink jet head.
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