Claims
- 1. An electrically conductive elastomeric ink composition which comprises an elastomeric silicone binder and finely divided nickel particles interspersed therein in an amount from about 25 to about 90 percent by weight based on the weight of the composition, the nickel particles having a size in the range from about 0.05 to about 32 microns.
- 2. The ink of claim 1 whereinthe nickel particles have a size in the range from about 0.1 to about 10 microns.
- 3. The ink of claim 1 wherein the nickel particles have a size in the range from about 0.1 to about 1.0 micron.
- 4. An electrically conductive elastomeric ink composition comprising an addition cured silicone binder and finely divided nickel particles interspersed therein in an amount from about 25 to about 90 percent by weight based on the weight of the composition, the nickel particles having a size in the range from about 0.1 to about 10 microns, the ink being self-adhered to a nonconductive printed circuit board.
- 5. The ink of claim 4 wherein the addition cured silicone binder is formed as a solution by the addition of a solvent.
- 6. The ink of claim 5 wherein the solvent is a high hydrocarbon solvent.
- 7. The ink of claim 6 wherein the solvent is a xylene.
- 8. A printed circuit board comprising conductive traces and contacts, at least one of said traces or contacts being comprised of the ink composition of claim 1.
- 9. The printed circuit board of claim 8 wherein the nickel particles are coated on a carbonaceous particulate substrate.
- 10. The printed circuit board of claim 9 wherein the substrate is comprised of graphite.
- 11. The printed circuit board of claim 9 wherein the binder is formed of an addition cured elastomeric silicone which has undergone linear shrinkage of at least about 3 percent during cure, and the ink composition is self-adhered to the printed circuit board.
- 12. The printed circuit board of claim 9 wherein the binder is formed of an addition cured elastomeric silicone, which has undergone linear shrinkage of at least about 6 percent during cure, and the ink composition being self-adhered to the printed circuit board.
- 13. The printed circuit board of claim 9 wherein a high hydrocarbon solvent is added to the reactive components of the binder prior to addition cure in sufficient quantities so that the solution has a viscosity of form about 50 to about 500 centipoise.
Parent Case Info
This is a division of application Ser. No. 515,823, filed July 18, 1983, now U.S. Pat. No. 4,518,833.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
515823 |
Jul 1983 |
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