Patent Application
20120231248
The present invention relates to a conductive laminate having a conductive layer on a base resin layer. More particularly, the present invention relates to a conductive laminate suitable for an electrode member used in a solar cell module and a display product such as a touch panel, a liquid crystal display, an organic electroluminescence, and an electronic paper.
In recent years, a mobile phone, a game console, and the like, including a touch panel mounted thereon, have been propagated. The touch panel may be fabricated using a conductive material for an electrode. However, with progress of fine point inputting to a touch panel with a pen or the like, a conductive material used for the touch panel needs smooth writing or high input sensitivity, durability, and the like.
A conductive laminate prepared by bonding a non-conductive layer face of a base material (‘substrate’) having a conductive layer stacked on the surface thereof in a dry process with another substrate by inserting an adhesive layer therebetween, is used in a touch panel. The conductive laminate having the adhesive layer has good writing sense and good input sensitivity since the adhesive layer functions as a cushion. However, the conductive layer is stacked by a dry process requiring high operation costs and, further, due to the configuration using multiple substrates, the cost is increasing considerably and, therefore, production may not be achieved at low cost.
For a conductive laminate prepared by providing a cushion layer on a substrate and stacking a resin layer and a conductive layer thereon in this sequence, the resin layer is placed as a base layer required to stack the conductive layer. Thus, even though the conductive laminate was provided with the cushion layer, the cushion layer does not give cushioning effect.
For a conductive laminate prepared by stacking a resin layer, a layer having a smaller thickness than a substrate and different index of refraction, and a conductive layer on the substrate in this sequence, writing sense and input sensitivity are poor even if the layer laminated in plural has a small thickness.
For a conductive laminate prepared by providing a base layer on a substrate and stacking a conductive layer thereon, if the base layer has a considerably smaller thickness than the substrate, the conductive laminate does not give cushioning effect and has poor writing sense and input sensitivity.
A conductive laminate with a base layer including a polyurethane resin is known in related art (see Patent Literature 1). The conductive laminate with a base layer including a polyurethane resin lacks cushioning effect of the base layer and has poor writing sense and input sensitivity.
A conductive laminate with a base layer including a urethane acrylate resin is known in related art (see Patent Literature 2). The conductive laminate with a base layer including a urethane acrylate resin lacks cushioning effect of the base layer and has poor writing sense and input sensitivity.
A conductive laminate with a base layer including a urethane acrylate resin having a glycol skeleton is known in related art (see Patent Literature 3). The base layer including only the urethane acrylate resin has insufficient hydrophilic property on the surface thereof. Specifically, a conductive layer containing a conductive component, that includes a moisture-containing composition, may incur unevenness and/or defect when it is stacked on a base resin layer, deteriorate external appearance of a conductive laminate, cause poor surface conductivity in turn entailing poor input sensitivity.
An embodiment of the present invention is to provide a conductive laminate that can improve in writing sense and input sensitivity of a touch panel and, in addition, that can provide with favorable durability.
An embodiment of the present invention provides a conductive laminate comprising a base resin layer and a conductive layer on at least one surface of a substrate, by stacking in the sequential order of the base resin layer and the conductive layer from the substrate side, in which the base resin comprises a resin including; a urethane acrylate resin having a glycol skeleton in the structure of the resin, and a grafted resin having a hydrophilic group among side chains thereof.
Additionally, an embodiment of the present invention provides a method of producing a conductive laminate, comprising; forming a base resin layer on a substrate, and then, forming a conductive layer on the base resin layer, in which the base resin comprises a urethane acrylate resin having a glycol skeleton and a grafted resin having a hydrophilic group among side chains.
A touch panel using embodiments of the conductive laminate of the present invention is smooth in writing, and has high input sensitivity and favorable durability.
Moreover, embodiments of the conductive laminate of the present invention can be preferably used in electrode members, which are applicable in association with display products such as a liquid crystal display, an organic electroluminescence, or an electronic paper, as well as a solar cell module.
Hereinafter, embodiments of the present invention will be described in detail.
An embodiment of a conductive laminate of the present invention is a conductive laminate comprising a base resin layer and a conductive layer on at least one surface of a substrate, by stacking in the sequential order of the base resin layer and the conductive layer from the substrate side, in which the base resin comprises a resin including; a urethane acrylate resin having a glycol skeleton in the structure of the resin, and a grafted resin having a hydrophilic group among side chains thereof.
The substrate used in embodiments of the conductive laminate of the present invention is preferably a base material having a high total luminous transmittance and, more preferably, a transparent substrate. Further, the substrate may be a base material having a total luminous transmittance of 801 or more, based on JIS K7361-1 (1997) and, more preferably, a base material having transparency of 90% or more.
The substrate used in embodiments of the conductive laminate of the present invention is preferably a resin or glass. The substrate can be selected from most preferable ones in terms of transparency, durability, flexibility, or cost according to its use.
If the substrate is a glass, a soda glass commonly known in the art may be used. Examples of resins may include polyester such as polyethylene terephthalate and polyethylene naphthalate, polyamide, polyimide, polyphenylene sulfide, aramid, polypropylene, polyethylene, polylactate, polyvinyl chloride, polycarbonate, polymethyl methacrylate, alicyclic acryl resin, cyclo-olefin resin, triacetyl cellulose, a mixture of the resins and/or copolymer thereof. In particular, polyethylene terephthalate is preferably used.
The substrate may be a film or a base plate. The resin may be a uniaxially or biaxially stretched film. The substrate is preferably a film having a thickness of 250 μm or less in views of cost, productivity, easy handling, or the like. More preferably, a film having a thickness of 190 μm or less, further preferably, a film having a thickness of 150 nm or less, may be used in the substrate.
The substrate may be a single layer substrate or a combined multilayer substrate with a plurality of substrates stacked in order. For instance, a combined substrate of resin and glass, a combined substrate of two or more resins, or the like, may be used.
The substrate may be subjected to surface treatment, as required. For instance, physical treatment such as glow discharge, corona discharge, plasma treatment, and flame treatment may be executed or, otherwise, the substrate may be provided with a resin layer. In the case where the substrate is a film, a film having an easy-adhesive layer may be used.
An embodiment of the conductive laminate of the present invention comprises a base resin layer on at least one surface of a substrate, in which the base resin comprises a resin including; a urethane acrylate resin having a glycol skeleton in the structure of the resin, and a grafted resin having a hydrophilic group among side chains thereof. If a base resin layer is not provided, writing sense and input sensitivity are not enhanced and durability is deteriorated even where the conductive laminate is assembled into a touch panel.
The base resin layer in an embodiment of the conductive laminate of the present invention comprises a urethane acrylate resin having a glycol skeleton. Such a urethane acrylate resin is a resin having a urethane structure formed by reaction between a polyol and a multi-functional isocyanate, in which the reaction product has an acrylate end in its structure. The urethane acrylate resin is prepared by a preparation method including, for example; reacting a polyol having two or more hydroxyl groups in its molecular structure, such as diol, with an aliphatic, aromatic or alicyclic multi-functional isocyanate having two or more isocyanate groups in its molecular structure, such as diisocyanate; and then, reacting an end of a structure of the reaction product with an acrylate having a hydroxyl group in its molecular structure (‘hydroxyl-functional acrylate’) to seal the end of the structure.
The urethane acrylate resin contained in the base resin layer according to an embodiment of the present invention comprises a glycol skeleton. If the urethane acrylate resin without a glycol skeleton is used as a touch panel, writing sense and input sensitivity of the touch panel are not improved and durability is deteriorated.
Examples of the glycol skeleton may include an ethyleneglycol skeleton, a propyleneglycol skeleton, a diethyleneglycol skeleton, a butanediol skeleton, a hexanediol skeleton, a 1,4-cyclohexanedimethanol skeleton, a glycolic acid skeleton, a polyglycolic acid skeleton, and the like.
The glycol skeleton is preferably a polyethyleneglycol skeleton and/or polypropyleneglycol skeleton. Polyethyleneglycol and polypropyleneglycol are high molecular weight compounds prepared by polymerizing ethyleneglycol and propyleneglycol, respectively. Owing to a long-extended and combined linear structure, the above material becomes a more flexible urethane acrylate resin when it is coupled to the skeleton of the urethane acrylate resin, to thereby easily further improve writing sense and input sensitivity of the touch panel.
As described above, the urethane acrylate having a glycol skeleton may include, any one selected from, for example, Art Resin UN Series products (trade name, manufactured by Negami Chemical Industrial Co., Ltd.).
The urethane acrylate resin having the glycol skeleton may be prepared as a single unit or a combination of two or more thereof and contained in the base resin layer or, otherwise, such glycol skeletons may be reacted together in advance to couple the same into the skeleton of the urethane acrylate resin, thereby preparing an urethane acrylate resin, which has two or more glycol skeletons in the same structure, and rendering the same to be contained in the base resin layer.
According to an embodiment of the present invention, a urethane acrylate resin having a polyethyleneglycol skeleton and/or polypropyleneglycol skeleton is preferably contained as a single unit or a mixture in the base resin layer. Further, preferably, copolymerizing a polyethyleneglycol skeleton with a polypropyleneglycol skeleton in advance may couple the same into the skeleton of the urethane acrylate resin, to thereby prepare a urethane acrylate resin, which has both the polyethyleneglycol skeleton and the polypropyleneglycol skeleton in the same structure, and render the same to be contained in the base resin layer. If the urethane acrylate resin including the polyethyleneglycol skeleton or the polypropyleneglycol skeleton is used as a touch panel, functional effects of more improving writing sense and input sensitivity of the touch panel can be sufficiently attained.
If the base resin layer includes a urethane acrylate resin having a glycol skeleton, writing sense and input sensitivity of a touch panel are enhanced and favorable durability is obtained.
The urethane acrylate resin may include a polyol part as a flexible skeleton and an acrylate part as a rigid skeleton. Specifically, the glycol skeleton is incorporated into the polyol part, on the basis of the following two aspects in which:
(1) a molecular structure has high linearity; and
(2) since oxygen in the molecular structure is not condensed by any element (for example, hydrogen) other than carbon and does not accept space hindering by a sterically hindered element other than carbon, a free space around oxygen is enlarged. It is presumed from the above results that more flexible urethane acrylate resin may be obtained. Accordingly, it is considerable that adding the urethane acrylate resin having the glycol skeleton to a base resin layer may render the base resin layer to be easily deformed by load applied when inputting with a pen or a finger. Meanwhile, it is considerable that the acrylate part is rigid and, hence, acts against deformation and functions to rapidly return to its original condition during load opening. As a result thereof, it is presumed that the base resin layer exhibits cushioning effect to the load applied by inputting, to thereby achieve favorable writing sense. However, the present invention is not particularly limited to the presumption.
Regarding the urethane acrylate resin, the number of functional groups at an acrylate part in one urethane acrylate molecule is preferably 2. Since rigidity may be easily endowed to the acrylate part, the urethane acrylate resin may be liable to be rigid if multi-functional groups having tri-functional groups or more are present in one urethane acrylate molecule. Further, since cushioning effects of the base resin layer are occasionally reduced, it may require control on an increase in thickness of the base resin layer and the like, to improve writing sense and input sensitivity of the touch panel.
On the other hand, if the number of functional groups in the acrylate part is 2, a ratio of the acrylate part present in one urethane acrylate molecule, that is, the rigid part is small and, hence, a urethane acrylate resin to be obtained may be more flexible and cushioning effects of the base resin layer may be further increased. Consequently, it is easy to highly enhance writing sense and input sensitivity of the touch panel.
The number of functional groups in the acrylate part may be adjusted to the number of isocyanate functional groups of any aliphatic, aromatic and/or alicyclic multi-functional isocyanate used in synthesizing the urethane acrylate resin. Further, kinds or types of the acrylate part may include, for example, acrylate, methacrylate, or the like.
More particularly, as the di-functional urethane acrylate, any product selected from, for example, Art Resin, UN series (trade name, manufactured by Negami Chemical Industrial Co. Ltd.) may be used.
For the urethane acrylate resin used in embodiment of the present invention, it is preferable to combine an acrylate part with the other acrylate part through polymerization. When the acrylate part is combined with the other acrylate part, durability may be further enhanced. Methods of combining such acrylate parts may include, for example; adding a urethane acrylate resin as well as a photo-polymerization initiator known in the art into a base resin layer, and then, irradiating the mixture with active electron beam such as UV light, visible light, or electron beam, to react the same. The photo-polymerization initiator refers to a material that absorbs light in UV region, light in visible region, electron beam, or the like, generates active species such as radical species, cation species, and anion species, and hence initiates polymerization of a resin. As particular examples of the photo-polymerization initiator, any products selected from Ciba (registered trademark) IRAGACURE (registered trademark) series (manufactured by Ciba Japan Co. Ltd.) may be used. The photo-polymerization initiator may be used alone or, otherwise, in combination of two or more thereof.
With regard to the combination of acrylate parts according to embodiments of the present invention, if the urethane acrylate resin contained in the base resin layer is one type alone, the same acrylate parts in the urethane acrylate resin may be combined. If the base resin layer includes two types or more of urethane acrylate resins, the same urethane acrylates or different urethane acrylate resins may be combined. Further, in the case where a component containing an acrylate part except the urethane acrylate resin is included in the base resin layer, the urethane acrylate resin may be combined with the component containing the acrylate part except the urethane acrylate resin.
Content of the urethane acrylate resin in the base resin layer may be 10% or more by weight, preferably, 15% or more by weight, more preferably, 20% or more by weight, particularly preferably, 50% or more by weight, and most preferably, 80% or more by weight, in relation to a total weight of the base resin layer.
The base resin of the conductive laminate according to embodiments of the present invention comprises a grafted resin having a hydrophilic group in a side chain.
The grafted resin in embodiments of the present invention refers to a block polymerized resin and a structure thereof, as illustrated in
According to embodiments of the present invention, if a graft-structural resin having a hydrophilic group in a side chain is included in the base resin layer, the surface of the base resin layer is modified and hence become to render a water-dispersed coating solution containing conductive components to be easily and homogeneously applied, without repelling the solution. Consequently, writing sense and input sensitivity is enhanced, thus enabling the supply of conductive laminates having favorable appearance and quality with high productivity. Alternatively, in the case in which the graft-structural resin having a hydrophilic group in a side chain is not included in the base resin layer, due to failures such as unevenness or defect after preparing a conductive laminate, writing sense and input sensitivity cannot be improved.
For the grafted resin used in embodiments of the present invention, the hydrophilic group may include, for example; a hydroxyl group (—OH), a carboxyl group (—COOH), a sulphonic acid group (—SO3H), a phosphoric acid group (H2PO4—), an amino group (—NH2), or the like. The grafted resin includes a hydrophilic group in which H+ in the hydrophilic group may be in a state partially including a counter-cation such as Na+ and K+ (that is, —ONa, —COONa, and —SO3Na). Meanwhile, such a hydrophilic group may be present alone, or two or more thereof may be present in a branched side chain. As the grafted resin, a copolymer and/or mixture of two grafted resins having different hydrophilic groups may be used.
More particularly, the grafted resin having a hydrophilic group in a side chain as described above may include, for example; CHEMTREE (registered trademark) series L-20, L-40M, LH-448, or the like (manufactured by Soken Chemical and Engineering Co. Ltd.).
The network polymer in the grafted resin used in embodiments of the present invention may include, for example, polyester resin such as polyethylene terephthalate and polyethylene naphthalate, polycarbonate resin, polyurethane resin, acryl resin, methacryl resin, epoxy resin, polyamide resin, polyimide resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl acetate resin, nylon resin, melamine resin, phenol resin, fluorine resin, and the like. The grafted resin may be used alone or as a copolymer and/or mixture of two or more thereof. In addition, according to its use, the grafted resin may include a partial cross-linking structure.
The network polymer of the grafted resin preferably includes a functional group. More preferably, a functional group with reactive properties to form a composite with resins or components contained in the base resin layer, respectively, a functional group compatible with an organic solvent or water, and the like, are present in the network polymer.
The functional group of the network polymer in the grafted resin may include, for example: a linear alkyl group; a branched alkyl group; a cycloalkyl group; an alkenyl group such as vinyl, aryl, and hexenyl; an aryl group such as phenyl, tollyl, xylyl, styryl, naphthyl, and biphenyl; an aralkyl group such as benzyl and phenetyl; other aromatic groups having heterocyclic rings or their ring-open groups such as lactone, oxazole, and imidazole; an alkoxy group such as methoxy, ethoxy, and isopropoxy; an acetoxy group; an acryl group; a methacryl group; an acryloxy group; a methacryloxy group; an oxycarbonyl group such as aryloxycarbonyl and benzyloxycarbonyl; an epoxy group; an isocyanate group; a hydroxyl group; a carboxyl group; a sulfur group; a phosphoric acid group; an amino group; a sulfur-containing functional group such as mercapto and sulfide; a nitrogen-containing functional group such as ureido and ketimino; a halogen-containing functional group such as fluoroalkyl. Among the functional groups, hydrophilic groups such as the hydroxyl group, carboxyl group, sulfur group, phosphoric acid group, and amino group, may be preferably used. The functional group of the network polymer in the grafted resin may include at least one randomly selected and used on the basis of use or required characteristics thereof or a mixture of two or more thereof, without being particularly limited to the foregoing.
The grafted resin contained in the base resin layer may be present in any form in the base resin layer. In other words, the grafted resin may be contained in a simply mixed state or present as a material having a combination with the urethane acrylate resin or other components in the base resin layer.
A content of the grafted resin may range from 5% to 90% by weight and, preferably, 10% to 80% by weight, in relation to a total weight of the base resin layer. If it is less than 5% by weight, effects of modifying the surface of the base resin layer may be slight. On the other hand, when the content is more than 90% by weight, a touch panel may occasionally attain only a little improvement in writing sense and input sensitivity, depending upon type or structure of the urethane acrylate resin or bonding form thereof.
In the conductive laminate of embodiments of the present invention, a thickness ‘T’ of the substrate and a thickness ‘t’ of the base resin layer preferably satisfy the following equations.
0.040≦t/T≦0.080
If the conductive laminate, in which the thickness T of the substrate and the thickness t of the base resin layer have satisfied the above equation, is assembled into the touch panel, the base resin layer may be easily deformed with high efficiency by the load applied when inputting with a pen or finger, to hence render the touch panel to have more improved writing sense and input sensitivity. The t/T value preferably ranges from 0.050 to 0.70.
The conductive laminate of embodiments of the present invention comprises stacking a base resin layer and a conductive layer, in sequential order of the base resin layer and the conductive layer from the substrate side. If the conductive layer is not contained, conductive properties are not exhibited.
According to embodiments of the present invention, the component in the conductive layer preferably has a linear structure. Such a linear structure according to embodiments of the present invention refers to a structure having a ratio of the length of a short axis to the length of a long axis, that is, an aspect ratio (=the length of a long axis/the length of a short axis) of more than 1 (on the other hand, for example, a spherical form has an aspect ratio=1). The linear structure may include, for example; a fiber-shaped conductor, a needle-shaped conductor such as whisker. The length of the short axis may range from 1 nm to 1,000 nm (1 μm). Further, the length of the long axis may be a length in which an aspect ratio the length of the long axis/the length of the short axis) may be more than 1, in relation to the length of the short axis. If the length of the long axis ranges from 1 μm to 100 μm (0.1 mm), both of optical feature and conductive property may be compatible with each other, thus being preferable.
The linear structure may be used alone, or in combination of plural structures as a mixture. Moreover, alternative micro to nano-sized conductive materials may be added thereto, as required.
The fiber-shaped conductor may include a carbon-based fiber conductor, a metal-based fiber conductor, a metal oxide-based fiber conductor, or the like. The carbon-based fiber conductor may include polyacrylonitrile-based carbon fibers, pitch-based carbon fibers, rayon-based carbon fibers, glass-shaped carbon, carbon nanotube, carbon nanocoil, carbon nanowire, carbon nanofiber, carbon whisker, graphite fibril, and the like. The metal-based fiber conductor may include fiber-shaped or nanowire-shaped metals or alloys thereof, which are prepared by using, for example; gold, platinum, silver, nickel, silicon, stainless steel, copper, brass, aluminum, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, manganese, technetium, rhenium, iron, osmium, cobalt, zinc, scandium, boron, gallium, indium, silicon (silicium), germanium, tin, magnesium, or the like. The metal oxide-based fiber conductor may include fiber-shaped or nanowire-shaped metal oxides and/or metal oxide composites, which are prepared by using InO2, InO2Sn, SnO2, ZnO, SnO2—Sb2O4, SnO2—V2O5, TiO2(Sn/Sb)O2, SiO2(Sn/Sb)O2, K2O-nTiO2—(Sn/Sb)O2, K2O-nTiO2—C, and the like. The fiber-shaped conductor may also be subjected to surface treatment.
The fiber-shaped conductor may further include a material prepared by coating or vapor-depositing the surface of a non-metal material such as a plant fiber, a synthetic fiber, or an inorganic fibers with, for example; gold, platinum, silver, nickel, silicon, stainless steel, copper, brass, aluminum, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, manganese, technetium, rhenium, iron, osmium, cobalt, zinc, scandium, boron, gallium, indium, silicon, germanium, tin, magnesium, InO2, InO2Sn, SnO2, ZnO, SnO2—Sb2O4, SnO2—V2O5, TiO2(Sn/Sb)O2, SiO2(Sn/Sb)O2, K2O-nTiO2—(Sn/Sb)O2, K2O-nTiO2—C, or carbon nanotubes.
The conductive laminate of embodiments of the present invention preferably uses carbon nanotubes as the fiber-shaped conductor, in view of optical properties such as transparency and conductivity.
In this regard, the following description will be given of explaining the carbon nanotube. According to embodiments of the present invention, the carbon nanotube used in the component of the conductive layer may be any one among a single-layer carbon nanotube, a double-layer carbon nanotube, triple-layer or more carbon nanotubes. The nanotube is preferably one having a diameter ranging from 0.3 to 100 nm and a length ranging from about 0.1 to 20 μm. In order to increase the transparency of the conductive laminate while reducing a surface resistivity thereof, a single-layer carbon nanotube or double-layer carbon nanotube having a diameter of 10 nm or less and a length in the range of 1 to 10 μm is more preferably used.
It is preferable that a carbon nanotube assembly contains as few impurities as possible such as amorphous carbon or catalyst metals. If such impurities are contained in the carbon nanotube, purification may be suitably executed by acid treatment or heating.
The carbon nanotube may be synthesized and produced through arc discharge, laser ablation, catalytic chemical vapor deposition (a method that uses a catalyst including a carrier and a transition metal supported thereby, among chemical vapor deposition methods), or the like. According to the catalytic chemical vapor deposition having excellent productivity and decreasing generation of impurities such as amorphous carbon, carbon nanotubes may be preferably prepared.
According to embodiments of the present invention, carbon nanotube dispersion may be applied to form a conductive layer. The carbon nanotube dispersion is generally prepared by dispersing carbon nanotubes as well as a solvent through a mixer or an ultrasonic irradiation apparatus. Furthermore, any dispersant is preferably added thereto.
Such a dispersant may be selected from natural polymers and synthetic polymers, in aspects of: adhesiveness to a substrate of a conductive layer containing carbon nanotubes, which are prepared by applying carbon nanotube dispersion to the substrate and drying the same; film hardness; scratch resistance. Further, a cross-linking agent may also be added thereto, without departing from a range in which dispersibility is not deteriorated.
The synthetic polymer may include, for example; polyetherdiol, polyesterdiol, polycarbonatediol, polyvinyl alchol, partially-saponified polyvinyl alcohol, acetoacetyl group-modified polyvinyl alcohol, acetal group-modified polyvinyl alcohol, butyral group-modified polyvinyl alcohol, silanol group-modified polyvinyl alcohol, ethylene vinyl alcohol copolymer, ethylene vinyl alcohol-vinyl acetate copolymer resin, dimethylamino ethyl acrylate, dimethylamino ethyl methacrylate, acryl resin, epoxy resin, modified epoxy resin, phenoxy resin, modified phenoxy resin, phenoxy ether resin, phenoxy ester resin, fluorine resin, melamine resin, alkyd resin, phenol resin, polyacrylamide, polyacrylic acid, polysthylene sulfonic acid, polyethyleneglycol, polyvinyl pyrrolidone, and the like. The natural polymers may be selected from, for example; polysaccharides such as starch, pullulan, dextran, dextrin, guar-gum, xanthan gum, amylose, amylopectin, alginic acid, Arabic gum, carageenan, chondroitin sulfate, hyaluronic acid, curdlan, chitin, chitosan, cellulose, and derivatives thereof. The derivative may refer to a compound known in the art such as ester and ether. The foregoing materials may be used alone or as a mixture of two or more thereof. Among those, polysaccharides and their derivatives are preferably used since they have excellent dispersible properties in relation to carbon nanotubes. In addition, cellulose and its derivatives have high film formation ability, thus being preferable. Among those, ester or ether derivatives are more preferably used. In particular, carboxymethyl cellulose or salts thereof are suitably used.
Moreover, a mixing ratio of the carbon nanotubes and the dispersant is adjustable. The mixing ratio between the carbon nanotubes and the dispersant is preferably determined within a range in which it does not incur problems in adhesiveness to a substrate, hardness, scratch resistance, or the like. More particularly, the carbon nanotubes are preferably present in the range of 10 through 90% by weight in relation to a total weight of the conductive layer. More preferably, the carbon nanotubes are contained in the range of 30 to 70% by weight. If an amount of the carbon nanotubes is 10% or more by weight, conductivity required for a touch panel may be easily attained. In addition, when applying the above carbon nanotubes to the surface of a substrate, it may be easily and homogeneously applied thereto without repelling. Moreover, a conductive laminate with favorable external appearance and quality may be supplied with high conductivity. When the amount of carbon nanotubes is 90% or less by weight, the carbon nanotubes may have good dispersibility in a solvent and a difficulty in aggregation, and may easily form a favorable carbon nanotube coating layer and attain high conductivity, thereby being preferable. Furthermore, a coating film may be rigid and hence hardly incur scratch defects in the manufacturing process, and may uniformly retain surface resistance, thereby being preferable.
The needle-shaped conductor may include a compound including a metal, carbon compound, metal compound, or the like. The metal may include, for example, elements belonging in Group IIA, IIIA, IVA, VA, VIA, VIIA, VIII, IB, IIB, IIIB, IVB or VB in the standard periodic table of chemical elements. More particular examples are gold, platinum, silver, nickel, stainless steel, copper, brass, aluminum, gallium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, manganese, antimony, palladium, bismuth, technetium, rhenium, iron, osmium, cobalt, zinc, scandium, boron, gallium, indium, silicon, germanium, tellurium, tin, magnesium, and alloys containing the same. The carbon compound may include carbon nanohorn, fullerene, graphene, and the like. The metal oxide may include InO2, InO2Sn, SnO2, ZnO, SnO2—Sb2O4, SnO2—V2O5, TiO2(Sn/Sb)O2, SiO2(Sn/Sb)O2, K2O-nTiO2(Sn/Sb)O2, K2O-nTiO2—C, and the like.
The conductive laminate of embodiments of the present invention preferably includes silver nanowires as a needle-shaped conductor, in view of optical properties such as transparency and conductivity.
The needle-shaped conductor may include, for example: composite compounds of potassium titanate fibers, tin, and antimony oxides, that is, WK200B, WK300R, WK500 among DENTALL WK Series (manufactured by Otsuka Chemical Co. Ltd.); composite compounds of silicon dioxide fibers, tin, and antimony oxides, that is, TM100 or the like among DENTALL TM Series (manufactured by Otsuka Chemical Co. Ltd.), all of which are commercially available in the market.
The conductive laminate of embodiments of the present invention preferably has a surface resistivity at the conductive layer side which is 1×100Ω/□ or more, and 1×104Ω/□ or less, more preferably, 1×101Ω/□ or more 1.5×103. Since the surface resistivity is present in the range of 1×100Ω/□ or more and 1×104Ω/□ or less, the foregoing laminate is preferably used as a conductive laminate for a touch panel. That is, when it is equal to or more than 1×100Ω/□, power consumption may be decreased. Further, with 1×104Ω/□ or less, it is possible to reduce influence of errors occurring in reading coordinates of the touch panel.
Simultaneous with modification of the base resin layer, the conductive layer stacked thereon may also be modified. Since the conductive layer is modified, an area of a contact face contributing to conduction of current by such modified conductive layer may be increased and, as a result, a total flow rate of current is increased even when a small input load is applied, and hence is presumed that input sensitivity may become excellent. However, the present invention is not particularly limited to the above presumption.
The conductive laminate of embodiments of the present invention is preferably a transparent conductive laminate having a total luminous transmittance of 801 or more, on the basis of JIS K7361-1 (1997) when the light is incident at the conductive layer side, as described above. If the conductive laminate of embodiments of the present invention, which is a transparent conductive laminate, is assembled into a touch panel, the touch panel may exhibit not only favorable writing sense and input sensitivity but also excellent transparency. Further, it is possible to clearly recognize indications on a display mounted on a bottom layer of the touch panel including such a transparent conductive laminate. Transparency described in the present invention may refer to a total luminous transmittance of 80%, or more, on the basis of JIS K7361-1 (1997) when the light is incident at the conductive layer side, as described above. The total luminous transmittance is preferably 85% or more and, more preferably, 90% or more. Methods of increasing the total luminous transmittance may include, for example; increasing the total luminous transmittance of a substrate to be used, considerably decreasing a film thickness of the conductive layer, a method of stacking a transparent protection layer to function as a light interference film, further above the conductive layer provided on the base resin layer, and the like. The method of increasing the total luminous transmittance may include a method of decreasing a thickness of the substrate or a method of selecting a substrate made of materials having high total luminous transmittance.
The conductive laminate of embodiments of the present invention is preferably fabricated by a process to form a conductive layer on a base resin layer, after the base resin layer is formed on a substrate, in which the base resin layer includes a urethane acrylate resin having a glycol skeleton and a grafted resin having a hydrophilic group in a side chain. More preferably, the conductive laminate of embodiments of the present invention may include a conductive layer formed by applying water dispersion including carbon nanotubes or silver nanowires and drying the same.
The substrate and/or individual layers used in embodiments of the present invention may further include a variety of additives without departing from a range in which effects of the present invention are not inhibited. As the additives, for example, organic and/or inorganic micro-particles, a cross-linking agent, flame retardant, a flame retardant support, a heat resistant stabilizer, an anti-oxidant stabilizer, a leveling agent, an slipping enhancer, a conducting agent, an anti-static agent, UV absorber, a light stabilizer, a nucleating agent, dye, filler, a dispersant, and a coupling agent, and the like, may be used.
The conductive laminate of embodiments of the present invention may preferably include a protection layer formed on a conductive layer.
The conductive layer reflects or absorbs light by physical properties of a conductive component itself. Therefore, in order to improve a total luminous transmittance of a transparent conductive laminate including the conductive layer provided on a substrate, a transparent protection layer is provided on the conductive layer, in which the transparent protection layer is prepared of a transparent material to form an optical interference film, and hence, a mean reflectance at a wavelength in the range of 380 to 780 nm at the optical interference film is preferably decreased to 4% or less. The wavelength in the range of 380 to 780 nm at the optical interference film side is preferably 3% or less and, more preferably, 2% or less. If the mean reflectance is 4% or less, a total luminous transmittance of 80% or more may be obtained with high productivity when the conductive laminate is used for a touch panel or the like, thus being preferable. Further, if the transparent protection layer is present, interference fringe occurring due to interference of reflected light between top and bottom of the touch panel illustrated in
In the conductive laminate of embodiments of the present invention, the transparent protection layer, which forms an optical interference film on the conductive layer, is more preferably a transparent protection film that concurrently functions to improve scratch-resistance of the conductive layer and prevent the conductive component from escaping, in addition to the role of optical interference.
In order to decrease the mean reflectance, the transparent protection layer preferably has a lower refractive index than that of the conductive layer. More particularly, the transparent protection layer is preferably used if a difference of its reflective index to the refractive index of the conductive layer is 0.3 or more and, more preferably, 0.4 or more. With regard to the reflective index of the transparent protection layer, when the difference in refractive indexes is 0.3 or more, a control range to render the mean reflectance of the transparent protection layer to 4% or less may be extended and a manufacturing process margin may also be enlarged, thus being preferable.
The transparent protection layer may include an inorganic compound, an organic compound, and a composite of inorganic and organic compounds and, hence, may include a configuration having hollow therein. Examples of a single compound may include: inorganic compounds such as silicon oxide, magnesium fluoride, cerium fluoride, lanthanum fluoride, and calcium fluoride; and organic compounds such as polymer containing silicon or fluorine; or the like. Examples of the composite may include a mixture of: micro-particles having hollow therein, such as silica and acryl; and mono-functional or multi-functional (meth) acrylic acid ester, a siloxane compound, and/or a polymer prepared by polymerization of a monomer component in an organic compound having a perfluoroalkyl group.
Particular examples of the silicon oxide may include: tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-i-propoxysilane, tetra-n-butoxysilane; trialkoxysilanes such as methyl trimethoxysilane, methyl triethoxylsilane, ethyl trimethoxysilane, ethyl triethoxysilane, n-propyl trimethoxysilane, n-propyl triethoxylsilane, i-propyl trimethoxysilane, i-propyl triethoxysilane, n-butyl trimethoxysilane, n-butyl triethoxylsilane, n-pentyl trimethoxysilane, n-pentyl triethoxysilane, n-hexyl trimethoxysilane, n-heptyl trimethoxylsilane, n-octyl trimethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane, cyclohexyl trimethoxysilane, cyclohexyl triethoxysilane, phenyl trimethoxysilane, phenyl triethoxysilane, N-(2-aminoethyl)-3-aminopropyl trimethoxysilane, N-(2-aminoethyl)-3-aminopropyl triethoxysilane, 3-chloropropyl trimethoxysilane, 3-chloropropyl triethoxysilane, 3,3,3-trifluoropropyl trimethoxysilane, 3,3,3-trifluoropropyl triethoxysilane, 3-aminopropyl trimethoxysilane, 3-aminopropyl triethoxysilane, 2-hydroxyethyl trimethoxysilane, 2-hydroxyethyl triethoxysilane, 2-hydroxypropyl trimethoxysilane, 2-hydroxypropyl triethoxysilane, 3-hydroxypropyl trimethoxysilane, 3-hydroxypropyl triethoxysilane, 3-mercaptopropyl trimethoxysilane, 3-mercaptopropyl triethoxysilane, 3-isocyanatopropyl trimethoxysilane, 3-isocyanatorpropyl triethoxysilane, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl triethoxysilane, 2-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, 2-(3,4-epoxycylcohexyl)ethyl triethoxysilane, 3-(meth)acryloxypropyl trimethoxysilane, 3-(meth)acryloxypropyl triethoxysilane, 3-ureidopropyl trimethoxysilane, 3-ureidopropyl triethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane, aryl trimethoxysilane, vinyl triacetoxysilane; organo-alkoxysilanes such as methyl triacetyloxysilane and methyl triphenoxysilane, in which the silicon oxide is introduced in any of various solvents such as alcohol, water, and acid, and hydrolyzed to prepare a coating solution. Polymerizing the coating solution may result in a coating layer such as a sol-gel coating layer or, otherwise, a deposition layer or sputtered layer of the silicon oxide may also be used.
The composite using silica micro-particles having hollow therein may include, in particular, OPSTER (registered trademark) TU-2180 (manufactured by JSR Corporation).
As methods of forming the base resin layer, the conductive layer, and the transparent protection layer on the conductive layer according to embodiments of the present invention, the optimum method may be selected depending upon the material produced therefrom, and general methods such as dry methods such as vacuum deposition, EB deposition, sputtering; wet-coating methods such as casting, spin coating, dip coating, bar coating, spray, blade coating, slit-die coating, gravure coating, reverse coating, screen printing, mold coating, print transfer, and ink-jet may be employed. Among these, slit-die coating which can uniformly laminate the base resin layer, conductive layer and transparent protection layer while hardly incurring scars on the conductive layer or, otherwise, a wet coating process using a micro-gravure to uniformly form each of the base resin layer, conductive layer and transparent protection layer with high productivity, may be preferably used. The conductive laminate of embodiments of the present invention is preferably fabricated by a method that forms the transparent protection layer in more preferable form on the conductive layer.
Next, the following description will be given of explaining a touch panel according to embodiments of the present invention.
The resistive film type touch panel illustrated in
Hereinafter, embodiments of the present invention will be concretely described on the basis of the following examples. Assessment methods used in respective examples and comparative examples are described below.
(1) Identification of Bonding States and Structures of Individual Layers
First, a sample was immersed in a solvent to delaminate and extract respective layers and the used solvent was filtered after the immersion. If a filtrate is present, a solvent having a high solubility in relation to the filtrate was selected and the filtrate was dissolved again in the solvent. Next, after adopting any separable method among typical chromatography techniques, which are representative of; silica gel column chromatography, gel permeation chromatography, liquid high performance chromatography, gas chromatography, or the like, the filtrate and the re-dissolved filtrate solution were separated and purified into single materials, respectively. In the case where these materials are combined with other components and entail difficulties in separation, they were used directly.
Thereafter, each of the materials was suitably concentrated and/or diluted and structural identification was executed by any method suitably selected from nuclear magnetic resonance spectroscopy (1H-NMR, 13C-NMR), two-dimensional nuclear magnetic resonance spectroscopy (2D-NMR), infrared spectro-photometry (IR), Raman spectroscopy, mass spectrometry (Mass), X-ray diffraction (XRD), neutron diffraction (ND), low-energy electron diffraction (LEED), reflection high-energy electron diffraction (RHEED), atomic absorption spectrometry (AAS), UV photo-electron spectroscopy (UPS), X-ray photo-electron spectroscopy (XPS), X-ray fluorescence analysis (XRF), inductively coupled plasma-atomic emission spectroscopy (ICP-AES), electron probe micro-analyzer (EPMA), gel permeation chromatography (GPC), and other elementary analysis methods, and/or in combination with two or more thereof.
(2) Surface Resistivity Ro
With regard to surface resistance at the conductive layer side, the center part of a sample with a size of 100 mm×50 mm was measured by means of a low resistivity meter Loresta-EP MCP-T36P (manufactured by Mitsubishi Chemical Corporation) using a four point probe method. The mean of the measured values of five (5) samples was calculated and the calculated value was defined as ‘surface resistivity R0’.
(3) Durability
Each of the samples in the above (2) was heated in a constant-temperature over equipped with a safe door, that is, safety oven (trade name: SPHH-201, manufactured by Espec Corp.) at 150° C. for 1 hour, followed by measurement of surface resistivity R at the same position again, according to the same procedures as described in the above (2) and calculation of R/R0 (R0 was determined in the above (2)). The same procedures were implemented for five samples and the mean of the calculated R/R0 values was defined as an increase rate of the surface resistivity and used as an indication of durability. The foregoing results were assessed on the basis of the following standards of assessment.
Grade A: R/R0≦1.5
Grade B: 1.5<R/R0≦1.8
Grade C: R/R0>1.8
Herein, if the sample ranks Grade A or B, it is considered to satisfy the standards and Grade A is most preferable.
(4) Thickness T of Substrate, Thickness t of Base Resin Layer
Each sample was cut off in a direction perpendicular to a plane of the sample, using a rotary microtome with a knife slope angle of 3° (manufactured by Nihon Microtome Laboratory Co. Ltd.). The cut side of the prepared sample piece was observed by a scanning electron microscope ABT-32 (manufactured by TOPCON Corporation) in which three magnifications were any ones selected from the observation magnification ranging from 2,500 to 10,000 times, image contrast was suitably adjusted, and the sample was observed at each of the selected magnifications. Based on the obtained photographs of the cut face, five positions corresponding to each of the substrate and the base resin layer, were measured at each of any three magnifications, same as described above (calculated at a high magnification). The mean values of the calculated values at total 15 positions were defined as thicknesses T and t, respectively (corresponding to the substrate and the base resin layer).
(5) Structure of Conductive Component
The surface of a sample at the conductive layer side was observed by using an electric field radiation type scanning electron microscope (trade name: JSM-6700-F, manufactured by JEOL Ltd.) at acceleration voltage of 3.0 kV or, otherwise, an atomic force microscope (trade name: Nano Scope III, manufactured by Digital Instruments). In the case where the sample cannot be observed by surface observation, after separating and purifying components of the conductive layer according to any of the same procedures as described in the above (1), a material corresponding to the conductive component was extracted and collected, followed by observation, like as described above.
(6) Total Luminous Transmittance
According to JIS K 7361-1 (1997) using a turbidity meter (or a haze meter) NDH 2000 (manufactured by Nippon Denshoku Industries Co. Ltd.), a total luminous transmittance of a conductive laminate in a thickness direction was measured while emitting incident light at the conductive layer side. Five samples were subjected to measurement, and the mean of the measured values was calculated. The calculated mean was defined as the total luminous transmittance.
(7) Writing Sense and Input Sensitivity of Touch Panel
With regard to embodiments of the invention, indications of writing sense and input sensitivity were ON load [g] and contact resistance value [kΩ]. ON load refers to, for example, a minimum load at which a touch panel firstly displays contact resistance described below and with which the touch panel can be operated, when applying the load to the touch panel with a pen 22 illustrated in
ON load and contact resistance value was determined as follows. First, with regard to the touch panel illustrated in
(8) External Appearance of Conductive Laminate
The conductive layer side of the conductive laminate was visibly observed in a 90° direction relative to the conductive side (vertical), 45° direction, and 10° direction, respectively, under a fluorescent lamp. As the standards of assessment used in embodiments of the invention, whether defects of the conductive layer (for example, repelling) are visibly observed was determined, and results thereof were assessed based on the following standards of assessment.
Grade A: No defect present in all angular directions
Grade B: Defects present in some of angular directions
Grade C: Defects present in all angular directions
Herein, if the sample ranks Grade A or B, it is considered to satisfy the standards and Grade A is most preferable.
(9) Refractive Index
With regard to a coating film formed on a silicon wafer or crystal glass by a coater, variation in polarized status of reflected light of the coating film was determined at incident angles of 60°, 65°, and 70°, using a high energy spectroscopic meter M 2000 (manufactured by J. A. Woollam Corporation), and a refractive index at 550 nm was calculated with an analytical soft WVASE 32.
(10) Film Thickness of Transparent Protection Layer
A film thickness of a transparent protection film in the fabricated transparent conductive laminate was observed at each of any three magnifications by using an electric field radiation type scanning electron microscope (trade name: JSM-6700-F, manufactured by JEOL Ltd.) at acceleration voltage of 3.0 kV, in which three magnifications were randomly selected from the observation magnification ranging from 10,000 to 200,000, image contrast was suitably adjusted. A cross-section of the sample was adjusted using the microtome described in the above (4). Based on the obtained photographs of the cross-section, any five positions were measured at each of any three magnifications (calculated at a high magnification). From the measured values at total 15 positions, the mean was calculated.
(11) Mean Reflectance
If a transparent protection layer is provided, the mean reflectance was determined according to the following procedure.
A surface opposed to a transparency measurement face (a face at which the transparent protection layer was provided) was uniformly roughed using No. 320 to 400 water-proof sandpaper to obtain a glossing degree at 60° (JIS Z 8741 (1997)) of 10 or less, and then, coated and colored with a black paint until a visible light transmittance reaches 5% or less. After placing the measurement face on a spectrophotometer (trade name: UV-3150, manufactured by Shimadzu Corporation), absolute reflectance spectrum in a wavelength region ranging from 300 nm to 800 nm was measured at an interval of 1 nm and with an incident angle of 5° to the measurement face, and the mean reflectance at the wavelength in the range of 380 to 780 nm was determined.
Resins, photo-polymerization initiators, and films used in the examples and comparative examples are described as follows.
(1) Resin A
Art Resin LPVC-3 (manufactured by Negami Chemical Industrial Co. Ltd., polypropyleneglycol skeleton 2-functional urethane acrylate, solid content of 100% by weight).
(2) Resin B
CHEMITORY (registered trademark) L-20 (manufactured by Soken Chemical and Engineering Co. Ltd., grafted acryl having a hydroxyl group (—OH) as a hydrophilic group in a side chain, solution with solid content of 26% by weight).
(3) Resin C
Art Resin UN-7600 (manufactured by Negami Chemical Industrial Co. Ltd., polyester skeleton 2-functional urethane acrylate, solid content of 100% by weight).
(4) Resin D
Aronics (registered trademark) M240 (manufactured by TOA GOSEI Co. Ltd., polyethyleneglycol skeleton 2-functional acrylate, solid content of 100% by weight).
(5) Resin E
Aronics (registered trademark) M270 (manufactured by TOA GOSEI Co. Ltd., polypropyleneglycol skeleton 2-functional acrylate, solid content of 100% by weight).
(6) Resin F
TRSC-006 (Manufactured by Negami Chemical Industrial Co. Ltd., polypropyleneglycol skeleton 2-functional urethane, solution with solid content of 58.8% by weight).
(7) Resin G
X-22-8114 (manufactured by Shin-Etsu Chemical Co. Ltd., grafted acryl containing silicon with a methyl group (—CH3) or n-butyl group (—CH2CH2CH2CH3) at a side chain, solution with solid content of 40% by weight).
(8) Photo-Polymerization Initiator
Ciba IRGACURE (registered trademark) 184 (Ciba Japan Co. Ltd.).
(9) Film
Polyethylene terephthalate film, Lumirror (registered trademark) U46 (manufactured by TORAY Industries).
Conductive layers used in the examples and comparative examples are described as follows.
(1) Conductive Layer A “Carbon Nanotube Conductive Layer”
(Control of Catalyst)
2.459 g of Ammonium iron citrate (green) (manufactured by Wako Pure Chemical Industries, Ltd.) was dissolved in 500 mL of methanol (manufactured by Kanto Chemical Co. Ltd.). 100 g of light magnesia (manufactured by Iwatani Chemical Industry Co. Ltd.) was added to the solution. The prepared mixture was agitated at room temperature for 60 minutes, then, vacuum dried to remove methanol while agitating at a temperature ranging from 40° C. to 60° C., resulting in a catalyst including a metal salt supported by the light magnesia.
(Preparation of Carbon Nanotube Composition)
A vertical fluidized bed reactor illustrated in the schematic view of
12 g of the catalyst was used, passed from a closed catalyst supplier 102 through the catalyst loading line 103, and a catalyst 108 described in the above ‘control of catalyst’ section was set on the quartz sintered plate 101. Next, it started to supply an argon gas from the raw gas supply line 104 at 1000 mL/min. After rendering the reactor to be under argon gas atmosphere, the temperature was increased to 850° C. by heating.
After reaching 850° C., the temperature was retained and a flow rate of argon from the raw gas supply line 104 was increased to 2000 mL/min to start fluidizing of a solid catalyst on the quartz sintered plate. After confirming the fluidization through the inspection door 107 of the furnace, it started to supply methane to the reactor at 95 mL/min. After feeding the mixed gas for 90 minutes, it was changed into the flow of argon gas alone to terminate the synthesis process.
Heating was terminated and the product was left to rest till room temperature. After reaching room temperature, a carbon nanotube composition containing the catalyst and carbon nanotubes was taken out from the reactor.
23.4 g of the catalyst-containing carbon nanotube composition described above was placed on a magnetic dish, heated in a muffle furnace pre-heated to 446° C. (manufactured by Yamato Scientific Co. Ltd., FP 41) under atmosphere and at 446° C. for 2 hours, and then, taken out from the muffle furnace. Next, in order to remove the catalyst, the carbon nanotube composition was added to 6 N hydrochloride acid solution and agitated at room temperature for 1 hour. A material recovered after filtration was further added to 6 N hydrochloride acid solution and agitated at room temperature for 1 hour. This solution was filtered and washed with water several times, and the filtrate was dried in an oven at 120° C. overnight, thereby resulting in 57.1 mg of a carbon nanotube composition free from magnesia and metals. The foregoing operation was repeated to prepare 500 mg of the carbon nanotube composition free from magnesia and metals.
Next, 80 mg of the carbon nanotube composition, from which the catalyst was removed by heating the composition in the muffle furnace, was added to 27 mL of concentrated nitric acid (manufactured by Wako Pure Chemical Industries, Ltd., Grade 1 Assay 60 to 61%), and heated in an oil bath at 130° C. for 5 hours under agitation. After terminating the heating and agitation, a nitric acid solution containing carbon nanotubes was filtered and washed with distilled water, resulting in 1266.4 mg of a wet carbon nanotube composition containing water as it stands.
(Carbon Nanotube Dispersed Coating Solution)
10 mg of the carbon nanotube composition (conversion of drying time) described above and 10 mg of sodium carboxymethyl cellulose (manufactured by Sigma Corporation, 90 kDa, 50 to 200 cps) as a dispersant were placed in a 50 mL vessel, followed by adding distilled water thereto to become 10 g. Thereafter, using an ultrasonic homogenizer at output power of 20 W, the prepared material was dispersed for 20 minutes under ice to thereby prepare a carbon nanotube coating solution. The obtained solution was centrifuged in a high speed centrifugal separator with 10000 G for 15 minutes, and then, 9 mL of a supernatant was obtained. The operation was repeated several times to obtain 145 mL of the supernatant, and 5 mL of ethanol was added thereto, thereby resulting in a carbon nanotube dispersed coating solution (a mixing ratio of carbon nanotube to dispersant is 1:1) containing carbon nanotubes with a concentration of about 0.1% by weight that enables the solution to be applied by a coater. The carbon nanotube dispersed coating solution was applied to a quartz glass and dried, thus preparing a carbon nanotube conductive layer having a refractive index of 1.82.
(Formation of Carbon Nanotube Conductive Layer)
The carbon nanotube dispersed coating solution was applied by means of a micro-gravure coater (gravure line No. 100R or 150R, gravure rotation rate of 80%) and dried at 100° C. for 1 minutes, thus forming a carbon nanotube coating film.
(2) Conductive Layer B “Silver Nanowire Conductive Layer”
According to the method described in Example 1 of WO 2007/022226 (synthesis of silver nanowire), silver nanowires were obtained. Next, according to the method described in Example 8 of WO 2007/022226 (dispersion of nanowires), a silver nanowire dispersed coating solution was prepared. This silver nanowire dispersed coating solution was applied by using a bar coater (manufactured by Matsuo Sangyo Co., Ltd.) and dried at 120° C. for 2 minutes, thus forming a silver nanowire coating film.
(3) Conductive Layer C “ITO Conductive Layer”
Using an indium/tin oxide target with constitutional composition of In2O2/SnO2=90/10, an ITO conductive thin film having a thickness of 250 nm was formed by a sputtering process at a vacuum degree of 10−4 Torr and under introduction of argon/oxygen mixed gas.
Transparent protection layers used in the examples and comparative examples are described below. The transparent protection layer was stacked on the conductive layer according to any of methods described in the examples and comparative examples.
(1) Transparent Protection Layer Material A
In 100 mL polymer vessel, 20 g of ethanol was introduced and 40 g of n-butyl silicate was added thereto, and the mixture was agitated for 30 minutes. Next, after adding 10 g of 0.1 N hydrochloride acid solution thereto, agitation was conducted for 2 hours (hydrolysis reaction), and the solution was stored at 4° C. Next day, the solution was diluted using isopropyl alcohol/toluene/n-butanol mixed solution (a mixing ratio by weight of 2/1/1) until a solid content reaches 1.0, 1.2, and 1.5% by weight. The prepared solution was applied on a silicon wafer and dried to thereby form a silicon oxide-based transparent protection layer having a refractive index of 1.44.
(2) Transparent Protection Layer Material B
Acryl-base UV curing low refractive index material TU-2180 (10% by weight solid content) containing hollow silica particles, manufactured by JSR Corporation, was diluted with methylethylketone until the solid content reaches 1.5% by weight. The prepared solution was applied to a silicon wafer and dried to thereby form a silicon oxide-based transparent protection layer having a refractive index of 1.37.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 1.40 g of ‘resin A’, 13.85 g of ‘resin B’, and 2.00 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 30 (manufactured by Matsuo Sangyo Co., Ltd.), the coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, followed by heating and drying at 100° C. for 3 minutes, thereby forming a base resin layer having a coating thickness of 13 μm after drying.
Then, ‘conductive layer A’ was stacked on the base resin layer by gravure line No. 150R, thus resulting in a conductive laminate of embodiments of the invention.
Except that a base resin layer coating solution has the constitutional composition of; 1.40 g of ‘resin A’, 13.96 g of ‘resin B’, 0.041 g of ‘photo-polymerization initiator’, and 2.08 g of ethyl acetate and, after applying and drying a coating solution, UV ray was radiated at 1.2 J/cm2, the sample procedure as described in Example 1 was executed and ‘conductive layer A’ was stacked on the base resin layer having a coating thickness of 13 μm after drying, by gravure line No. 150R, thus resulting in a conductive laminate.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 3.48 g of ‘resin A’, 8.92 g of ‘resin B’, and 7.59 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 30 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, followed by heating and drying at 100° C. for 3 minutes, thereby forming a base resin layer having a coating thickness of 13 μm after drying.
Then, ‘conductive layer B’ was stacked on the base resin layer, thus resulting in an embodiment of a conductive laminate of the invention.
A ‘film’ having a thickness of 125 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 3.64 g of ‘resin A’, 1.38 g of ‘resin B’, and 14.97 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 24 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, followed by heating and drying at 100° C. for 3 minutes, thereby forming a base resin layer having a coating thickness of 7 μm after drying. Then, ‘conductive layer B’ was stacked on the base resin layer, thus resulting in an embodiment of a conductive laminate of the invention.
The same procedure as described in Example 4 was executed and ‘conductive layer B’ was stacked on a base resin layer having a thickness of 7 μm after drying, except that the base resin layer coating solution has the constitutional composition of; 3.84 g of ‘resin A’, 0.62 g of ‘resin B’, and 15.55 g ethyl acetate, thus resulting in an embodiment of a conductive laminate of the invention.
A ‘film’ having a thickness of 125 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 1.40 g of ‘resin A’, 13.96 g of ‘resin B’, 0.041 g of ‘photo-polymerization initiator’, and 9.95 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 24 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, heated and dried at 100° C. for 3 minutes, followed by UV irradiation at 1.2 J/cm2 and curing, thereby forming a base resin layer having a coating thickness of 7 μm.
Then, ‘conductive layer A’ was stacked on the base resin layer by gravure line No. 150R, thus resulting in an embodiment of a conductive laminate of the invention.
Except that a base resin layer coating solution has the constitutional composition of; 1.80 g of ‘resin A’, 8.48 g of ‘resin B’, 0.043 g of ‘photo-polymerization initiator’, and 9.92 g of ethyl acetate and after applying and drying a coating solution, UV ray was radiated at 1.2 J/cm2, the sample procedure as described in Example 6 was executed and ‘conductive layer A’ was stacked on the base resin layer having a coating thickness of 7 μm, by gravure line No. 150R, thus resulting in an embodiment of a conductive laminate of the invention.
Except that a base resin layer coating solution has the constitutional composition of; 1.00 g of ‘resin A’, 16.40 g of ‘resin B’, 0.030 g of ‘photo-polymerization initiator’, and 9.04 g of ethyl acetate and after applying and drying a coating solution, UV ray was radiated at 1.2 J/cm2, the sample procedure as described in Example 6 was executed and ‘conductive layer A’ was stacked on the base resin layer having a coating thickness of 7 μm, by gravure line No. 150R, thus resulting in an embodiment of a conductive laminate of the invention.
Except that a base resin layer coating solution has the constitutional composition of; 0.80 g of ‘resin A’, 18.90 g of ‘resin B’, 0.024 g of ‘photo-polymerization initiator’, and 8.97 g of ethyl acetate and after applying and drying a coating solution, UV ray was radiated at 1.2 J/cm2, the sample procedure as described in Example 6 was executed and ‘conductive layer A’ was stacked on the base resin layer having a coating thickness of 7 μm, by gravure line No. 150R, thus resulting in an embodiment of a conductive laminate of the invention.
A ‘film’ having a thickness of 125 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 0.50 of ‘resin A’, 19.44 g of ‘resin B’, 0.015 g of ‘photo-polymerization initiator’, and 0.67 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 26 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, heated and dried at 100° C. for 3 minutes, followed by UV irradiation at 1.2 J/cm2 and curing, thereby forming a base resin layer having a coating thickness of 10.5 μm.
Then, ‘conductive layer A’ was stacked on the base resin layer by gravure line No. 150R, thus resulting in an embodiment of a conductive laminate of the invention.
A ‘film’ having a thickness of 125 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 1.00 of ‘resin A’, 9.89 g of ‘resin B’, 0.030 g of ‘photo-polymerization initiator’, and 7.09 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 16 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, heated and dried at 100° C. for 3 minutes, followed by UV irradiation at 1.2 J/cm2 and curing, thereby forming a base resin layer having a coating thickness of 4.8 μm.
Then, ‘conductive layer A’ was stacked on the base resin layer by gravure line No. 150R, thus resulting in an embodiment of a conductive laminate of the invention.
The same procedure as described in Example 11 was executed to form an embodiment of a conductive laminate of the invention, except that ‘conductive layer A’ to be laminated was stacked by gravure line No. 100R.
‘Transparent protection layer material A’ coating solution having a solid content of 1.0% by weight was applied to ‘conductive layer A’ in Example 6 by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%), followed by drying at 125° C. for 1 minute to form a transparent protection layer having a thickness of 60 nm, resulting in an embodiment of a conductive laminate of the invention.
‘Transparent protection layer material A’ coating solution having a solid content of 1.2% by weight was applied to ‘conductive layer A’ in Example 6 by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%), followed by drying at 125° C. for 1 minute to form a transparent protection layer having a thickness of 75 nm, resulting in an embodiment of a conductive laminate of the invention.
‘Transparent protection layer material A’ coating solution having a solid content of 1.5% by weight was applied to ‘conductive layer A’ in Example 6 by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%), followed by drying at 125° C. for 1 minute to form a transparent protection layer having a thickness of 100 nm, resulting in an embodiment of a conductive laminate of the invention.
‘Transparent protection layer material B’ coating solution having a solid content of 1.5% by weight was applied to ‘conductive layer A’ in Example 6 by a micro-gravure coater (gravure line No. 120R, gravure rotation rate 100%) and dried at 80° C. for 30 seconds, followed by UV irradiation at 1.2 J/cm2 and curing to form a transparent protection layer having a thickness of 65 nm, resulting in an embodiment of a conductive laminate of the invention.
‘Transparent protection layer material B’ coating solution having a solid content of 1.5% by weight was applied to ‘conductive layer A’ in Example 6 by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 30 seconds, followed by UV irradiation at 1.2 J/cm2 and curing to form a transparent protection layer having a thickness of 100 nm, resulting in an embodiment of a conductive laminate of the invention.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm. Then, a laminate was prepared without a base resin layer and a conductive layer provided on the other face opposed to the face of the substrate, on which a hard coating layer is provided.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 5.80 g of ‘resin A’, 0.174 g of ‘photo-polymerization initiator’, and 14.63 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 30 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, heated and dried at 100° C. for 3 minutes, followed by UV irradiation at 1.2 J/cm2 and curing, thereby forming only a base resin layer having a coating thickness of 13 μm and, which in turn, resulting in a laminate without a conductive layer.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, ‘conductive layer C’ was directly stacked on the other face opposed to the face of the substrate, on which the hard coating layer is provided, without a base resin layer, to thereby form a conductive laminate.
The same procedure as described in Comparative Example 3 was executed to form a conductive laminate, except that a conductive layer was ‘conductive layer A’ (stacked by gravure line No. 150R).
The same procedure as described in Comparative Example 3 was executed to prepare a conductive laminate, except that a conductive layer was ‘conductive layer B’.
The same procedure as described in Example 1 was executed and ‘conductive layer A’ was stacked on a base resin layer having a coating thickness of 13 μm after drying by gravure line No. 150R, to form a conductive laminate, except that a resin to be used in the base resin layer coating solution was ‘resin C’.
The same procedure as described in Comparative Example 6 was executed to form a conductive laminate, except that ‘conductive layer A’ to be laminated was stacked by gravure line No. 100R.
The same procedure as described in Example 2 was executed and ‘conductive layer A’ was stacked on a base resin layer having a coating thickness of 13 μM after drying by gravure line No. 150R, to form a conductive laminate, except that a resin to be used in the base resin layer coating solution was ‘resin D’.
The same procedure as described in Example 2 was executed and ‘conductive layer A’ was stacked on a base resin layer having a coating thickness of 13 μm after drying by gravure line No. 150R, to form a conductive laminate, except that a resin to be used in the base resin layer coating solution was ‘resin E’.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 1.00 g of ‘resin F’, 5.82 g of ‘resin B’, and 0.43 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 30 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, heated and dried at 100° C. for 3 minutes, to thereby form a base resin layer having a coating thickness of 13 μm after drying.
Then, ‘conductive layer A’ was stacked on the base resin layer by gravure line No. 150R, thus forming a conductive laminate.
A ‘film’ having a thickness of 188 μm was used as a substrate, KAYANOVA (registered trademark) FOP 1740 (manufactured by Nippon Kayaku Co., Ltd., solid content of 82% by weight) was diluted with toluene and methylethylketone at a ratio by weight of 1:1, to the solid content of 40% by weight and hence prepare a hard coating agent, the hard coating agent was applied to one face of the substrate by a micro-gravure coater (gravure line No. 80R, gravure rotation rate 100%) and dried at 80° C. for 1 minute, followed by UV irradiation at 1.0 J/cm2 and curing to thereby form a hard coating layer having a thickness of 5 μm.
Next, 1.00 g of ‘resin F’, 3.87 g of ‘resin G’, and 2.46 g of ethyl acetate were mixed and agitated to prepare a base resin layer coating solution. Using a bar coater No. 30 (manufactured by Matsuo Sangyo Co., Ltd.), the base resin layer coating solution was applied to the other face opposed to the face of the substrate, on which the hard coating layer was provided, heated and dried at 100° C. for 3 minutes, to thereby form a base resin layer having a coating thickness of 13 μm after drying.
Then, although it was attempted to apply a carbon nanotube dispersed coating solution of ‘conductive layer A’ to the base resin layer, however, the base resin layer repelled the coating solution, thus causing a failure in laminating the conductive layer.
In Examples 1 to 17, it was possible to enhance writing sense and input sensitivity of a touch panel. Among those, in the case where a base resin layer was prepared by mixing an urethane acrylate, in which a glycol skeleton has a specific structure and the number of functional groups at an acrylate part is 2, as well as a grafted resin having a hydrophilic group in a side chain (Examples 1 to 3, 6, and 13 to 17), water dispersion including a conductive component with a linear structure could be applied and, in addition, writing sense and input sensitivity were remarkably enhanced. Moreover, when the acrylate part of the urethane acrylate resin was combined with another acrylate part (Examples 2, 6, and 13 to 17), favorable durability was successfully achieved.
On the other hand, if a conductive layer is not provided (Comparative Examples 1 and 2), a touch panel does not act. If a base resin layer was not provided (Comparative Examples 3 to 5), it exhibited poor writing sense and input sensitivity. In the case where a skeleton structure of an urethane acrylate resin in a base resin layer is not a glycol skeleton (Comparative Examples 6 and 7) or, otherwise, even though a grycol skeleton is present, the material having the above structure is not an urethane acrylate (Comparative Examples 8, 9, and 10), writing sense and input sensitivity were deteriorated. Furthermore, if a side chain of a grafted resin is a hydrophobic group, a water dispersed coating solution may not be applied, thus causing a failure in laminating a conductive layer (Comparative Example 11).
embodiments of the invention provide a conductive laminate with good writing sense and high input sensitivity to a touch panel, and favorable durability. Further, embodiments of the conductive laminate may be used for electrode members, which are employed in display-related products such as a liquid crystal display, an organic electro-luminescence, and/or an electronic paper, a solar cell module, and the like.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-257833 | Nov 2009 | JP | national |
This application is the U.S. National Phase application of PCT International Application No. PCT/JP2010/069405, filed Nov. 1, 2010, and claims priority to Japanese Patent Application No. 2009-257833, filed Nov. 11, 2009, the disclosures of which PCT and priority applications are incorporated herein by reference in their entireties for all purposes.
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2010/069405 | 11/1/2010 | WO | 00 | 5/10/2012 |
