Conductive positive temperature coefficient polymer composition and circuit protection device made therefrom

Information

  • Patent Application
  • 20080074232
  • Publication Number
    20080074232
  • Date Filed
    September 22, 2006
    18 years ago
  • Date Published
    March 27, 2008
    16 years ago
Abstract
A PTC circuit protection device has a resistivity at 20° C. of less than 10 ohm-cm and is made from a PTC polymer composition that contains: 40-70 vol % of a non-cross-linked polyvinylidene fluoride (PVDF) or a cross-linked polyvinylidene fluoride formed by cross-linking the non-cross-linked polyvinylidene fluoride by irradiation to a dosage less than 8 Mrads; and 30-60 vol % of a particulate conductive filler. The non-cross-linked polyvinylidene fluoride has a melting flow rate (MFR) of less than 120 g/10 min.
Description

BRIEF DESCRIPTION OF THE DRAWING

Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments of this invention, with reference to the accompanying drawing, in which:



FIG. 1 is a plot of the electrical resistance of the PTC element versus the irradiating dosage for different PTC polymer compositions having corresponding formulation nos. 1, 2, 10, 11, 12, and 13.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The PTC element of this invention, which is particularly useful in the manufacture of a PTC circuit protection device having a resistivity at 20° C. of less than 10 ohm-cm, has a PTC polymer composition comprising: 40-70 vol % of a non-cross-linked polyvinylidene fluoride (PVDF) or a cross-linked polyvinylidene fluoride formed by cross-linking the non-cross-linked polyvinylidene fluoride by irradiation to a dosage less than 8 Mrads; and 30-60 vol % of a particulate conductive filler. The non-cross-linked polyvinylidene fluoride has a melting flow rate (MFR) of less than 120 g/10 min.


Preferably, the cross-linked polyvinylidene fluoride is formed by cross-linking the non-cross-linked polyvinylidene fluoride by irradiating it to a dosage less than 4 Mrads.


Preferably, the non-cross-linked polyvinylidene fluoride has a melting flow rate ranging from 0.5-30 grams per 10 minutes, and a melting point ranging from 140 to 180° C.


The particulate conductive filler is preferably made from a conductive material selected from the group consisting of metal particles and particulate carbon black.


The merits of the PTC polymer composition of this invention will become apparent with reference to the following Examples.


EXAMPLES 1-29 AND COMPARATIVE EXAMPLES 1-41

PTC elements of Examples 1-29 and Comparative Examples 1-41 were prepared in a conventional manner that involved compounding, compress molding, laminating with nickel plated copper foils, and compressing steps, but differ from each other in the PTC polymer composition and in the irradiating dosage for the polyvinylidene fluoride of the polymer composition. The PTC polymer compositions of the Examples 1-29 and the Comparative Examples 1-41 are represented by corresponding formulation numbers shown in Table 1.












TABLE 1







Formulation
Polymer 1
Polymer 2
Conductive Filler













no.
Type
Vol %
Type
Vol %
Type
Vol %





F1
PVDF*
58.3%
none

Carbon Black
41.7%


F2
PVDF*
62.2%
none

Carbon Black
37.8%


F3
PVDF*
57.3%
ETFE
5.0%
Carbon Black
37.7%


F4
PVDF*
52.2%
ETFE
10.1% 
Carbon Black
37.7%


F5
HDPE
56.8%
PVDF*
3.7%
Carbon Black
39.5%


F6
HDPE
52.7%
PVDF*
3.8%
Carbon Black
43.6%


F7
HDPE
28.9%
Grafted-PE
 29%
Carbon Black
42.2%


F8
HDPE
28.9%
Grafted-PE
 29%
Carbon Black
42.2%


F9
PVDF**
67.2%
none

Carbon Black
32.8%


F10
PVDF***
67.2%
none

Carbon Black
32.8%


F11
PVDF****
67.2%
none

Carbon Black
32.8%


F12
PVDF*
50.0%
none

Carbon Black
50.0%


F13
PVDF*
55.0%
none

Carbon Black
45.0%





PVDF*= Kynar 761 (Melting Point is about 170° C., MFR is about 0.5 g/10 min under 230° C. and load 5 kg condition, from Arkema).


PVDF**= Solef 1006 (Melting Point is about 175° C., MFR is about 120 g/10 min under 230° C. and load 5 kg condition, from Solvay Solexis)


PVDF***= Solef 6008(Melting Point is about 174° C., MFR is about 24 g/10 min under 230° C. and load 5 kg condition, from Solvay Solexis)


PVDF****= Solef 6010(Melting Point is about 173° C., MFR is about 6 g/10 min under 230° C. and load 5 kg condition, from Solvay Solexis)


ETFE= Tefzel ETFE HT 2181(Melting Point is about 260° C., MFR is about 6 g/10 min under ASTM D3159 condition, from Dupont)






Electrical Resistance Stability Test

The PTC elements of Examples 1-29 and Comparative Examples 1-41 were tested in their electrical resistance stability. The tests included Trip Endurance Test, in which a current of 7.8 A was continuously applied to each test specimen at a voltage of 16V for 300 hours, and Cycle Test, in which a current of 7.8 A was applied to each test specimen at a voltage of 16V and at an interval of 1 minute on/1 minute off for 7200 cycles. The results of the electrical resistance stability test for Examples 1-29 and Comparative Examples 1-41 are shown in Table 2. As best shown in FIG. 1, the results show that the electrical resistance stability for formulation nos. F1, F2, F10, F11, F12 and F13 is greatly improved when the irradiating dosage for the PVDF (having an MFR less than 120 g/10 min) is less than 8 Mrads. In instances of higher irradiating dosage (above 8 Mrads) and lower irradiating dosage (below 8 Mrads), the PTC elements made from PVDF having an MFR of 120 g/10 min (formulation no. 9) were all burned out in the Trip Endurance Test, and the PTC elements made from PVDF having an MFR of 120 g/10 min were almost burned out in the Cycle Test (except for Comparative Examples 34 and 35 which have a higher irradiating dosage). In addition, the PTC elements made from formulation nos. 3 and 4 (which contains a major amount of PVDF having an MFR of 0.5 g/10 min, and a small amount of ETFE), and the PTC elements made from formulation nos. 5, 6, 7, and 8 (which contain a major amount of HDPE and a small amount of PVDF, or a mixture of HDPE and grafted PE) exhibit relatively poor electrical resistance stability. Moreover, for the PTC elements made from HDPE or the mixture of HDPE and grafted PE, the higher the irradiating dosage, the better will be the electrical resistance stability, which is in consistent with the teachings of the prior art.













TABLE 2










Trip
Cycle Test




X-linking
Endurance Test
(16 V/7.8 A, 1 min on/1 min


Exper.
Formulation
Dosage
(16 V/7.8 A, 300 hrs)
off, 7200Cycles)















No.
No
Mrad
Ri, ohm
R24/Ri
R300/Ri
Ri, ohm
R720c/Ri
R7200c/Ri


















Exp. 1
F1
0
0.0550
1.38
2.45
0.0511
3.11
2.03


Exp. 2
F1
1
0.0689
1.65
4.84
0.0649
3.48
3.28


Exp. 3
F1
2
0.0785
2.95
3.47
0.0638
4.34
4.60


Exp. 4
F1
4
0.0744
1.47
3.79
0.0730
4.88
3.95


Exp. 5
F1
8
0.0760
1.71
9.47
0.0691
4.70
8.41


Comp.
F1
15
0.0713
55.34
330.54
0.0678
5.36
13.65


Exp. 1


Comp.
F1
30
0.0799
2039
22426
0.0699
5.95
111.24


Exp. 2


Exp. 6
F2
0
0.0659
1.84
3.16
0.0580
3.50
3.30


Exp. 7
F2
1
0.0832
2.04
3.77
0.0624
2.84
4.33


Exp. 8
F2
2
0.0810
2.84
7.48
0.0657
3.31
3.75


Exp. 9
F2
4
0.0887
4.56
10.88
0.0743
1.75
1.98


Exp. 10
F2
8
0.1082
9.73
73.66
0.0987
1.60
2.70


Comp.
F2
15
0.0923
135.36
1915.5
0.0939
2.30
41.14


Exp. 3


Comp.
F2
30
0.0993
1335.8
20156.27
0.0854
3.79
208.03


Exp. 4


Comp.
F3
0
0.0548
Burned
xxxx
0.0377
Burned
xxxx


Exp. 5


Comp.
F3
5
0.0432
15.82
Burned
0.0429
6.36
Burned


Exp. 6


Comp.
F3
15
0.0419
31.91
189.34
0.0395
2.52
18.47


Exp. 7


Comp.
F3
30
0.0352
16.53
63.45
0.0420
2.78
10.89


Exp. 8


Comp.
F4
0
0.0524
Burned
xxxx
0.0566
Burned
xxxx


Exp. 9


Comp.
F4
5
0.0482
58.54
Burned
0.0391
16.29 
Burned


Exp. 10


Comp.
F4
15
0.0444
63.39
849.34
0.0428
6.21
54.38


Exp. 11


Comp.
F4
30
0.0416
49.31
239.41
0.0408
4.92
34.56


Exp. 12


Comp.
F5
0
0.0222
Burned
xxxx
0.0214
Burned
xxxx


Exp. 13


Comp.
F5
5
0.0243
Burned
xxxx
0.0238
Burned
xxxx


Exp. 14


Comp.
F5
15
0.0256
8.75
Burned
0.0243
Burned
xxxx


Exp. 15


Comp.
F5
30
0.0265
9.51
88.54
0.0254
6.89
Burned


Exp. 16


Comp.
F6
0
0.0180
Burned
xxxx
0.0176
Burned
xxxx


Exp. 17


Comp.
F6
5
0.0184
Burned
xxxx
0.0183
Burned
xxxx


Exp. 18


Comp.
F6
15
0.0192
Burned
xxxx
0.0184
Burned
xxxx


Exp. 19


Comp.
F6
30
0.0195
Burned
xxxx
0.0193
Burned
xxxx


Exp. 20


Comp.
F7
0
0.0732
15.54
Burned
0.0754
Burned
xxxx


Exp. 21


Comp.
F7
5
0.0741
10.32
30.34
0.0753
20.43 
Burned


Exp. 22


Comp.
F7
15
0.0752
5.43
8.34
0.0793
3.42
10.32


Exp. 23


Comp.
F7
30
0.0761
4.95
6.53
0.0757
2.89
7.36


Exp. 24


Comp.
F8
0
0.0631
Burned
xxxx
0.0643
Burned
xxxx


Exp. 25


Comp.
F8
5
0.0642
12.34
50.34
0.0632
25.34 
Burned


Exp. 26


Comp.
F8
15
0.0662
4.53
9.43
0.0649
5.95
8.32


Exp. 27


Comp.
F8
30
0.0673
4.23
8.86
0.0612
4.32
6.45


Exp. 28


Comp.
F9
0
0.0574
Burned
xxxx
0.0573
Burned
xxxx


Exp. 29


Comp.
F9
1
0.0583
Burned
xxxx
0.0587
Burned
xxxx


Exp. 30


Comp.
F9
2
0.0593
Burned
xxxx
0.0593
Burned
xxxx


Exp. 31


Comp.
F9
4
0.0599
Burned
xxxx
0.0603
Burned
xxxx


Exp. 32


Comp.
F9
8
0.0573
Burned
xxxx
0.0591
Burned
xxxx


Exp. 33


Comp.
F9
15
0.0559
Burned
xxxx
0.0598
0.34
Burned


Exp. 34


Comp.
F9
30
0.0568
Burned
xxxx
0.0584
2.34
1.22


Exp. 35


Exp. 11
F10
0
0.0645
1.56
3.45
0.0643
1.78
3.23


Exp. 12
F10
1
0.0679
1.32
4.35
0.0664
2.14
4.53


Exp. 13
F10
2
0.0681
1.59
3.67
0.0631
2.57
4.69


Exp. 14
F10
4
0.0695
2.31
4.79
0.0683
3.24
5.31


ExP. 15
F10
8
0.0693
2.69
10.45
0.0626
3.58
9.76


Comp.
F10
15
0.0711
1.24
53.64
0.0593
3.90
11.64


Exp. 36


Comp.
F10
30
0.0699
3.56
148.43
0.0619
5.69
93.23


Exp. 37


Exp. 16
F11
0
0.0967
2.45
4.53
0.0953
2.02
2.78


Exp. 17
F11
1
0.0987
2.96
3.89
0.0963
2.98
3.22


Exp. 18
F11
2
0.1023
3.56
4.82
0.0925
3.58
3.62


Exp. 19
F11
4
0.1045
5.63
5.78
0.0954
3.67
4.61


Exp. 20
F11
8
0.1094
6.34
8.51
0.0957
3.21
6.78


Comp.
F11
15
0.1180
13.67
92.12
0.0910
4.65
34.34


Exp. 38


Comp.
F11
30
0.1032
38.34
225.63
0.0942
8.53
107.34


Exp. 39


Exp. 21
F12
0
0.0358
1.12
1.98
0.0373
2.75
3.79


Exp. 22
F12
1
0.0475
1.34
3.92
0.0454
2.76
4.60


Exp. 23
F12
2
0.0502
2.39
4.81
0.0402
4.25
5.85


Exp. 24
F12
4
0.0484
4.76
7.37
0.0533
4.69
8.64


Exp. 25
F12
8
0.0570
5.82
8.54
0.0451
5.58
9.99


Comp.
F12
15
0.0520
39.98
98.82
0.0468
6.43
16.37


Exp. 39


Comp.
F12
30
0.0559
1651.59
8165.06
0.0477
7.20
134.60


Exp. 40


Exp. 25
F13
0
0.0440
1.24
2.21
0.0424
2.92
3.91


Exp. 26
F13
1
0.0572
1.49
2.36
0.0506
3.10
4.92


Exp. 27
F13
2
0.0612
2.66
3.12
0.0530
4.30
5.55


Exp. 28
F13
4
0.0610
2.65
4.82
0.0606
4.78
8.87


Exp. 29
F13
8
0.0638
3.25
6.99
0.0574
5.12
9.67


Comp.
F13
15
0.0556
47.04
80.96
0.0563
5.87
19.95


Exp. 41









Accordingly, the applicants have discovered that PTC polymer compositions containing non-cross-linked PVDF or low dosage irradiated cross-linked PVDF, which have an MFR of less than 120 g/10 min, exhibit an excellent electrical resistance stability.


While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation and equivalent arrangements.

Claims
  • 1. A positive temperature coefficient (PTC) polymer composition comprising: non-cross-linked polyvinylidene fluoride having a melting flow rate of less than 120 g/10 min; anda particulate conductive filler.
  • 2. The PTC polymer composition of claim 1, wherein said PTC polymer composition contains 40-70 vol % of said non-cross-linked polyvinylidene fluoride and 30-60 vol % of said conductive filler.
  • 3. The PTC polymer composition of claim 1, wherein said non-cross-linked polyvinylidene fluoride has a melting flow rate ranging from 0.5-30 grams per 10 minutes.
  • 4. The PTC polymer composition of claim 3, wherein said non-cross-linked polyvinylidene fluoride has a melting point ranging from 140 to 180° C.
  • 5. The PTC polymer composition of claim 1, wherein said conductive filler is carbon black.
  • 6. A positive temperature coefficient (PTC) polymer composition comprising: cross-linked polyvinylidene fluoride formed by cross-linking a non-cross-linked polyvinylidene fluoride by irradiation to a dosage less than 8 Mrads; anda particulate conductive filler;wherein said non-cross-linked polyvinylidene fluoride has a melting flow rate of less than 120 g/10 min.
  • 7. The PTC polymer composition of claim 6, wherein said PTC polymer composition contains 40-70 vol % of said cross-linked polyvinylidene fluoride and 30-60 vol % of said conductive filler.
  • 8. The PTC polymer composition of claim 6, wherein said dosage is less than 4 Mrads.
  • 9. The PTC polymer composition of claim 6, wherein said non-cross-linked polyvinylidene fluoride has a melting flow rate ranging from 0.5-30 grams per 10 minutes.
  • 10. The PTC polymer composition of claim 9, wherein said non-cross-linked polyvinylidene fluoride has a melting point ranging from 140 to 180° C.
  • 11. The PTC polymer composition of claim 6, wherein said conductive filler is carbon black.
  • 12. A circuit protection device having a resistivity at 20° C. of less than 10 ohm-cm, said circuit protection device comprising: a conductive polymer element exhibiting positive temperature coefficient and having a PTC polymer composition containing non-cross-linked polyvinylidene fluoride having a melting flow rate of less than 120 g/10 min, and a particulate conductive filler; andtwo electrodes connected to said conductive polymer element and adapted to receive electrical power so as to cause current to flow through said conductive polymer element.
  • 13. The circuit protection device of claim 12, wherein said PTC polymer composition contains 40-70 vol % of said non-cross-linked polyvinylidene fluoride and 30-60 vol % of said conductive filler.
  • 14. The circuit protection device of claim 12, wherein said non-cross-linked polyvinylidene fluoride has a melting flow rate ranging from 0.5-30 grams per 10 minutes.
  • 15. The circuit protection device of claim 14, wherein said non-cross-linked polyvinylidene fluoride has a melting point ranging from 140 to 180° C.
  • 16. The circuit protection device of claim 12, wherein said conductive filler is carbon black.
  • 17. A circuit protection device having a resistivity at 20° C. of less than 10 ohm-cm, said circuit protection device comprising: a conductive polymer element exhibiting positive temperature coefficient and having a PTC polymer composition containing cross-linked polyvinylidene fluoride and a particulate conductive filler, said cross-linked polyvinylidene fluoride being formed by cross-linking a non-cross-linked polyvinylidene fluoride by irradiation to a dosage less than 8 Mrads, said non-cross-linked polyvinylidene fluoride having a melting flow rate of less than 120 g/10 min; andtwo electrodes connected to said conductive polymer element and adapted to receive electrical power so as to cause current to flow through said conductive polymer element.
  • 18. The circuit protection device of claim 17, wherein said PTC polymer composition contains 40-70 vol % of said cross-linked polyvinylidene fluoride and 30-60 vol % of said conductive filler.
  • 19. The circuit protection device of claim 17, wherein said dosage is less than 4 Mrads.
  • 20. The circuit protection device of claim 17, wherein said non-cross-linked polyvinylidene fluoride has a melting flow rate ranging from 0.5-30 grams per 10 minutes.
  • 21. The circuit protection device of claim 20, wherein said non-cross-linked polyvinylidene fluoride has a melting point ranging from 140 to 180° C.
  • 22. The circuit protection device of claim 17, wherein said conductive filler is carbon black.