Claims
- 1. A suspension assembly for supporting a head, comprising:
- a load beam;
- flexure secured to said load beam;
- said flexure being formed of a dielectric layer containing a pattern of conductive traces;
- said dielectric layer providing added stiffness to said load beam;
- at least some of said conductive traces being adapted for connection to the head;
- said flexure including a forward portion;
- said load beam including a forward section; and
- said flexure forward portion extending onto a substantial surface of said load beam forward section.
- 2. An assembly as recited in claim 1, wherein said dielectric layer is made of a polymeric resinous material.
- 3. An assembly as recited in claim 2, wherein said dielectric layer is made of polyimide.
- 4. An assembly as recited in claim 1, wherein said dielectric layer is made of plastic.
- 5. An assembly as recited in claim 1, wherein said conductive traces are made of copper.
- 6. An assembly as recited in claim 1, wherein said load beam includes a lateral edge;
- wherein said flexure further includes a bend portion and a rearward portion; and
- wherein said flexure bend portion extends integrally into said flexure rearward portion;
- and wherein said flexure rearward portion is substantially flattened against and secured to said load beam lateral edge.
- 7. An assembly as recited in claim 6, wherein said flexure forward portion includes a wing that extends integrally, underneath said load beam, into a substantially uniform, elongated tail, which terminates proximately to a resilient section of said load beam.
- 8. An assembly as recited in claim 6, wherein said dielectric layer has a generally uniform thickness.
- 9. An assembly as recited in claim 6, wherein the thickness of said dielectric layer is not uniform.
- 10. An assembly as recited in claim 6, further including stiffening regions on said flexure for increasing the stiffness of said flexure, and for controlling the flatness of said flexure.
- 11. An assembly as recited in claim 10, wherein said stiffening regions also act as stops for adhesive flow.
- 12. An assembly as recited in claim 10, further including one or more bond sites.
- 13. An assembly as recited in claim 12, wherein at least one of said bond sites provides a ground connection.
- 14. An assembly as recited in claim 6, wherein said flexure includes a test pad.
- 15. An assembly as recited in claim 1, wherein said flexure forward portion extends generally symmetrically over substantially the entire surface of said load beam forward section.
- 16. An assembly as recited in claim 1, wherein said flexure forward portion includes a tongue formed as part of said flexure for supporting the head.
- 17. An assembly as recited in claim 16, wherein said flexure includes a dimple that bears on the head for providing a gimballing action.
- 18. An assembly as recited in claim 16, wherein said load beam includes a dimple that bears on the head through a clearance opening in said tongue.
- 19. A suspension assembly for supporting a head, comprising:
- a load beam;
- a flexure secured to said load beam;
- said flexure being formed of a dielectric layer containing a pattern of conductive traces;
- said dielectric layer providing added stiffness to said load beam;
- at least some of said conductive traces being adapted for connection to the head;
- said flexure including a forward portion; and
- said dielectric layer in said flexure forward portion extending in a tongue for supporting the head.
- 20. A suspension assembly for supporting a head, comprising:
- a load beam;
- a flexure secured to said load beam;
- said flexure being formed of a dielectric layer containing a pattern of conductive traces;
- said dielectric layer providing added stiffness to said load beam;
- at least some of said conductive traces being adapted for connection to the head;
- said flexure including a forward portion;
- said load beam including a forward section; and
- said flexure forward portion extending generally symmetrically over said load beam forward section.
Parent Case Info
This application is a continuation of application Ser. No. 08/600,240, filed on Feb. 12, 1996, now abandoned.
US Referenced Citations (6)
Continuations (1)
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Number |
Date |
Country |
Parent |
600240 |
Feb 1996 |
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