TREA

Conductor pad

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Information

  • Patent Grant
  • D877103
  • Patent Number
    D877,103
  • Date Filed
    Wednesday, February 13, 2019
    5 years ago
  • Date Issued
    Tuesday, March 3, 2020
    4 years ago
  • US Classifications
    Field of Search
    • US
    • D13 133
    • D13 182
    • 324 754010
    • 324 754020
    • 324 754030
    • 361 019000
    • 361 107000
    • 361 637000
    • 361 515000
    • 361 813000
    • 439 043000
    • 439 052000
    • 439 066000
    • 439 012000
    • 439 208000
    • 439 210000
    • 439 456000
    • 439 457000
    • 439 458000
    • 439 902000
    • 438 614000
    • 438 610000
    • 438 584000
    • 438 612000
    • 438 618000
    • CPC
    • H01L24/03
    • H01L24/05
    • H01L23/49575
    • H01L24/34
    • H01L2224/05556
    • H01J37/08
    • H01J37/26
    • G01N23/00
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Information
Abstract
Description


FIG. 1 is a top plan view of a first embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 2 is a top plan view of a second embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 3 is a top plan view of a third embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 4 is a top plan view of a fourth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 5 is a top plan view of a fifth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 6 is a top plan view of a sixth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 7 is a top plan view of a seventh embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 8 is a top plan view of an eighth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 9 is a top plan view of a ninth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 10 is a top plan view of a tenth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.



FIG. 11 is a top plan view of an eleventh embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof; and,



FIG. 12 is a top plan view of a twelfth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.


The broken-line disclosure in the views is understood to represent portions of the article in which the claimed design is embodied, but which form no part of the claimed design.


All surfaces not shown form no part of the claimed design.


Claims
  • The ornamental design for a conductor pad, as shown and described.
US Referenced Citations (10)
Number Name Date Kind
D327883 Gloton Jul 1992 S
D328599 Gloton Aug 1992 S
6803582 Berglund Oct 2004 B2
D503691 Standing Apr 2005 S
D598380 Kuriki Aug 2009 S
D613690 Kuriki Apr 2010 S
D615927 Kuriki May 2010 S
8791560 Hu Jul 2014 B2
9082626 Gatterbauer Jul 2015 B2
D774477 Venk Dec 2016 S
Divisions (2)
Number Date Country
Parent 29584216 Nov 2016 US
Child 29680129 US
Parent 29486410 Mar 2014 US
Child 29584216 US