Claims
- 1. A process for stabilizing the electroconductive properties of a mass of electroconductive metallic powder having a protective coating formed thereon of a silicide, nitride, carbide or boride of said electroconductive metal by treating the surface of said powder by
- (a) dispersing said metal powder in a reaction medium;
- (b) adding a known amount of sulfur to such medium and reacting said dispersed metal powder with said
- (c) said known amount of sulfur effective to improve the corrosion resistance of powder.
- 2. A process as defined in claim 1 wherein said reaction medium is a sulfur-free organic liquid, in which said powder is slurred and when said sulfur is added to said medium in the form of a organosulfur compound.
- 3. A process as defined in claim 1 wherein said process comprises, in addition to said reaction between metal powder and sulfur, a reaction of said metal with carbon supplied to said slurry in the form of a decomposable hydrocarbon gas.
- 4. A process as defined in any of claims 1, 2 or 3 wherein said process comprises reacting said metal surface with a quantity of sulfur of between about 4.times.10.sup.-4 to about 12.times.10.sup.-4 parts by weight of sulfur per square meter of metal to be treated.
- 5. A process as defined in claim 1 or 4, wherein said process comprises the step of subjecting the powder to hydrogen during the reacting of sulfur therewith.
- 6. A process as defined in claim 1, 2, or 3 wherein said metal being treated is nickel.
- 7. A process as defined in claim 4 wherein said metal being treated is nickel.
- 8. A process as defined in claim 5 wherein said metal being treated is nickel.
- 9. A process as defined in claim 1, comprising the step of subjecting the powder to hydrogen during the reacting of sulfur therewith.
Parent Case Info
This is a division of application Ser. No. 017,419 filed Mar. 5, 1979 now U.S. Pat. No. 4,347,165.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4218507 |
Deffeyes et al. |
Aug 1980 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
17419 |
Mar 1979 |
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