Claims
- 1. A method of producing a connecting structure for covered wires, the method comprising the steps of:preparing a first covered wire having a first conductor covered with a first resinous cover and a second covered wire having a second conductor covered with a second resinous cover; overlaying the second covered wire on the first covered wire cross each other; interposing respective overlapping portions of the first and second covered wires between an upper resin tip and a lower resin tip; and oscillating the upper and lower resin tips with ultrasonic waves while compressing the upper and lower resin tips from the outside, whereby the first and second resinous covers of the first and second covered wires are molten for removal thereby to bring the first conductor of the first covered wire into electrical contact with the second conductor of the second covered and simultaneously, the upper and lower resin tips are mutually welded to each other thereby to seal up the surroundings of a contact between the first conductor and the second conductor; wherein each of the upper and lower resin tips is provided, on its butt face being abutted against the other resin, with a wire receiving groove which has a semi-circular cross section of a diameter corresponding to the diameter of the first covered wire.
- 2. A method as claimed in claim 1, wherein the first covered wire is a shield wire, while the second wire is a ground wire and wherein the first conductor is a shield conductor of the shield wire, while the second conductor is a core line of the ground wire.
- 3. A method as claimed in claim 1, wherein the upper resin tip is provided, at an intermediate portion of the wire receiving groove in the longitudinal direction, with a press part which serves to urge the second covered wire against the first covered wire and of which depth is smaller than the other portion of the wire receiving groove.
- 4. A method as claimed in claim 1, wherein each of the upper and lower resin tips is provided, on an outer edge of the butt face, with a recess for fitting the second resinous cover of the second covered wire.
- 5. A method as claimed in claim 1, wherein the upper resin tip is provided, on a part of the butt face contacting the second covered wire, with a protrusion for concentrating an ultrasonic energy in oscillating the upper and lower resin tips with ultrasonic waves.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-50955 |
Mar 1998 |
JP |
|
Parent Case Info
This is a division of application Ser. No. 09/260,541, filed Mar. 19, 1999, the entire disclosure of which is incorporated herein by reference.
US Referenced Citations (16)
Foreign Referenced Citations (2)
Number |
Date |
Country |
838 883 |
Apr 1998 |
EP |
7-320842 |
Dec 1995 |
JP |