Claims
- 1. A method of producing a connecting structure for covered wires, the method comprising the steps of:preparing a first covered wire having a first conductor covered with a first resinous cover and a second covered wire having a second conductor covered with a second resinous cover; preparing upper and lower resin tips, one of the upper and lower resin tips being provided, on an entire periphery of a butt thereof to be abutted against the other resin tip, with a projecting rim and the other of the upper and lower resin tips being provided, on an entire periphery of a butt face thereof to be abutted against the other resin tip, with a recessed rim; overlaying the second covered wire on the first covered wire cross each other; interposing respective overlapping portions of the first and second covered wires between the upper resin tip and the lower resin tip; integrating the upper and lower resin tips by engaging the projecting rim with the recessed rim; and oscillating the upper and lower resin tips with ultrasonic waves while compressing the upper and lower resin tips from the outside, whereby the first and second resinous covers of the first and second covered wires are molten for removal thereby to bring the first conductor of the first covered wire into electrical contact with the second conductor of the second covered wire and simultaneously, the upper and lower resin tips are mutually welded to each other thereby to seal up an area surrounding a contact between the first conductor and the second conductor.
- 2. A method as claimed in claim 1, wherein the first covered wire is a shield wire, while the second wire is a ground wire and wherein the first conductor is a shield conductor of the shield wire, while the second conductor is a core line of the ground wire.
- 3. A method as claimed in claim 1, further comprising the step of arranging the second covered wire across the projecting rim and the recessed rim with a portion of the second covered wire withdrawn to the exterior of the upper and lower resin tips.
- 4. A method as claimed in claim 1, wherein each of the upper and lower resin tips is provided, on its butt face being abutted against the other resin tip, with a wire receiving groove which has a semi-circular cross section having a diameter substantially equal to a diameter of the first covered wire.
Priority Claims (1)
Number |
Date |
Country |
Kind |
P10-50991 |
Mar 1998 |
JP |
|
Parent Case Info
This is a division of application Ser. No. 09/260,547, filed Mar. 2, 1999, which is incorporated herein by reference.
US Referenced Citations (17)
Non-Patent Literature Citations (1)
Entry |
United Kingdom Search Report, May 1999. |