This application is the national phase under 35 U.S.C. §371 of PCT International Application No. PCT/EP2013/052271 which has an International filing date of Feb. 6, 2013, which designated the United States of America, which claims priority under 35 U.S.C. §119 to German patent application number DE 1020120078706 filed Apr. 18, 2012 and German patent application number DE 1020120035373 filed Feb. 26, 2012, the entire contents of each of which are hereby incorporated herein by reference.
Example embodiments relate to a connection of a first metal component to a covered second metal component. Example embodiments furthermore relate to a method for producing a connection of the above connection.
If moisture is allowed to reach the connection between the aforementioned components, which is usually produced by welding, a rapid corrosion of the aluminum must be feared which has a negative effect on the cable strength and thus the operational safety of the complete onboard power supply.
To be sure, attempts have previously been made to seal the connecting location between the components against moisture by using shrink-wrap hose and/or by using shrink-wrap hose/butyl strip seals and/or through insert-molding with polymers. These known sealing systems, however, cannot be used in practical operations for the temperature range of approximately −40° C. to approximately +230° C. and will therefore fail. Furthermore detrimental for a good sealing effect are the widely varying expansion coefficients of the materials used.
A method for covering micro-electric hybrid semiconductor circuits or micro-electronic semiconductor components is known from the DE 34 42 131 A1. With said method, the components located on a substrate are covered by pouring a soft, sealing layer of plastic over them, covering this layer with a compound foil of plastic and metal, and subsequently encapsulating it with synthetic resin. With this relatively involved method, a low-viscous, liquid elastomer is applied, for example, to form the soft sealing layer of synthetic material. A composite foil of plastic and metal is then placed onto this layer and is pressed against it with a hollow punch. A synthetic resin, especially a highly filled epoxy casting resin, is then used for the insert-molding or encapsulation.
A method for covering electric and electronic components or assemblies is known from the EP 0 361 194 A2, for which an intermediate layer of an elastic synthetic material is initially applied to the mechanically sensitive regions, which are then covered with an outer cover layer of a mechanically and chemically stable synthetic material. In the process, the outer covering layer as well as the intermediate layer are produced through injection-molding with molding compound in an injection molding tool. During the injection molding process, however, components to be encapsulated are subjected to relatively high pressure and temperature stresses.
The DE 10 2004 062 457 A1 discloses a water-absorbing composition with suppressed corrosiveness when in the swollen state, relative to copper, wherein its use is known for cable sheaths and for a sheathed cables.
Example embodiments to provide an improved connection between components made of different metals.
Example embodiments relate to a first metal component, which may be a copper component, for example, while a second metal component, which may be an aluminum component, for example. For reasons of cost reduction and to save weight, aluminum cables are increasingly used in the field of automotive manufacturing. The cable ends may be generally provided with lugs made of copper or other metals which permit a fastening of the cables. When used in motor vehicles, cables of this type may be subjected to extreme stresses, for example, in particular to temperature changes, vibration stresses and the effects of moisture.
Extensive testing during practical operations has shown that the connection embodied according to example embodiments can withstand stresses caused by temperature changes in a temperature range between approximately −40° C. and +190° C., with strong mechanical vibration stress and high moisture over long periods of time. Even after subjecting the connection for many hours to a continuous temperature of 180° C. and temperature peaks of approximately up to 230° C., no failure of the connection could be detected. It can therefore be expected that when using the connection designed according to example embodiments, the operational safety can clearly be improved.
An exemplary embodiment of the invention is explained in further detail in the following, with reference to the drawing.
Shown are in:
The connection according to example embodiments is explained in the following with reference to the drawing and an exemplary embodiment in the form of a cable manufactured with a cable lug.
An advantageous method for producing the connection according to example embodiments is described in the following with the aid of an example for producing a cable 1 with cable lug 2. The cable 1 may be an aluminum cable that is sheathed with a sheath 1.2 of a polyorganosiloxane, for example, high temperature vulcanization (HTV). The cable lug 2 may consist of copper, which is covered with a contact layer of nickel phosphorous (NiP), having a thickness of approximately 0.3 to 5 μm and, in particular, of 0.5 to 3 μm. In the connecting region, the conductor 1.1 of aluminum may be exposed by removing the silicon sheath 1.2. The cable lug 2 and the aluminum cable 1 may be preferably connected with the aid of ultrasonic welding. The silicon sheath 1.2 of the cable 1 may be first cleaned with cellulose and isopropanol. This is followed by a surface activation of the cable 1 in the connecting region and the cable lug 2 in an insulated atmospheric plasma. The connecting region may then be insert-molded in the connecting region with polyorganosiloxane (2k-LSR, liquid silicon rubber, 2 components), which is subsequently cross-linked at a temperature ranging from approximately 160° C. to approximately 210° C., in particular at a temperature ranging from approximately 170° C. to approximately 210° C.
Subsequent examinations of the connecting location have shown that the applied 2k silicon (LSR) has bonded with the 1k silicon (HTV) of the cable sheath, so as to advantageously form a permanent and durable, moisture resistant connection. An extraordinarily strong, moisture-resistant connection was also detected between the NiP layer of the cable lug and the applied 2k silicone following the cross-linkage.
While a number of example embodiments have been disclosed herein, it should be understood that other variations may be possible. Such variations are not to be regarded as a departure from the spirit and scope of the present disclosure, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Number | Date | Country | Kind |
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10 2012 003 537 | Feb 2012 | DE | national |
10 2012 007 870 | Apr 2012 | DE | national |
Filing Document | Filing Date | Country | Kind |
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PCT/EP2013/052271 | 2/6/2013 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2013/124151 | 8/29/2013 | WO | A |
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3442131 | May 1986 | DE |
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Entry |
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International Search Report PCT/ISA/210 for International Application No. PCT/EP2013/052271 Dated May 10, 2013. |
Written Opinion of the International Searching Authority PCT/ISA/237 for International Application No. PCT/EP2013/052271 dated May 10, 2013. |
Number | Date | Country | |
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20140370763 A1 | Dec 2014 | US |