Patent Grant
7588463
The present invention is related to and claims priority of the following co-pending applications, namely, Japanese Patent Applications Nos. 2007-117407 filed on Apr. 26, 2007 and 2007-323626 filed on Dec. 14, 2007.
1. Field of the Invention
The present invention relates to a type of connector including a plurality of contact modules, and further relates to a method of producing this type of connector.
2. Description of the Prior Art
In recent years, information and communication apparatuses, broadcast and video apparatuses, control devices for factory automation systems, medical equipment, semi-conductor manufacturing equipment, semi-conductor testers, etc., have been required to process enormous volumes of data at a high speed with a high degree of precision. Therefore, connectors for these apparatuses or devices are required to have a high shielding capability.
The connector (the plug connector 3) disclosed in Japanese unexamined patent publication 2005-197163 is provided with a front housing 5 and a plurality of contact modules 6 which are fixed to the front housing 5 to be arranged in layers in a specific direction.
Each contact module 6 includes an insulator 28, a plurality of signal contacts 16 fixed to the insulator 28, and a plurality of shielding members (the first ground plates 14 and the second ground plates 15) which are made of metal by insert molding and embedded in the insulator 28. One end of each signal contact 16 is connected to a board (electrical circuit board), while the other end of each signal contact 16 is connectable with contact pins of another connector (the receptacle connector 4), respectively.
Each of the first and second ground plates 14 and 15 includes a plurality of substantially L-shaped portions 18 and a plurality of protrusion-shaped ribs 22. The substantially L-shaped portions 18 and the protrusion-shaped ribs 22 partly surround the signal contacts 16 in the insulator 28 to shield each signal contact 16 electromagnetically.
However, in the connector disclosed in the aforementioned patent publication, the connector needs to be provided with shielding members (the first ground plates 14 and the second ground plates 15) and also needs to be formed in a complicated shape in order to exhibit a shielding effect. Therefore, the number of elements of the connector increases; moreover, it is difficult to increase productivity, and accordingly, the cost of production tends to increase.
In addition, although the metal-made shielding members are provided for the purpose of surrounding the signal contacts 16, the internal area and the external surface area of an integrally-molded product 27 (i.e., the portion of the contact module 6 excluding the signal contacts 16) in which no shielding member exits are large, and accordingly, it is hard to obtain a sufficient shielding effect.
Additionally, since the plurality of shielding members are embedded in the insulator 28, it is difficult to miniaturize the integrally-molded product 27 (it is difficult for the integrally-molded product 27 to have a high a space-saving efficiency). Accordingly, each contact module 6 becomes large in size, thus increasing the dimensions of the connector.
Additionally, since the plurality of shielding members are embedded in the insulator 28, it is difficult to achieve a higher density in each contact module 6 (i.e., increase the number of the signal contacts 16 in each contact module 6 with no increase in size of each contact module 6).
The present invention provides a simple and easy-to-produce connector (receptacle/plug) having a small number of elements, wherein a high-shielding capability is obtained even if each contact module is miniaturized.
According to an aspect of the present invention, a receptacle is provided, including a plurality of contact modules, each of which includes a plurality of contacts, one of common ends of the contacts being connected to a corresponding plurality of contact pins of a plug, respectively, when the receptacle and the plug are connected to each other, and the other of the common ends of the contacts being connected to a circuit board. Each of the plurality of contact modules includes a plurality of holding plates arranged in a direction of thickness of the each contact module. At least one conductive layer and at least one insulating portion are formed on each of opposed surfaces of adjacent holding plates of the plurality of holding plates, and at least one of the plurality of contacts is held between the insulating portions that are formed on the opposed surfaces of the adjacent holding plates, respectively.
In an embodiment, a plug is provided, including a plurality of contact modules, each of which includes a plurality of contact pins, one of common ends of the contact pins being inserted into a receptacle to be connected to a corresponding plurality of contacts included in the receptacle, respectively, when the plug and the receptacle are connected to each other, and the other of the commons ends of the plurality of contact pins being connected to a circuit board. Each of the contact modules includes a plurality of holding plates arranged in a direction of thickness of the each contact module. At least one conductive layer and at least one insulating portion are formed on each of opposed surfaces of adjacent holding plates of the holding plates. At least one of the contact pins is held between the insulating portions that are formed on the opposed surfaces of the adjacent holding plates, respectively. It is desirable for each of the plurality of contact modules to include two adjacent holding plates of the plurality of holding plates.
It is desirable for each of the plurality of contact modules to include at least three holding plates of the plurality of holding plates.
Accordingly, the receptacle and the plug achieve a smaller number of elements and are simpler in structure than those of conventional connectors using one or more metal-made shielding members in either case where the contact or contact pins of the receptacle and the plug are constituted by the same type of contacts or contact pins (this case also includes both the case of single-ended signaling and the case of differential signaling, as described above, and where the contact or contact pins of the receptacle and the plug are constituted by two types of contacts or contact pins.
Moreover, since no metal shielding member becomes no longer necessary, each contact module can be made smaller than before and the contacts or contact pins in each contact module can be further densified in the case where each contact module is provided therein with the same number of contacts or contact pins as a conventional contact module.
Furthermore, the shielding effect of the connector (receptacle/plug) can be enhanced because the surface area of each conductive layer can be increased. Accordingly, the connector (receptacle/plug) according to the present invention makes high-speed signal transmission possible.
It is desirable for the opposed surfaces of the adjacent holding plates to include first opening recesses and second opening recesses, respectively, the first opening recesses and second opening recesses being open at common end surfaces of the adjacent holding plates, respectively. Engaging holes, through which an outside and an inside of the each contact module are communicatively connected to each other, is formed by the first opening recesses and the second opening recesses upon the adjacent holding plates being joined to each other. Electrical continuity is established between the contacts of the each contact module and the contact pins of the plug upon the contact pins of the plug being inserted into the each contact module through the engaging holes, respectively.
It is desirable for the opposed surfaces of the adjacent holding plates to include first opening recesses and second opening recesses, respectively, the first opening recesses and the second opening recesses being open at common end surfaces of the adjacent holding plates, respectively. Engaging holes through which outside and inside of the each contact module are communicatively connected to each other are formed by the first opening recesses and the second opening recesses upon the adjacent holding plates being joined to each other. The contact pins project to the outside of the each contact module through the engaging holes.
Accordingly, the connector (receptacle/plug) does not have to be provided with a housing that is an indispensable element of a convention connector, which achieves a further reduction in the number of elements of the connector.
It is desirable for at least one of the adjacent holding plates to include a plurality of contact holding grooves formed on the insulating portion, the contacts being engaged in the contact holding grooves to be held thereby, respectively.
It is desirable for some of the contacts to be held between the insulating portions formed on the adjacent holding plates, and for the remainder of the plurality of contacts to be held between the conductive layers formed on the adjacent holding plates.
It is desirable for a plurality of the insulating portions to be formed on each of the opposed surfaces of the adjacent holding plates with the conductive layer on the each of the opposed surfaces of the adjacent holding plates being provided on opposite sides of each of the plurality of insulating portions. Only one of the contacts is held between each of the insulating portions that are formed on the opposed surfaces of the adjacent holding plates, respectively.
Accordingly, each contact or contact pin can be securely held by the adjacent holding plates.
It is desirable for the conductive layer to be formed entirely over each of the opposed surfaces of the adjacent holding plates of the plurality of holding plates, and for the insulating portion to be formed partly on the conductive layer.
Accordingly, since the range of shielding by the conductive layer with respect to the contacts or contact pins that are held by the associated insulating portions widens, a far superior shielding effect is achieved.
It is desirable for the conductive layer to cover a pair of side edges of each of the insulating portions positioned on both sides of the plurality of contacts.
Accordingly, if each contact or contact pin is held between the insulating portions formed on the opposed surfaces of the adjacent holding plates, the perimeter of each contact or contact pin is perfectly shielded since each contact or contact pin is totally surrounded by the conductive layers of a pair of holding plates. Accordingly, an extremely superior shielding effect is obtained.
It is desirable for a continuous conductive layer to be formed on all surfaces of the adjacent holding plates other than the opposed surfaces of the adjacent holding plates.
If the conductive layer portion is formed entirely over the surface of each holding plate in such a manner, the surface area of each conductive layer becomes extremely large, so that a far superior shielding effect is achieved.
It is desirable for each of the plurality of holding plates to include a conductive layer portion including a resin-made substrate on which the conductive layer is plated, and at least one insulation recess formed on a surface which faces the other of the adjacent holding plates; and for the insulating portion to be made of a resin material and be provided in the insulation recesses so as to occupy the insulation recesses.
Accordingly, the holding plates can be easily produced.
It is desirable for the receptacle to include a retainer which is attached to a contact module group formed by the plurality of contact modules arranged in layers to combine the plurality of contact modules into one integral module.
Accordingly, the contact module group can be easily combined into one integral body.
In an embodiment, a method is provided for making a receptacle with a plurality of contact modules, each of which includes a plurality of contacts, one of common ends of the contacts being connected to a corresponding plurality of contact pins of a plug, respectively, when the receptacle and the plug are connected to each other, and the other of the common ends of the contacts being connected to a circuit board. The method includes forming a plurality of conductive layer portions which each include a resin-made substrate which has been plated; forming a plurality of holding plates by putting a resin-made insulating portion on each of the conductive layer portions so as to occupy a part of a surface thereof; forming the contact modules by arranging the holding plates in a direction of thickness of the each contact module and by joining opposed surfaces of adjacent holding plates thereof, on which the insulating resin-made insulating portion is placed, to each other so that at least one of the contacts is held between the insulating portions that are formed on the opposed surfaces of the adjacent holding plates; and connecting the contact modules into one integral module.
Accordingly, a receptacle which includes contact modules which are simple in structure with a small number of elements and which can achieve a high shielding capability even if the size of each contact module is reduced, can be easily produced.
In an embodiment, a method is provided for making a plug with a plurality of contact modules each of which includes a plurality of contact pins, one of common ends of the contact pins being inserted into a receptacle to be connected to a corresponding plurality of contacts included in the receptacle, respectively, when the plug and the receptacle are connected to each other, and the other of the common ends of the plurality of contact pins being connected to a circuit board. The method includes forming a plurality of conductive layer portions which each include a resin-made substrate which has been plated, respectively; forming a plurality of holding plates by putting a resin-made insulating portion on each of the conductive layer portions so as to occupy a part of a surface thereof; forming the contact modules by arranging the holding plates in a direction of thickness of the each contact module and by joining opposed surfaces of adjacent holding plates thereof, on which the insulating resin-made insulating portion is placed, to each other so that at least one of the contact pins is held between the insulating portions that are formed on the opposed surfaces of the adjacent holding plates; and connecting the contact modules into one integral module.
Similarly, a plug which includes contact modules which are simple in structure with a small number of elements and which can achieve a high shielding capability even if the size of each contact module is reduced, can be easily produced.
It is desirable for the connecting of the contact modules into one integral module to include arranging the plurality of contact modules in layers to form a contact module group, and attaching a retainer to the contact module group.
Accordingly, a connector (receptacle/plug) can be easily produced since the contact module group can be easily combined into one integral body.
The present invention will be discussed below in detail with reference to the accompanying drawings, in which:
A first embodiment of a connector according to the present invention will be discussed below with reference to
As shown in
As shown in
The receptacle 30 will be discussed with reference mainly to
Each contact module 31 is provided with a pair of holding plates 33 and 34, two of the ground contacts 65A and 65D and four of the signal contacts 65B, 65C, 65E and 65F.
As discussed below, the holding plate 33 shown in
A conductive layer portion (conductive layer) 35 serving as a base of the holding plate 33 is made by firstly being molded from an insulating synthetic resin into the shape shown in
The method of applying such plating can be a so-called resin plating method or thin-film forming method (evaporation method, spattering, etc.). In the case of the resin plating method, firstly a molded member (molding) as a base of the conductive layer portion 35 is subjected to a grease removing process to remove grease from the outer surface of the molded member, a cleaning process to cleanse the outer surface of the molded member and thereafter a surface activating process to activate the outer surface of the molded member by catalysis. Thereafter, the molded member is given electroless plating, nickel strike plating, electric copper plating, nickel plating, and finish plating in that order. Alternatively, the conductive layer portion 35 can be molded by MID (molded interconnect device).
As shown in the drawings, the conductive layer portion 35 is provided on the inner surface thereof with two insulation recesses 36 and 37 which are open to both the front end surface and the bottom end surface of the conductive layer portion 35. The conductive layer portion 35 is further provided, on two ribs formed on the inner surface of the conductive layer portion 35 which are respectively adjacent to the two insulation recesses 36 and 37, with two opening recesses 39 and two end accommodation grooves (ground-contact holding grooves) 40 positioned immediately behind the two opening recesses 39, respectively. The two opening recesses 39 are elongated rearward from the front end surface of the conductive layer portion 35, and the two end accommodation grooves 40 are communicatively connected with the rear ends of the two opening recesses 39 and are greater in width than the two opening recesses 39, respectively. The conductive layer portion 35 is further provided, on the inner surface thereof in the vicinity of the upper rear corner of the conductive layer portion 35, with a circular-columnar-shaped engaging recess (bottomed hole) 41 and an elongated insertion hole (through-hole) 42.
An insulating portion 43 made of an insulating synthetic resin is molded with the use of molding dies (not shown) to be integral with the inner surface of the conductive layer portion 35, which is molded in the above described manner, so that the two insulation recesses 36 and 37 are provided (occupied) with the insulating portion 43 as shown in
The two holding plates 33 and 34 of each contact module 31 are substantially bilaterally symmetrical in shape; however, the holding plate 34 is partly different in shape from the holding plate 33.
A conductive layer portion (conductive layer) 48 of the holding plate 34, which is shown in
The side edges (upper and lower side edges) of each insulating portion 43 and 55 in each associated insulation recess (36, 37, 49 and 50) are covered by the associated conductive layer.
The two ground contacts 65A and 65D and the four signal contacts 65B, 65C, 65E and 65F, which are held between the two holding plates 33 and 34, are stamp molded out of metal. More specifically, to make each contact 65A through 65F, a base material (e.g., phosphor bronze, beryllium copper, titanium copper, stainless steel, or Corson-copper alloy) is coated firstly with a base plating (e.g., nickel (Ni) plating), and subsequently with a finish plating (e.g., gold(Au) plating, tin(Sn)-copper(Cu) plating, or tin(Sn)-lead(Pb) plating). The side shapes of the ground contacts 65A and 65D and the signal contacts 65B, 65C, 65E and 65F are all in the shape of a substantially letter L and mutually different in length. The front ends and the lower ends of all the ground contacts 65A and 65D and the signal contacts 65B, 65C, 65E and 65F are formed as bifurcated resilient (spring) portions 66 and press-fit terminals 67, respectively.
The ground contacts 65A and 65D, the signal contacts 65B, 65C, 65E and 65F and the two holding plates 33 and 34 are combined into one integral component in the following manner.
First of all, the bifurcated resilient portions 66 of the ground contacts 65A and 65D are respectively accommodated in the two end accommodation grooves 52, and middle portions (conductive positions) of the ground contacts 65A and 65D between the bifurcated resilient portions 66 and the press-fit terminals 67 thereof are respectively held by the two communication grooves 53 (with projections (not shown) which are formed on the aforementioned conductive portions of the ground contacts 65A and 65D pressing against side surfaces of the two communication grooves 53, respectively ) so that the press-fit terminals 67 of the ground contacts 65A and 65D project downward from the bottom end of the holding plate 34. At the same time, the bifurcated resilient portions 66 of the signal contacts 65B, 65C, 65E and 65F are respectively accommodated in the four end accommodation grooves 57, and middle portions (conductive positions) of the signal contacts 65B, 65C, 65E and 65F between the bifurcated resilient portions 66 and the press-fit terminals 67 thereof are respectively held by the four communication grooves 58 (with projections (not shown) which are formed on the aforementioned conductive portions of the signal contacts 65B, 65C, 65E and 65F pressing against side surfaces of the four communication grooves 58, respectively ) so that the press-fit terminals 67 of the signal contacts 65B, 65C, 65E and 65F project downward from the bottom end of the holding plate 34.
Subsequently, the inner surface of the holding plate 33 is combined with the inner surface of the holding plate 34 to which the ground contacts 65A and 65D and the signal contacts 65B, 65C, 65E and 65F have been installed while the engaging projections 54 and 59 of the holding plate 34 are fitted into the engaging recesses 41 and 46, respectively. Thereupon, the bifurcated resilient portions 66 of the ground contacts 65A and 65D are accommodated in the two end accommodation grooves 40 of the conductive layer portion 35 of the holding plate 33, respectively, the bifurcated resilient portions 66 of the signal contacts 65B, 65C, 65E and 65F are accommodated in the four end accommodation grooves 45 of the conductive layer portion 35 of the holding plate 33, respectively, the inner surfaces of the conductive layer portions 35 and 48 come in intimate contact with each other, and the inner surfaces of the insulating portions 43 and 55 come in intimate contact with each other. In addition, the two opening recesses 39 of the holding plate 33 and the two opening recesses 51 of the holding plate 34, which face each other, form two engaging holes 69 at the front end of the contact module 31, and the two opening recesses 44 of the holding plate 33 and the two opening recesses 56 of the holding plate 34, which face each other, form two engaging holes 70 at the front end of the contact module 31 (see
Ten of the contact modules 31, each of which is assembled in the above described manner, are arranged in layers in the left-right direction as shown in
After the receptacle 30 is assembled in the above described manner, the press-fit terminals 67 of the ground contacts 65A and 65D and the signal contacts 65B, 65C, 65E and 65F are driven (press-fitted) into the through holes formed in the aforementioned circuit board (not shown), respectively. Thereupon, the press-fit terminals 67 of the ground contacts 65A and 65D are connected to a ground pattern on this circuit board, and the press-fit terminals 67 of the signal contacts 65B, 65C, 65E and 65F are connected to a circuit pattern on this circuit board.
When the receptacle 30 and the plug 20, each of which having the above described structure, are connected to each other as shown in
Therefore, the ground contact pins 25A and 25D of the plug 20 are electrically connected to a ground pattern formed on a circuit board on the receptacle 30 side, and the ground contacts 65A and 65D of the receptacle 30 are electrically connected to a ground pattern formed on a circuit board on the plug 20 side. Similarly, the signal contact pins 25B, 25C, 25E and 25F of the plug 20 are electrically connected to a circuit pattern formed on the circuit board on the receptacle 30 side, and the signal contacts 65B, 65C, 65E and 65F of the receptacle 30 are electrically connected to a circuit pattern formed on the circuit board on the plug 20 side.
In the above illustrated first embodiment of the connector, the peripheries of the signal contacts 65B, 65C, 65E and 65F are totally covered by the insulating portions 43 and 55; moreover, the peripheries of the insulating portions 43 and 55 are totally covered by the insulation recesses 36 and 37 and the insulation recesses 49 and 50 that are formed on the conductive layer portions 35 and 48, respectively. Due to this structure, the signal contacts 65B, 65C, 65E and 65F are securely shielded by the inner surfaces of the insulation recesses 36, 37, 49 and 50 (which makes it possible to prevent the signal contacts 65B, 65C, 65E and 65F from both picking up noise from the outside and leaking noise caused by themselves during signal transmission in an extremely effective manner). Accordingly, the connector 10 which has superior shielding characteristics and makes a high-speed signal transmission possible is achieved.
Moreover, the surface areas of the conductive layer portions 35 and 48 are large because the conductive layer portions 35 and 48 are formed over the entire surface of the holding plates 33 and 34 and because a surface (inner surface) of the conductive layer portion 35 of the holding plate 33 which faces the other holding plate 34 is provided with recesses (the insulation recesses 36 and 37) and a surface (inner surface) of the conductive layer portion 48 of the holding plate 34 which faces the other holding plate 33 is also provided with recesses (the insulation recesses 49 and 50).
Furthermore, the connector can be easily produced with no decrease in productivity even if the holding plates 33 and 34 (conductive layer portions and insulating portions) that are elements of each contact module 31 include complicated shapes such as the insulation recesses and the contact holding grooves because each holding plate 33 and 34 is a molded member made of synthetic resin.
Furthermore, since no shielding member made of metal is embedded in each contact module 31, the number of elements of the connector can be reduced as compared with conventional contacts; moreover, each contact module 31 can be miniaturized in the case where the present embodiment of the connector is provided therein with the same number of contacts as a conventional contact.
Furthermore, since the contact modules 31 are joined together by the retainer 75 to be made as an integral member instead of using a housing that was an indispensable element of a conventional connector, in this respect also it can be said that the present embodiment of the connector is easy to produce (assemble).
In addition, since the ground contacts 65A and 65D and the signal contacts signal contacts 65B, 65C, 65E and 65F are held between the end accommodation grooves 40 and 45, which are recessed in the holding plate 33, and the end accommodation grooves 52, the communication grooves 53, the end accommodation grooves 57 and the communication grooves 58, which are recessed in the holding plate 34, the ground contacts 65A and 65D and the signal contacts signal contacts 65B, 65C, 65E and 65F can be firmly held and retained by the holding plates 33 and 34 and easily produced with a high degree of productivity.
A second embodiment of the connector according to the present invention will be discussed below with reference to
As shown in
Firstly, the receptacle 130 will be discussed with reference mainly to
The receptacle 130 is provided with three contact modules (two contact modules 131 and a contact module 132), a connecting bar 173 and a retainer 175 as relatively large elements of the receptacle 130.
First of all, the structures of the two contact modules 131 will be discussed hereinafter.
Among the three contact modules 131 and 132, each of the two contact modules 131 that are positioned on the laterally opposite sides of the contact module 132 is provided with two holding plates (side holding plates) 133 and 134, a holding plate (center holding plate) 138 positioned between the two holding plates 133 and 134, four ground contacts 165A and 165D and eight signal contacts 165B, 165C, 165E and 165F.
As shown in
A conductive layer portion (conductive layer) 135 serving as a base of the holding plate 133 in each contact module 131 is made by firstly being molded of an insulating synthetic resin into the shape shown in
As shown in the drawings, the conductive layer portion 135 is provided on the left side thereof with two insulation recesses 136 and 137 which are open to both the front end surface and the bottom end surface of the conductive layer portion 135. The conductive layer portion 135 is further provided, on two ribs formed on the left side of the conductive layer portion 135 which are respectively adjacent to the two insulation recesses 136 and 137, with two opening recesses 139, two end accommodation grooves (ground-contact holding grooves) 140 and two communication grooves (ground-contact holding grooves) 141, respectively. The two opening recesses 139 are elongated rearward from the front end surface of the conductive layer portion 135, the two end accommodation grooves 140 are communicatively connected to the rear ends of the two opening recesses 139 and are greater in width than the two opening recesses 139, respectively. The two communication grooves 141 extend from the two end accommodation grooves 140 to the rear ends of the aforementioned two ribs, respectively. Additionally, the conductive layer portion 135 is further provided on the left side thereof with four substantially circular-columnar-shaped engaging recesses 135A and two circular-columnar-shaped engaging pins 135B. The conductive layer portion 135 is further provided, at the upper front end and the upper rear end of the conductive layer portion 135, with a front engaging groove 135C and a rear engaging groove 135D, respectively. The conductive layer portion 135 is further provided, on the right side thereof in the vicinity of the bottom front corner of the conductive layer portion 135, with a key groove 135E having a rectangular shape as viewed from the right side of the conductive layer portion 135. As shown in
An insulating portion 143 made of an insulating synthetic resin is fitted into the left side of the conductive layer portion 135, which is molded in the above described manner as shown in
The two holding plates 133 and 134 of each contact module 131 are substantially bilaterally symmetrical in shape; however, the holding plate 134 is partly different in shape from the holding plate 133.
A conductive layer portion (conductive layer) 148 of the holding plate 134 is an element corresponding to the conductive layer portion 135 of the holding plate 133 (the material of the conductive layer portion 148 (including the material of plating) is the same as that of the conductive layer portion 135). The conductive layer portion 148 is molded with the use of molding dies (not shown) in the same manner as the conductive layer portion 135. The conductive layer portion 148 is provided, on the right side thereof at positions thereon which correspond to the positions of the two insulation recesses 136 and 137, with two insulation recesses 149 and 150. The two insulation recesses 149 and 150 and the two insulation recesses 136 and 137 are bilaterally symmetrical to each other (are mirror images to each other), respectively. The conductive layer portion 148 is further provided, on the right side thereof at positions thereon which correspond to the positions of the two opening recesses 139, the two end accommodation grooves 140 and the two communication grooves 141, with two opening-forming projecting portions 151, intermediate recessed portions 152 and two pressure ribs 153, respectively. One of the two pressure ribs 153 projects from the surface of a rib on the right side of the conductive layer portion 148 between the two insulation recesses 149 and 150, while the other of the two pressure ribs 153 projects from a portion on the right side of the conductive layer portion 148 directly below the insulation recess 150. Although none of the accompanying drawings shows the right side of the conductive layer portion 148, the two insulation recesses 149 and 150, the two opening-forming projecting portions 151, the intermediate recessed portions 152 and the two pressure ribs 153, which are formed on the right side of the conductive layer portion 148, are identical in shape and size to those formed on the right side of a conductive layer portion (conductive layer) 160 serving as a base of the holding plate 138 in each contact module 131. Accordingly,
The conductive layer portion 148 is provided with a front engaging groove 148C and a rear engaging groove 148D which correspond to the engaging groove 135C and the rear engaging groove 135D of the conductive layer portion 135, respectively. The conductive layer portion 148 is provided, on the right side at positions thereon which correspond to the positions of the four engaging recesses 135A, with four engaging projections 148A (see
An insulating portion 155 made of an insulating synthetic resin is fitted into the right side of the conductive layer portion 148. The insulating portion 155 is molded with the use of molding dies (not shown) separately from the conductive layer portion 148 (the material of the insulating portion 155 and the method of molding thereof are the same as those of the insulating portion 143).
The insulating portion 155 is provided on the right side thereof with four opening recesses 156 (see
The shape of the conductive layer portion 160 of the holding plate 138, which is held between the holding plates 133 and 134, is shown in
As shown in
After the conductive layer portion 160 is molded, the insulating portions 155 and 143, which are molded separately from the conductive layer portion 160, are fitted into the right and left sides of the conductive layer portion 160 to become integral therewith, which completes the holding plate 138.
Note that the side edges (upper and lower side edges) of each insulating portion 143 and 155 in each associated insulation recess (136, 137, 149 and 150) are covered by the associated conductive layer.
A set of six contacts are held between the insulating portion 143 of the holding plate 133 and the insulating portion 155 of the holding plate 138, and another set of six contacts are held between the insulating portion 155 of the holding plate 134 and the insulating portion 143 of the holding plate 138. Each of these two sets of contacts is composed of two ground contacts 165A and 165D and four signal contacts 165B, 165C, 165E and 165F. The two ground contacts 165A and 165D and the four signal contacts 165B, 165C, 165E and 165F are stamp molded out of metal. More specifically, to make each contact 165A through 165F, a base material (e.g., phosphor bronze, beryllium copper, titanium copper, stainless steel, or Corson-copper alloy) is coated firstly with a base plating (e.g., nickel (Ni) plating) and subsequently with a finish plating (e.g., gold(Au) plating, tin(Sn)-copper(Cu) plating, or tin(Sn)-lead(Pb) plating). The side shapes of the ground contacts 165A and 165D and the signal contacts 165B, 165C, 165E and 165F are all in the shape of a substantially letter L and mutually different in length. The front ends and the lower ends of all the ground contacts 165A and 165D and the signal contacts 165B, 165C, 165E and 165F are formed as bifurcated resilient (spring) portions 166 and press-fit terminals 167, respectively.
One set of six contacts (the ground contacts 165A and 165D, and the signal contacts 165B, 165C, 165E and 165F) (hereinafter referred to as a first set of contacts), another set of six contacts (the ground contacts 165A and 165D, and the signal contacts 165B, 165C, 165E and 165F) (hereinafter referred to as a second set of contacts) and the two of the holding plates 133, 134 and 138 are combined into one with these two sets of six contacts being held between the two holding plates 133 and 138 and between the two holding plates 134 and 138, respectively, in the following manner.
Firstly, the bifurcated resilient portions 166 of the ground contacts 165A and 165D of the first set of contacts are accommodated in the two end accommodation grooves 140 of the conductive layer portion 135 of the holding plate 133, respectively, and middle portions (conductive positions) of the ground contacts 165A and 165D of the first set of contacts between the bifurcated resilient portions 166 and the press-fit terminals 167 thereof are respectively held by the two communication grooves 141 of the conductive layer portion 135 of the holding plate 133 and the communication grooves 146 of the insulating portion 143 so that the press-fit terminals 167 of the ground contacts 165A and 165D of the first set of contacts project downward from the bottom end of the holding plate 133. On the other hand, the bifurcated resilient portions 166 of the ground contacts 165A and 165D of the second set of contacts are accommodated in the two end accommodation grooves 140 of the conductive layer portion 160 of the holding plate 138, respectively, and middle portions (conductive positions) of the ground contacts 165A and 165D of the second set of contacts between the bifurcated resilient portions 166 and the press-fit terminals 167 thereof are respectively held by the two communication grooves 141 of the conductive layer portion 160 of the holding plate 138 so that the press-fit terminals 167 of the ground contacts 165A and 165D of the second set of contacts project downward from the bottom end of the holding plate 138. At the same time, the bifurcated resilient portions 166 of the signal contacts 165B, 165C, 165E and 165F of the first set of contacts are accommodated in the four end accommodation grooves 145 of the insulating portion 143 of the holding plate 133, respectively, and middle portions (conductive positions) of the signal contacts 165B, 165C, 165E and 165F of the first set of contacts between the bifurcated resilient portions 166 and the press-fit terminals 167 thereof are respectively held by the two communication grooves 142 of the insulating portion 143 of the holding plate 133 so that the press-fit terminals 167 of the signal contacts 165B, 165C, 165E and 165F of the first set of contacts project downward from the bottom end of the holding plate 133. On the other hand, the bifurcated resilient portions 166 of the signal contacts 165B, 165C, 165E and 165F of the second set of contacts are accommodated in the four end accommodation grooves 145 of the insulating portion 143 of the holding plate 138, respectively, and middle portions (conductive positions) of the signal contacts 165B, 165C, 165E and 165F of the second set of contacts between the bifurcated resilient portions 166 and the press-fit terminals 167 thereof are respectively held by the two communication grooves 142 of the insulating portion 143 of the holding plate 138 so that the press-fit terminals 167 of the signal contacts 165B, 165C, 165E and 165F of the second set of contacts project downward from the bottom end of the holding plate 138.
Furthermore, the right side of the holding plate 138 (which includes the conductive layer portion 160 and the insulating portion 155) is combined with the left side of the holding plate 133 (which includes the conductive layer portion 135 and the insulating portion 143) to which the ground contacts 165A and 165D and the signal contacts 165B, 165C, 165E and 165F have been installed, and the right side of the holding plate 134 (which includes the conductive layer portion 148 and the insulating portion 155) is combined with the left side of the holding plate 138 (which includes the conductive layer portion 160 and the insulating portion 143). At this time, the four engaging projections 160A1 of the conductive layer portion 160 are fitted into the four engaging recesses 135A of the conductive layer portion 135, respectively, and the four engaging projections 148A of the conductive layer portion 148 are fitted into the four engaging recesses 160A2 of the conductive layer portion 160, respectively. Thereupon, the right side of the insulating portion 155 of the holding plate 134 comes into intimate contact with the left side of the insulating portion 143 of the holding plate 138, the right side of the insulating portion 155 of the holding plate 138 comes into intimate contact with the left side of the insulating portion 143 of the holding plate 133, the right side of the conductive layer portion 148 comes into intimate contact with the left side of the conductive layer portion 160, and the right side of the conductive layer portion 160 comes into intimate contact with the left side of the conductive layer portion 135. Additionally, the four opening recesses 144 of each insulating portion 143 and the four opening recesses 156 of the associated insulating portion 155, which face each other, form four engaging holes 169 at the front ends of the insulating portions 143 and 155 (see
Hence, each of the two contact modules 131 (the right contact module 131 and the left contact module 131) are assembled in the above described manner.
The structures of the contact module 132, which is held between the two contact modules 131, will be discussed hereinafter.
The contact module 132 is assembled by joining the left side of the holding plate 133 (which includes the conductive layer portion 135 and the insulating portion 143) and the right side of the holding plate 134 (which includes the conductive layer portion 148 and the insulating portion 155) to each other with a set of six contacts (the two grand contacts 165A and 165D and the four signal contacts 165B, 165C, 165E and 165F) being held between the holding plates 133 and 134. Upon the contact module 132 being assembled in this manner, the four engaging holes 169 and the two engaging holes 170 are formed at the front end of the contact module 132 (see
The manner of assembling the contact module 132 is similar to the manner of assembling each contact module 131. Namely, in the first place, the bifurcated resilient portions 166 of the ground contacts 165A and 165D are accommodated in the two end accommodation grooves 140 of the conductive layer portion 135 of the holding plate 133, respectively, and middle portions (conductive positions) of the ground contacts 165A and 165D between the bifurcated resilient portions 166 and the press-fit terminals 167 thereof are respectively held by the two communication grooves 141 of the conductive layer portion 135 of the holding plate 133 and the communication grooves 146 of the insulating portion 143 so that the press-fit terminals 167 of the ground contacts 165A and 165D project downward from the bottom end of the conductive layer portion 135 of the holding plate 133. Additionally, the bifurcated resilient portions 166 of the signal contacts 165B, 165C, 165E and 165F are accommodated in the four end accommodation grooves 145 of the insulating portion 143 of the holding plate 133, respectively, and middle portions (conductive positions) of the signal contacts 165B, 165C, 165E and 165F between the bifurcated resilient portions 166 and the press-fit terminals 167 thereof are respectively held by the two communication grooves 142 of the insulating portion 143 of the holding plate 133 so that the press-fit terminals 167 of the signal contacts 165B, 165C, 165E and 165F project downward from the bottom end of the conductive layer portion 135 of the holding plate 133. Furthermore, the right side of the holding plate 134 (which includes the conductive layer portion 148 and the insulating portion 155) is combined with the left side of the holding plate 133 (which includes the conductive layer portion 135 and the insulating portion 143) to which the ground contacts 165A and 165D and the signal contacts 165B, 165C, 165E and 165F have been installed, and the four engaging projections 148A of the conductive layer portion 148 are fitted into the four engaging recesses 135A of the conductive layer portion 135, respectively. Thereupon, the upper pressure rib 153 on the right side of the conductive layer portion 148 of the contact module 132 is in press contact with the left side of the ground contact 165D while the right side of the same ground contact 165D is in press contact with the bottom surface of the associated communication recess (contact holding recess) 141 of the conductive layer portion 135. Likewise, the lower pressure rib 153 on the right side of the conductive layer portion 148 of the contact module 132 is in press contact with the left side of the ground contact 165A while the right side of the same ground contact 165A is in press contact with the bottom surface of the associated communication recess 141 of the conductive layer portion 135. Moreover, the signal contacts 165B, 165C, 165E and 165F are held between the bottom surfaces (left sides) of the communication grooves (contact holding grooves) 142 of the insulating portion 143 of the holding plate 133 and the four pressure ribs 154 on the right side of the insulating portion 155 of the holding plate 134, respectively.
Two contact modules 131 and one contact module 132, each of which is assembled in the above described manner, are arranged in layers in the left-right direction as shown in
The connecting bar 173 is an element with a substantially L-shaped cross section which is substantially identical in length (in the left-right direction) to the contact module group 172, and is provided with an insertion jutting portion 174A and a contacting portion 174B.
The retainer 175 is an element having a substantially U-shaped cross section. The retainer 175 is provided with a vertical side 176, an upper side 177 and a lower side 178. The upper side 177 and the lower side 178 extend rearward from the upper and lower ends of the vertical side 176, respectively.
The vertical side 176 is provided with five columns of through holes 179 arranged in the left-right direction, wherein each column includes six through holes 179. Namely, a total of thirty through holes 179 are formed in the vertical side 176.
The lower side 178 is provided, in a central part on the top surface thereof, with a pair of guide keys (right and left guide keys) 180 which extend in the forward-rearward direction. The lower side 178 is provided, on the top surface thereof at the right and left ends thereof with a pair of guide keys 182 which extend in the forward-rearward direction. As shown in
The upper side 177 is provided at the rear end thereof with a pair of engaging projections (right and left engaging projections) 186. The upper side 177 is provided, at the rear end thereof between the pair of engaging projections 186, with an engaging projection 187 which is greater in width than each engaging projection 186. As shown in
The manner of combining the contact module group 172, the connecting bar 173 and the retainer 175 into one will be discussed hereinafter.
Firstly, the manner of combining the contact module group 172 and the retainer 175 will be discussed hereinafter.
In this case, firstly the retainer 175 is brought to approach the contact module group 172 as shown in
The contact module group 172 and the retainer 175 are combined into one integral module in the above described manner.
Next the manner of combining the contact module group 172 and the connecting bar 173 will be discussed hereinafter.
Upon completion of the contact module group 172, the rear engaging groove 135D of each conductive layer portion 135, the rear engaging groove 148D of each conductive layer portion 148D and the rear engaging groove 160D of each conductive layer portion 160 are aligned in the left-right direction to form a laterally-elongated engaging groove (see
After the completion of the receptacle 130 by combining the contact module group 172, the connecting bar 173 and the retainer 175 into one integral module in the above described manner, the press-fit terminals 167 of the ground contacts 165A and 165D and the signal contacts 165B, 165C, 165E and 165F, which project downward from a bottom surface of the receptacle 130, are driven (press-fitted) into through holes (not shown) formed in a circuit board CB1, respectively (see
Next, the plug 120 will be discussed with reference mainly to
The plug 120 is provided with two contact modules 121, a contact module 122, a connecting bar 173 and a retainer 110 as relatively large elements of the plug 120.
Each contact module 121 is identical in structure to each contact module 131 except that each contact module 121 is provided with four ground contact pins 125A and 125D and eight signal contact pins 125B, 125C, 125E and 125F, whereas each contact module 131 is provided with the four ground contacts 165A and 165D and the eight signal contacts 165B, 165C, 165E and 165F.
As shown in
The manner of assembling each contact module 121 is the same as the manner of assembling each contact module 131.
The contact module 122 is identical in structure to the contact module 132 except that the contact module 122 is provided with four ground contact pins 125A and 125D and eight signal contact pins 125B, 125C, 125E and 125F, whereas the contact module 132 is provided with four ground contacts 165A and 165D and eight signal contacts 165B, 165C, 165E and 165F.
The contact module 122 is assembled in the same manner as the contact module 132.
The retainer 110 is an element having a substantially H-shaped cross section. The retainer 110 is provided with a vertical side 111, an upper side 112 and a lower side 113. The upper side 112 extends both forward and rearward from the upper end of the vertical side 111. Likewise, the lower side 113 extends both forward and rearward from the lower end of the vertical side 111. The upper side 112 is provided with a contact-module retaining portion 112A and a receptacle retaining portion 112B which extend forward and rearward, respectively. Likewise, the lower side 113 is provided with a contact-module retaining portion 113A and a receptacle retaining portion 113B which extend forward and rearward, respectively.
The vertical side 111 is provided with five columns of through holes 114 arranged in the left-right direction, wherein each column includes six through holes 114. Namely, a total of thirty through holes 114 are formed in the vertical side 111. The contact-module retaining portion 113A is provided with a pair of guide keys 180, a pair of guide keys 182, two engaging keys 183, two engaging keys 184 and a pair of lock holes 185 which are all formed in the same manner as those of the retainer 175 (see
The plug 120 that has the above described structure is completed by mounting the retainer 110 and the connecting bar 173 to the contact module group 116 in the same manner as the receptacle 131 after the completion of the contact module group 116 by combining the two contact module 121 and the contact module 122 into one. Upon the vertical side 111 being mounted to the contact module group 116, the terminal contacts 126 of the ground contact pins 125A and 125D and the signal contact pins 125B, 125C, 125E and 125F project rearward from the vertical side 111 through the corresponding through holes 114 of the vertical side 111, respectively, as shown in
Upon the press-fit terminals 127 of the ground contact pins 125A and 125D being driven (press-fitted) into through holes (not shown) formed in a circuit board CB2 (see
When the receptacle 130 and the plug 120 that have the above described structures are connected to each other so that the receptacle retaining portion 112B of the retainer 110 covers the upper surface of the upper side 177 of the retainer 175 and so that the receptacle retaining portion 113B of the retainer 110 covers the bottom surface of the lower side 178 of the retainer 175 as shown in
Therefore, the ground contact pins 125A and 125D of the plug 120 are electrically connected to a ground pattern formed on the circuit board CB1 on the receptacle 130 side and the ground contacts 165A and 165D of the receptacle 130 are electrically connected to a ground pattern formed on the circuit board CB2 on the plug 120 side, while the signal contact pins 125B, 125C, 125E and 125F of the plug 120 are electrically connected to a circuit pattern formed on the circuit board CB1 on the receptacle 130 side and the signal contacts 165B, 165C, 165E and 165F of the receptacle 130 are electrically connected to a circuit pattern formed on the circuit board CB2 on the plug 120 side.
The above illustrated second embodiment of the connector 100 can obtain effects similar to those obtained in the first embodiment of the connector 10 because the basic structure of the second embodiment of the connector 100 is the same as the basic structure of the first embodiment of the connector 10.
In addition, since two sets of contacts 165A through 165F are sandwiched between three holding plates (133, 134 and 138) while two sets of contact pins 125A through 125F are sandwiched between three holding plates (133, 134 and 138) in each of the contact modules 121 and 131 of the second embodiment of the connector 100, each of the contact modules 121 and 131 of the second embodiment of the connector 100 have the following advantages with respect to each contact module 31 of the first embodiment of the connector 10, in which a set of contacts (65A through 65F) are sandwiched between two holding plates (33 and 34).
First of all, for instance, a total of four holding plates are required to sandwich two sets of contacts in the first embodiment of the connector, whereas a total of three holding plates can do the same in the second embodiment of the connector. Namely, according to the second embodiment of the connector, since the number of components, the number of assembly procedures, and the time required for the plating process performed on each component can be reduced, it is possible to achieve an improvement in productivity and a reduction in production cost.
Furthermore, since each of the contact modules 121 and 131 is composed of the two holding plates 133 and 134 and the holding plate 138 that is mechanically stronger and greater in thickness than either of the two holding plates 133 and 134, the mechanical strength of each contact module and the contact module group itself in the second embodiment of the connector can be made higher than that in the first embodiment of the contact module 31.
Moreover, more than one plug connector 120 or more than one receptacle 130 can be arranged in the left-right direction with all the contacts (125A through 125F and 165A through 165F) being positioned at regular intervals in the left-right direction because neither of the retainers 110 and 175 has side walls (either a left side wall or a right side wall) and because, among the three holding plates 133, 134 and 138 of the two contact modules 121 of the plug 120 that respectively include the left side portion and the right side portion of the plug 120, the two conductive layer portions 135 and 148 of each contact module 121 that respectively include the left side portion and the right side portion of each contact module 121 are each designed to be smaller in wall thickness than a half the wall thickness of the conductive layer portion 160, and further because, among the three holding plates 133, 134 and 138 of the two contact modules 131 of the receptacle 130 that respectively include the left side portion and the right side portion of the receptacle 130, the two conductive layer portions 135 and 148 of each contact module 131 that respectively comprise the left side portion and the right side portion of each contact module 131 are each designed to be smaller in wall thickness than a half the wall thickness of the conductive layer portion 160.
Furthermore, each contact pin (125A through 125F) of the plug 120 can be easily held at a predetermined position (i.e., all the contact pins 125A through 125F of the plug 120 can be placed in proper alignment) since the through holes 114 are formed in the vertical plate portion 111 of the retainer 110. Likewise, since the through holes 179 are formed in the vertical side 176 of the retainer 175, each contact pin (165A through 165F) of the receptacle 130 can be easily lead into the associated contact module 131 or 132 of the receptacle 130 (i.e., the ground contact pins 165A and 165D and the signal contact pins 165B, 165C, 15E and 165F of the receptacle 130 can be easily made contact with the ground contacts 125A and 125D and the signal contacts 125B, 125C, 125E and 125F of the plug 120, respectively).
Although the present invention has been described based on the above illustrated first and second embodiments of the connectors, the present invention is not limited solely to these embodiments; making various modifications to these embodiments is possible.
For instance, although each contact module 31 includes the two holding plates (a pair of holding plates) 33 and 34 in the first embodiment of the connector and each of the contact modules 121 and 131 includes the three holding plates 133, 134 and 138 in the second embodiment of the connector, it is possible that each contact module include more than three holding plates so that contacts or contact pins are held between adjacent holding plates.
Additionally, all the contacts (or contact pins) of each of the receptacle 30, the plug 120 and the receptacle 130 can consist of only signal contacts (or signal contact pins) as shown in
Although not shown in the drawings, the number of contacts or contact pins held between the conductive layer portion and the conductive layer portion of the adjacent holding plates 33 and 34 can be any number so long as the number is at least one. In addition, it is possible that contact holding grooves and corresponding contact holding grooves be formed on two conductive layer portions which face each other, respectively. Additionally, it is also possible that contact holding grooves and no contact holding grooves be formed on two conductive layer portions which face each other, respectively.
In addition, in the first embodiment of the connector, it is possible to combine all the ten contact modules 31 into one integral module by a retainer similar to the retainer 175 of the second embodiment of the connector instead of combining all the ten contact modules 31 into one integral by the retainer 75.
In addition, although the side edges (upper and lower side edges in the illustrated first embodiment of the connector) of each insulation recess (36, 37, 49 and 50) in either of the two holding plates 33 and 34, which extend parallel to the associated signal contact 65B, 65C, 65E or 65F, are covered by the associated conductive layer portion 35 or 48 and also the side edges (upper and lower side edges in the illustrated second embodiment of the connector) of each insulation recess (136, 137, 149 and 150) in each of the three holding plates 133, 134 and 138, which extend parallel to the associated signal contact 165B, 165C, 165E or 165F, are covered by the associated conductive layer portion 135, 148 or 160, the side edges of each insulation recess (36, 37, 49 and 50) in either of the two holding plates 33 and 34 can be shaped so as only to be partly covered by the associated conductive layer portion 35 or 48, and also the side edges of each insulation recess (136, 137, 149 and 150) in each of the three holding plates 133, 134 and 138 can be shaped so as only to be partly covered by the associated conductive layer portion 135, 148 or 160.
In addition, in the first embodiment of the connector, it is possible that the holding plate 33 be made by forming the conductive layer portion 35 on a synthetic-resin-made member, subsequently making the insulating portion 43 as a member separated from the conductive layer portion 35 (as a member independent of the conductive layer portion 35), and subsequently fitting the insulating portion 43 into the conductive layer portion 35, and that the holding plate 34 be made by forming the conductive layer portion 48 on a synthetic-resin-made member, subsequently making the insulating portion 55 as a member separated from the conductive layer portion 48 (as a member independent of the conductive layer portion 48), and subsequently fitting the insulating portion 55 into the conductive layer portion 48. Additionally, in the second embodiment of the connector, it is possible that each conductive layer portion (135, 148 and 160) be formed on a synthetic-resin-made member, and then the associated insulating portion (143 or 155) be molded integrally with this conductive layer portion with the use of molding dies (by so-called two-color forming).
In addition, it is possible that firstly the conductive layer portion (35, 48, 135, 148 or 160) be formed over the surface of a synthetic-resin-made member, subsequently a portion of this conductive layer portion (plating) on which the insulating portion (43, 55, 143 or 155) is to be formed be removed, and subsequently the insulating portion (43, 55, 143 or 155) be formed on this removed portion.
Obvious changes may be made in the specific embodiments of the present invention described herein, such modifications being within the spirit and scope of the invention claimed. It is indicated that all matter contained herein is illustrative and does not limit the scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2007-117407 | Apr 2007 | JP | national |
| 2007-323626 | Dec 2007 | JP | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6843687 | McGowan et al. | Jan 2005 | B2 |
| 7387535 | Minich | Jun 2008 | B2 |
| Number | Date | Country | |
|---|---|---|---|
| 20080268708 A1 | Oct 2008 | US |
