The subject matter herein relates generally to pin spacers for connector assemblies.
Some electrical systems utilize electrical connectors, such as header assemblies and receptacle assemblies, to interconnect two circuit boards, such as a motherboard and daughtercard. The electrical connectors include contacts having pins extending from a mounting end of the electrical connectors. The pins are through-hole mounted to the circuit board by loading the pins into plated vias in the circuit board. The electrical connectors are typically pre-assembled and configured to be mounted to the circuit board. In order to insure that the pins are oriented correctly, many electrical connectors include pin spacers or pin organizers that are coupled to the bottoms of the electrical connectors and that hold the pins in proper positions for mounting to the circuit board.
The electrical connectors are typically shipped with the pin spacers in an intermediate position to support and protect the pins during shipping. Typically, many electrical connectors are shipped together in a shipping tube or container that holds the electrical connectors. However, during shipping, it is possible that the electrical connectors move within the shipping tube. For example, the electrical connectors may shift up, down or laterally side-to-side. When the electrical connectors shift, the pins are susceptible to damage, such as bending. For example, the pin spacer of one receptacle connector may overlap with the pin spacer of an adjacent electrical connector, causing the pins to bend.
A need remains for an improved pin spacer that is able to protect the pins during shipping and handling.
In one embodiment, a connector assembly is provided that includes a housing, a plurality of contact modules received in the housing, and a pin spacer coupled to the contact modules. Each contact module has a plurality of contacts each including a pin for terminating to a circuit board. The pins extend from a bottom of the corresponding contact module. The pin spacer has a plurality of pin holes extending through the pin spacer between a top of the pin spacer and a bottom of the pin spacer. The pin holes receive corresponding pins for mounting to the circuit board. The pin spacer holds relative positions of the pins. The pin spacer has side edges at opposite sides of the pin spacer and lugs extending from the top of the pin spacer proximate to the sides of the pin spacer. The lugs block entry into a space defined between the bottoms of the contact modules and the top of the pin spacer.
Optionally, the lugs may prevent damage to the pins. The lugs may have exterior walls substantially aligned with the side edges of the pin spacer. The lugs may be interspersed with pin holes along the sides of the pin spacer. Optionally, the sides may be scalloped to internest with a pin spacer of an adjacent connector assembly.
Optionally, the pin spacer may be initially held spaced apart from the bottoms of the contact modules on the pins to define the space between the bottoms of the contact modules and the top of the pin spacer. The lugs may span across a majority of the space. The lugs may span entirely across the space to engage the contact modules.
Optionally, the lugs may block a pin spacer of an adjacent connector assembly from entering the space. The lugs may block lateral shifting of the pin spacer relative to a pin spacer of an adjacent connector assembly.
Optionally, the opposite sides may include a first side and a second side. The lugs along the first side may be staggered forward with respect to the lugs along the second side. The connector assembly may be positioned adjacent a second connector assembly. The lugs along the second side may be staggered with respect to lugs along a first side of the second connector assembly.
In a further embodiment, a connector assembly may be provided including a housing and contact modules coupled to the housing. Each contact module includes a conductive holder holding a frame assembly. The frame assembly includes a plurality of signal contacts and a dielectric frame supporting the signal contacts. The dielectric frame is received in the conductive holder. The signal contacts each include a signal pin for terminating to a circuit board. The signal pins extend from a bottom of the contact module. A ground shield is coupled to the conductive holder. The ground shield is electrically connected to the conductive holder. The ground shield has grounding pins extending beyond the bottom of the contact module for terminating to the circuit board. A pin spacer is coupled to the contact modules. The pin spacer has a plurality of signal pin holes and ground pin holes extending through the pin spacer between a top of the pin spacer and a bottom of the pin spacer. The signal pin holes receive corresponding signal pins and the ground pin holes receive corresponding grounding pins. The signal pins and grounding pins extend beyond the bottom of the pin spacer for mounting to the circuit board. The pin spacer holds relative positions of the signal pins and grounding pins. The pin spacer has side edges at opposite sides of the pin spacer. The pin spacer has lugs extending from the top of the pin spacer. The lugs block entry into a space defined between the bottoms of the contact modules and the top of the pin spacer.
In a further embodiment, a pin spacer is provided for a connector assembly having a plurality of pins extending from a bottom of the connector assembly. The pin spacer includes a plate having a top, a bottom, a front, a rear and opposite sides with edges extending between the top and bottom along the front, rear and sides. A plurality of pin holes extend through the plate between the top and bottom. The pin holes receive corresponding pins of the connector assembly. The pin holes are spaced apart in an array corresponding to a particular pinout of vias in a circuit board to which the connector assembly is mounted. Lugs extend from the top. The lugs are positioned proximate to the sides of the plate. The lugs block entry into a space defined above the top of the plate from the sides of the plate.
The receptacle and header assemblies 102, 104 are each electrically connected to respective circuit boards 106, 108. The receptacle and header assemblies 102, 104 are utilized to electrically connect the circuit boards 106, 108 to one another at a separable mating interface. In an exemplary embodiment, the circuit boards 106, 108 are oriented perpendicular to one another when the receptacle and header assemblies 102, 104 are mated. Alternative orientations of the circuit boards 106, 108 are possible in alternative embodiments.
A mating axis 110 extends through the receptacle and header assemblies 102, 104. The receptacle and header assemblies 102, 104 are mated together in a direction parallel to and along the mating axis 110.
The receptacle assembly 102 includes a connector housing 120, which may be referred to hereinafter as a receptacle housing 120, that holds a plurality of contact modules 122. The contact modules 122 are held in a stacked configuration generally parallel to one another. Any number of contact modules 122 may be provided in the receptacle assembly 102. The contact modules 122 each include a plurality of signal contacts 124 (shown in
The receptacle assembly 102 includes a front 128 defining a mating end (which may be referred to hereinafter as mating end 128) and a bottom 130 defining a mounting end 130 (which may be referred to hereinafter as bottom 130). The mating and mounting ends may be at different locations other than the front 128 and bottom 130 in alternative embodiments. The receptacle signal contacts 124 (shown in
In an exemplary embodiment, each contact module 122 has a shield structure 126 for providing electrical shielding for the receptacle signal contacts 124. The contact modules 122 may generally provide 360° shielding for each pair of receptacle signal contacts 124 along substantially the entire length of the receptacle signal contacts 124 between the mounting end 130 and the mating end 128. In an exemplary embodiment, the shield structure 126 is electrically connected to the header assembly 104 and/or the circuit board 106. For example, the shield structure 126 may be electrically connected to the header assembly 104 by extensions (for example beams and/or fingers) extending from the contact modules 122 that engage the header assembly 104. The shield structure 126 may be electrically connected to the circuit board 106 by features, such as grounding pins. In an exemplary embodiment, a portion of the shield structure 126 on one side of the contact module 122 is electrically connected to a portion of the shield structure 126 on another side of the contact module 122. For example, portions of the shield structure 126 on opposite sides of the contact module 122 may be electrically connected to each other by internal extensions (for example tabs) that extend through the interior of the contact module 122. Having the portions of the shield structure 126 on opposite sides of the contact module 122 electrically connected to each other electrically commons the portions of the shield structure 126 to provide increased performance of the signal transmission through the contact module 122.
The receptacle housing 120 includes a plurality of signal contact openings 132 and a plurality of ground contact openings 134 at the mating end 128. The receptacle signal contacts 124 are received in corresponding signal contact openings 132. Optionally, a single receptacle signal contact 124 is received in each signal contact opening 132. The signal contact openings 132 may also receive corresponding header signal contacts 144 therein when the receptacle and header assemblies 102, 104 are mated. The ground contact openings 134 receive header ground contacts 146 therein when the receptacle and header assemblies 102, 104 are mated. The ground contact openings 134 also receive the extensions (for example beams and/or fingers) of the shield structure 126 of the contact modules 122 that mate with the header ground contacts 146 to electrically common the receptacle and header assemblies 102, 104.
The receptacle housing 120 is manufactured from a dielectric material, such as a plastic material, and provides isolation between the signal contact openings 132 and the ground contact openings 134. The receptacle housing 120 isolates the receptacle signal contacts 124 and the header signal contacts 144 from the header ground contacts 146. The receptacle housing 120 isolates each set of receptacle and header signal contacts 124, 144 from other sets of receptacle and header signal contacts 124, 144.
The receptacle assembly 102 includes a pin spacer 136 coupled to the bottom of the receptacle assembly 102. The pin spacer 136 is used to hold the relative positions of the signal and grounding pins for mounting to the circuit board 106. The pin spacer 136 includes pin holes being spaced apart in an array corresponding to a particular pinout of vias in the circuit board 106 to which the receptacle assembly 102 is mounted. The pin spacer 136 is captured between the bottom of the receptacle assembly 102 and the circuit board 106 when the receptacle assembly 102 is mounted to the circuit board 106. In an exemplary embodiment, the pin spacer 136 includes features to protect the pins from damage during shipping and handling of the receptacle assembly prior to mounting to the circuit board 106.
The header assembly 104 includes a header housing 138 having walls 140 defining a chamber 142. The header assembly 104 has a mating end 150 and a mounting end 152 that is mounted to the circuit board 108. Optionally, the mounting end 152 may be substantially parallel to the mating end 150. The receptacle assembly 102 is received in the chamber 142 through the mating end 150. The receptacle housing 120 engages the walls 140 to hold the receptacle assembly 102 in the chamber 142. The header signal contacts 144 and the header ground contacts 146 extend from a base wall 148 into the chamber 142 for mating with the receptacle assembly 102.
The header ground contacts 146 provide electrical shielding around corresponding header signal contacts 144. The header signal contacts 144 may be arranged in rows and columns on the header assembly 104. In an exemplary embodiment, the header signal contacts 144 are arranged in pairs configured to convey differential signals. The header ground contacts 146 peripherally surround a corresponding pair of the header signal contacts 144 to provide electrical shielding. In the illustrated embodiment, the header ground contacts 146 are C-shaped, covering three sides of the pair of header signal contacts 144.
The contact module 122 includes a conductive holder 154 which defines at least a portion of the shield structure 126. The conductive holder 154 generally surrounds the receptacle signal contacts 124 along substantially the entire length of the receptacle signal contacts 124 between the mounting end 130 and the mating end 128. The conductive holder 154 has a front 156 configured to be loaded into the receptacle housing 120, a rear 157 opposite the front 156, a bottom 158 which optionally may be adjacent to the circuit board 106 (shown in
The conductive holder 154 is fabricated from a conductive material which provides electrical shielding for the receptacle assembly 102. For example, the conductive holder 154 may be die-cast, or alternatively stamped and formed, from a metal material. In other alternative embodiments, the holder 154 may be fabricated from a plastic material that has been metalized or coated with a metallic layer. In other embodiments, rather than a conductive holder, the holder 154 may be non-conductive. In other embodiments, the contact module 122 may be provided without the conductive holder 154 altogether.
The receptacle signal contacts 124 have mating portions 164 extending forward from the front 156 of the conductive holder 154. The mating portions 164 are configured to be electrically terminated to corresponding header signal contacts 144 (shown in
In an exemplary embodiment, the receptacle signal contacts 124 in each contact module 122 are arranged as contact pairs 168 configured to transmit differential signals through the contact module 122. The receptacle signal contacts 124 within each contact pair 168 are arranged in rows that extend along row axes 170. In an exemplary embodiment, each row axis 170 includes one contact pair 168 from each contact module 122 stacked together in the receptacle assembly 102. At the mating end 128, the contact pairs 168 within each contact module 122 are stacked vertically. The right receptacle signal contacts 124 of each contact module 122 extend along a column axis 172, and the left receptacle signal contacts 124 of each contact module extend along a column axis 174. When the contact modules 122 are stacked in the receptacle assembly 102, the column axes 172, 174 of the contact modules 122 extend parallel to each other.
In an exemplary embodiment, each contact module 122 includes first and second ground shields 176, 178, which define at least a portion of the shield structure 126. The ground shields 176, 178 may be positioned along the exterior sides 160, 162 of the conductive holder 154. For example, the first ground shield 176 may be positioned along the right side 160 of the conductive holder 154, and as such, may be hereinafter referred to as the right ground shield 176. The second ground shield 178 (
The right ground shield 176 is coupled to the right exterior side 160 of the conductive holder 154. When attached to the conductive holder 154, the right ground shield 176 electrically connects to the conductive holder 154. The right ground shield 176 includes a main body 180 that is generally planar and extends alongside of the conductive holder 154. The ground shield 176 includes grounding beams 184 extending from a front 186 of the main body 180. The ground shield 176 includes grounding pins 188 extending from a bottom 190 of the main body. The grounding pins 188 are configured to be terminated to the circuit board 106 (shown in
The left ground shield 178 (
In an exemplary embodiment, the right and left ground shields 176, 178 are manufactured from a metal material. The ground shields 176, 178 are stamped and formed parts with the grounding beams 184, 194 being stamped and then formed during a forming process. The grounding pins 188, 198 are stamped and/or formed.
The conductive holder 154 shown in the illustrated embodiment includes a right holder member 200 and a left holder member 202. Upon assembling the contact module 122, the right and left holder members 200, 202 are coupled together to form the conductive holder 154. The right and left ground shields 176, 178 are coupled to the right and left holder members 200, 202, respectively. The right ground shield 176 engages and is electrically connected to the right holder member 200. The left ground shield 178 (
As a part of the shield structure 126, the holder members 200, 202 generally provide electrical shielding between and around respective receptacle signal contacts 124. For example, the holder members 200, 202 provide shielding from electromagnetic interference (EMI) and/or radio frequency interference (RFI), and may provide shielding from other types of interference as well. The holder members 200, 202 may provide shielding around the outside of the receptacle signal contacts 124 as well as between the receptacle signal contacts 124 using tabs 204, 206. As a result, the holder members 200, 202 allow for better control of electrical characteristics, such as impedance, cross-talk, and the like, of the receptacle signal contacts 124.
The conductive holder 154 holds a frame assembly 212, which includes the receptacle signal contacts 124. Upon assembly of the contact module 122, the frame assembly 212 is received in the right and left holder members 200, 202. The holder members 200, 202 provide shielding around the frame assembly 212 and receptacle signal contacts 124. The tabs 204, 206 are configured to extend into the frame assembly 212 such that the tabs 204, 206 are positioned between receptacle signal contact pairs 168 to provide shielding between adjacent contact pairs 168.
The frame assembly 212 includes a pair of right and left dielectric frames 214, 216, respectively, surrounding and supporting the receptacle signal contacts 124. In an exemplary embodiment, one of the receptacle signal contacts 124 of each contact pair 168 is held by the right dielectric frame 214, while the other receptacle signal contact 124 of the contact pair 168 is held by the left dielectric frame 216. The receptacle signal contacts 124 of each contact pair 168 extend through the frame assembly 212 generally along parallel paths such that the receptacle signal contacts 124 are skewless between the mating portions 164 and the signal pins 168.
In an exemplary embodiment, the receptacle signal contacts 124 are initially held together as leadframes (not shown), which are overmolded with dielectric material to form the dielectric frames 214, 216. Manufacturing processes other than overmolding a leadframe may be utilized to form the dielectric frames 214, 216, such as loading receptacle signal contacts 124 into a formed dielectric body.
The pin spacer 136 includes a plurality of signal pin holes 320 and ground pin holes 322 extending through the plate 300 between the top 302 and bottom 304. The signal pin holes 320 receive corresponding signal pins 166 and the ground pin holes 322 receive corresponding grounding pins 188, 198 (shown in
The pin spacer 136 includes a plurality of lugs 330 extending from the top 302 of the pin spacer 136. The lugs 330 are positioned proximate to the sides 310, 312 of the plate 300. The lugs 330 are used to protect the pins 166, 188, 198 from damage, such as during shipping, handling, mounting to the circuit board 106, and the like. The lugs 330 stop other components, such as other pin spacers 136 from passing above the pin spacer 136, which could potentially damage the pins 166, 188, 198. The lugs 330 are interspersed with pin holes 320 and/or 322 along the sides 310, 312 of the pin spacer 136. Optionally, the lugs 330 may be aligned in-column with the outer-most column of ground pin holes 322. In an exemplary embodiment, the lugs 330 along the first side 310 are staggered forward with respect to the lugs 330 along the second side 312 such that the lugs 330 at the opposite sides 310, 312 are in different rows.
In the intermediate position, the pin spacer 136 is only partially loaded onto the pins 166, 188, 198. For example, the pin spacer 136 is aligned with the enlarged areas 167, 192, 199 (shown in
The lugs 330 block entry into the space 344 defined between the bottoms 158 of the contact modules 122 and the top 302 of the pin spacer 136. The lugs 330 may span across a majority of the space 344. Optionally, the lugs 330 may span entirely across the space 344, such that the lugs 330 abut against the sides of the contact modules 122 in the intermediate position. The lugs 330 prevent damage to the pins 166, 188, 198, such as by blocking an adjacent pin spacer 136 from entering the space 344 to damage the stems 342 and/or by blocking the pin spacer 136 from moving to a position that could bend or damage pins of an adjacent receptacle assembly 102. The lugs 330 may block lateral (for example side-to-side) shifting of the pin spacer 136 relative to a pin spacer 136 of an adjacent receptacle assembly 102.
The lugs 330 extend to a tip 350. The lugs 330 have interior walls 352 and exterior walls 354 that extend to the tip 350. Optionally, the lugs 330 may have a chamfered surface 356 along the interior wall 352 to reduce stubbing when the pin spacer 136 is moved to the fully loaded position. The chamfered surface 356 guides the lug 330 into position along the side of the contact module 122. In the fully loaded position, the lugs 330 engage the sides of the outer-most contact modules 122. Optionally, the exterior walls 354 may be substantially aligned with the side edges 316, 318 (shown in
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
Number | Name | Date | Kind |
---|---|---|---|
5348488 | Green et al. | Sep 1994 | A |
5692912 | Nelson et al. | Dec 1997 | A |
6494724 | Bixler et al. | Dec 2002 | B1 |
6638104 | Hashimoto et al. | Oct 2003 | B2 |
6755691 | Sasame et al. | Jun 2004 | B2 |
6923662 | Sasame et al. | Aug 2005 | B2 |
7267515 | Lappohn | Sep 2007 | B2 |
7690946 | Knaub et al. | Apr 2010 | B2 |
7927143 | Helster et al. | Apr 2011 | B2 |
7931500 | Knaub et al. | Apr 2011 | B2 |
Number | Date | Country | |
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20150140865 A1 | May 2015 | US |