This application relates to the field of communications device technologies, and in particular, to connectors.
As a communication rate increases, a system imposes a higher requirement on a high-speed electrical performance of a connector. The most important electrical performance indicators are crosstalk, loss, and reflection. The crosstalk includes far-end crosstalk and near-end crosstalk. The crosstalk is represented as noise injection to a victim network, and directly reduces a signal-to-noise ratio of a signal. Consequently, signal transmission quality deteriorates. As a rate of a current mainstream communications product evolves to 56 Gbps or even 112 Gbps, the crosstalk gradually becomes one of main challenges to the connector.
Embodiments of this application provide a connector, a connection assembly, and a backplane interconnection system, to reduce crosstalk of the connector.
To achieve the foregoing objective, the following technical solutions are used in the embodiments of this application.
According to a first aspect, embodiments of this application provide a connector, including an insulation base, a terminal array, a metal shielding piece, and a first common grounding conductor. The insulation base has a first surface and a second surface opposite to the first surface. The terminal array is fastened on the insulation base, the terminal array includes a plurality of rows of terminals, each row of terminals includes a signal terminal and a ground terminal, both the signal terminal and the ground terminal penetrate the insulation base, and a metal shielding piece is disposed between two adjacent rows of terminals. The first common grounding conductor is disposed on the first surface. A first through hole is disposed on the first common grounding conductor at a position corresponding to the signal terminal. The signal terminal penetrates the first through hole, and is insulated from an inner wall of the first through hole. A second through hole is disposed on the first common grounding conductor at a position corresponding to the ground terminal. The ground terminal penetrates the second through hole, and is in contact with and conducted with at least a part of an inner wall of the second through hole. The metal shielding piece is in contact with and conducted with the first common grounding conductor.
The connector provided in embodiments of this application includes the terminal array, the terminal array is fastened on the insulation base, and the terminal array includes the plurality of rows of terminals. Each row of terminals includes the signal terminal and the ground terminal. In this way, signal terminals in each row of terminals can be shielded from each other by using a ground terminal. When the connector is connected to a backplane or a board, the ground terminal is connected to a ground cable on the backplane or the board, to implement grounding and signal backflow. In addition, the metal shielding piece is disposed between the two adjacent rows of terminals, the first common grounding conductor is disposed on the first surface, the second through hole is disposed on the first common grounding conductor at the position corresponding to the ground terminal, the ground terminal penetrates the second through hole and is in contact with and conducted with at least a part of the inner wall of the second through hole, and the metal shielding piece is in contact with and conducted with the first common grounding conductor. Therefore, the metal shielding piece can be connected to the ground cable on the backplane or the board through the first common grounding conductor and the ground terminal, so that two adjacent rows of signal terminals can be shielded from each other by using the metal shielding piece. In addition, a relatively large quantity of contact and conduction regions can be formed between the ground terminal and the first common grounding conductor and between the metal shielding piece and the first common grounding conductor. In this way, the metal shielding piece has relatively good grounding and signal backflow performance, crosstalk between two adjacent rows of terminals is relatively low, and crosstalk of the connector is relatively low.
According to aspects of the present disclosure, a second common grounding conductor is further disposed on the second surface, a third through hole is disposed on the second common grounding conductor at a position corresponding to the signal terminal, the signal terminal penetrates the third through hole and is insulated from an inner wall of the third through hole, a fourth through hole is disposed on the second common grounding conductor at a position corresponding to the ground terminal, and the ground terminal penetrates the fourth through hole and is in contact with and conducted with at least a part of an inner wall of the fourth through hole. In this way, signal backflow is performed on the ground terminal by using two common grounding conductors (that is, the first common grounding conductor and the second common grounding conductor), so that signal backflow performance of the connector can be further improved.
In an embodiment, the metal shielding piece is embedded in the insulation base, an end that is of the metal shielding piece and that is close to the first surface is in contact with and conducted with the first common grounding conductor, and an end that is of the metal shielding piece and that is close to the second surface is in contact with and conducted with the second common grounding conductor. In this way, signal backflow is performed on the metal shielding piece by using two common grounding conductors (that is, the first common grounding conductor and the second common grounding conductor), so that signal backflow performance of the connector can be further improved.
In an embodiment, the metal shielding piece has one of a protrusion and a groove, the first common grounding conductor has the other of the protrusion and the groove, and the protrusion is cooperatively accommodated in the groove and is in contact with and conducted with an inner wall of the groove. In this way, an area of contact between the metal shielding piece and the first common grounding conductor can be increased, so that signal backflow performance of the connector is further improved.
In an embodiment, protection boards are disposed on at least two opposite sides of the terminal array, and the protection boards are fastened on the insulation base. In this way, the terminal array can be protected by using the protection board, to avoid scratching the terminal array.
In an embodiment, the protection board and the insulation base are integrally molded. In this way, the connector provided in embodiments of this application includes a relatively small quantity of components, and assembly efficiency is relatively high.
In an embodiment, both the signal terminal and the ground terminal are plug terminals, a plug direction of the signal terminal is consistent with that of the ground terminal, a guide structure is disposed on an inner surface of the protection board, and a guide direction of the guide structure is consistent with the plug direction of the signal terminal or the ground terminal. In this way, under guidance of the guide structure, the connector provided in embodiments of this application can be quickly inserted into another connector cooperating with the connector.
In an embodiment, the connector further includes an insulation and isolation piece, the insulation and isolation piece is cooperatively embedded in the first through hole, a fifth through hole is disposed on the insulation and isolation piece, and the signal terminal cooperatively penetrates the fifth through hole. In this way, insulation between the signal terminal and the inner wall of the first through hole is implemented by using the insulation and isolation piece, and insulation stability is relatively high.
In an embodiment, the insulation and isolation piece and the insulation base are integrally molded. In this way, the connector includes a relatively small quantity of components, and assembly efficiency is relatively high.
In an embodiment, in each row of terminals, signal terminals form a plurality of signal terminal groups, each signal terminal group includes at least one signal terminal, and a ground terminal is disposed between two adjacent signal terminal groups. In this way, signals transmitted by the two adjacent signal terminal groups are shielded from each other by using the ground terminal, signal crosstalk is reduced, and performance of the connector is improved.
In an embodiment, each signal terminal group includes two signal terminals. In this way, the signal terminal group can transmit two differential signals having equal amplitudes and opposite phases, and the differential signals have a strong anti-electromagnetic interference capability, so that anti-electromagnetic interference performance of the connector can be improved.
According to aspects of the present disclosure, embodiments of this application provide a connection assembly, including a first connector and a second connector. The first connector and/or the second connector are/is the connector described in any one of the foregoing technical solutions, and the first connector is cooperatively connected to the second connector.
Because the first connector and/or the second connector used in the connection assembly in embodiments of this application are/is the same as the connector described in any one of the foregoing technical solutions, the connectors can resolve a same technical problem and achieve a same expected effect.
According to a third aspect, embodiments of this application provide a backplane interconnection system, including a backplane, at least one board, and at least one connection assembly described in the foregoing technical solutions. Each board is connected to the backplane through at least one connection assembly.
Because the connection assembly used in the backplane interconnection system in embodiments of this application is the same as the connection assembly described in the foregoing technical solutions, the connection assemblies can resolve a same technical problem and achieve a same expected effect.
It should be noted that “and/or” in descriptions of embodiments of this application describes only an association relationship for describing associated objects and represents that three relationships may exist. For example, A and/or B may represent the following three cases: Only A exists, both A and B exist, and only B exists. In addition, the character “/” in this specification generally indicates an “or” relationship between the associated objects.
Embodiments of this application relate to a connector, a connection assembly, and a backplane interconnection system. The following briefly describes concepts in the embodiments.
Crosstalk: Electronically, crosstalk refers to coupling between two signal cables. This is because undesired inductive coupling and capacitive coupling may occur between signal cables that are close in space, resulting in mutual interference. The capacitive coupling causes a coupling current, and the inductive coupling causes a coupling voltage. Crosstalk is an urgent problem to be solved in printed circuit board designs and integrated circuit designs.
Signal terminal: A signal terminal is configured to transmit an electrical signal and is conductive.
Ground terminal: A ground terminal is configured to connect to the ground and is conductive.
Backplane: A backplane is an important part of a communications device. Usually, the backplane includes a multilayer printed board, a connector, a guide pin, and the like, and provides an electrical signal connection and physical support for each board or module in a system.
Board: A board includes a printed circuit board (PCB) and an electronic component (such as a chip, a resistor, or a capacitor) disposed on the printed circuit board.
Conduction: Conduction refers to a state in which a current can be transmitted between two parts.
In the foregoing connector, the metal shielding piece 3 abuts the ground terminal through the spring 31, and the metal shielding piece 3 is in point-contact with the ground terminal. Therefore, grounding and signal backflow performance of the metal shielding piece 3 is relatively poor, and crosstalk of the connector is relatively severe.
In a current communications hardware system, a backplane interconnection system that is based on a printed circuit board and that includes a combination of a backplane and a board is a most common interconnection architecture, and is usually used in a high-speed link of a communications system. Various boards are connected to the backplane through connection assemblies. As a connection bridge between the backplane and the board, the connection assembly is a key part that affects the entire hardware system architecture.
An embodiment of this application provides a backplane interconnection system, including a backplane, at least one board, and at least one connection assembly. Each board is connected to the backplane through at least one connection assembly.
For example, as shown in
As shown in
Signal transmission between the first connector 031 and the backplane or the board is implemented by connecting a plurality of signal terminal groups of the first connector 031 to signal cables on the backplane or the board, signal transmission between the first connector 031 and the second connector 032 is implemented by connecting a plurality of signal terminal groups of the first connector 031 to a plurality of signal terminal groups of the second connector 032, and signal transmission between the second connector 032 and the board or the backplane is implemented by connecting a plurality of signal terminal groups of the second connector 032 to signal cables on the board or the backplane. Because different signal terminal groups are used to transmit different signals, the different signal terminal groups need to be isolated from each other to avoid signal crosstalk. Each signal terminal group includes at least one signal terminal.
A structure of the first connector 031 and/or the second connector 032 may be as follows: As shown in
It should be noted that when both the first connector 031 and the second connector 032 are of the connector structure described in the foregoing embodiment, a terminal in a terminal array 200 of the first connector 031 is one of a male terminal and a female terminal, and a terminal in a terminal array 200 of the second connector 032 is the other of the male terminal and the female terminal. In this way, the first connector 031 and the second connector 032 can be cooperatively connected to each other.
A connector provided in an embodiment of this application is shown in
Because the first connector and/or the second connector used in the connection assembly in embodiments of this application are/is the connector described in the foregoing embodiment, the connectors can resolve a same technical problem and achieve a same expected effect.
Because the connection assembly used in the backplane interconnection system in embodiments of this application is the connection assembly described in the foregoing embodiment, the connection assemblies can resolve a same technical problem and achieve a same expected effect.
A shape of the insulation base 100 includes, but is not limited to, a block shape or a plate shape. Materials of the insulation base 100 include, but are not limited to, plastic, glass, and ceramics.
A shape of the metal shielding piece 300 includes, but is not limited to, a sheet shape or a strip shape. A material of the metal shielding piece 300 includes, but is not limited to, copper, iron, or aluminum.
The first common grounding conductor 400a may be directly molded on the first surface a, or may be independently molded and then fastened on the first surface a. This is not specifically limited herein.
The signal terminal 201 and the ground terminal 202 may be plug terminals, or may be spring terminals. This is not specifically limited herein.
It should be noted that, that the ground terminal 202 is in contact with and conducted with at least a part of an inner wall of the second through hole 600a means that the ground terminal 202 may be in contact with and conducted with all of the inner wall of the second through hole 600a, or may be in contact with and conducted with a part of the inner wall of the second through hole 600a.
In some embodiments, as shown in
The second common grounding conductor 400b may be directly molded on the second surface b, or may be independently molded and then fastened on the second surface b. This is not specifically limited herein.
That the ground terminal 202 is in contact with and conducted with at least a part of an inner wall of the fourth through hole 600b means that the ground terminal 202 may be in contact with and conducted with all of the inner wall of the fourth through hole 600b, or may be in contact with and conducted with a part of the inner wall of the fourth through hole 600b.
In some embodiments, as shown in
In some embodiments, the metal shielding piece 300 has one of a protrusion and a groove, and the first common grounding conductor 400a has the other of the protrusion and the groove. The protrusion is cooperatively accommodated in the groove, and is in contact with and conducted with an inner wall of the groove. In this way, an area of contact between the metal shielding piece 300 and the first common grounding conductor 400a can be increased, so that signal backflow performance of the connector is further improved.
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, as shown in
It should be noted that the inner surface of the protection board 700 is a surface that is of the protection board 700 and that faces the terminal array 200. The guide structure 800 may be a guide rib protruding from the inner surface of the protection board 700, or may be a guide sliding slot provided on the inner surface of the protection board 700. This is not specifically limited herein.
A gap may be disposed between the signal terminal 201 and the inner wall of the first through hole 500a to implement insulation by using the gap, or an insulation material may be used for insulation. This is not specifically limited herein. In some embodiments, as shown in
A gap may be disposed between the signal terminal 201 and the inner wall of the third through hole 500b to implement insulation by using the gap, or an insulation material may be used for insulation. This is not specifically limited herein. In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, as shown in
In some embodiments, as shown in
Each signal terminal group is configured to transmit one signal. The signal terminal group may include one signal terminal 201, or may include two signal terminals 201. This is not specifically limited herein. In some embodiments, as shown in
Connectors shown in
In the descriptions of this specification, the specific features, structures, materials, or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.
Finally, it should be noted that, the foregoing embodiments are merely intended to describe the technical solutions of this application, but not to limit this application. Although this application is described in detail with reference to the foregoing embodiments, persons of ordinary skill in the art should understand that they may still make modifications to the technical solutions recorded in the foregoing embodiments or make equivalent replacements to some technical features thereof, without departing from the spirit and scope of the technical solutions of the embodiments of this application.
Number | Date | Country | Kind |
---|---|---|---|
201921544553.8 | Sep 2019 | CN | national |
This application is a continuation application of International Patent Application No. PCT/CN2020/106515, filed on Aug. 3, 2020, which claims priority to Chinese Patent Application No. 201921544553.8, filed on Sep. 17, 2019. The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties.
Number | Date | Country | |
---|---|---|---|
Parent | PCT/CN2020/106515 | Aug 2020 | US |
Child | 17695462 | US |