Patent Grant
11791593
The present disclosure relates to a connector-equipped multicore cable.
Patent Document 1 discloses, as a connector-equipped multicore cable used for transmission between electronic devices, a connector-equipped multicore cable that can be connected to an electronic device regardless of the vertical orientation of the connector.
[Patent Document 1] Japanese Laid-Open Patent Publication No. 2017-69152
A connector-equipped multicore cable of the present disclosure includes a connector including a first end portion and a second end portion, and a multicore cable including a plurality of coaxial electrical wires and connected to the first end portion. The connector includes, at the second end portion, a cover that is made of metal and that covers a connector terminal. The plurality of coaxial electrical wires each include a first shield layer. The first shield layer and the cover are electrically connected to each other.
According to the technique described in Patent Document 1, although the intended object is achieved, there is a possibility that noise increases when the frequency of a signal becomes higher.
According to the present disclosure, noise can be further reduced.
In the following, an embodiment will be described.
First, embodiments of the present disclosure will be listed and described. In the following description, the same or corresponding elements are denoted by the same reference numerals, and the same description thereof will not be repeated.
<1> A connector-equipped multicore cable according to one aspect of the present disclosure includes a connector including a first end portion and a second end portion, and a multicore cable including a plurality of coaxial electrical wires and connected to the first end portion. The connector includes, at the second end portion, a cover that is made of metal and that covers a connector terminal. The plurality of coaxial electrical wires each include a first shield layer. The first shield layer and the cover are electrically connected to each other.
According to the connector-equipped multicore cable in one aspect of the present disclosure, a first shield layer of the coaxial electrical wire and the cover that is made of the metal are electrically connected. Therefore, the ground potential can be supplied to the first shield layer through the cover that is made of the metal. Therefore, noise of a signal transmitted through the coaxial electrical wire can be reduced.
<2> In the connector-equipped multicore cable according to <1>, the connector may include an outer case into which one end of the multicore cable is inserted, and a portion of the cover may be exposed from the outer case. In this case, an inner portion of the outer case of the multicore cable can be insulated from the outside while the cover that is made of metal can be connected to the electronic device.
<3> In the connector-equipped multicore cable according to <1> or <2>, the connector may include a substrate having a first surface to which a first coaxial electrical wire included in the plurality of coaxial electrical wires is connected, and a first metal plate that covers the first surface to which the first coaxial electrical wire is connected and that is connected to the cover and the first shield layer of the first coaxial electrical wire. In this case, the connector can be easily assembled.
<4> In the connector-equipped multicore cable according to <3>, the multicore cable may include a second shield layer that covers the plurality of coaxial electrical wires, and the first metal plate may be connected to the second shield layer. In this case, the first shield layer of the coaxial electrical wires can be electrically connected to the second shield layer of the multicore cable.
<5> In the connector-equipped multicore cable according to <3> or <4>, the first metal plate may include a first body portion, and a first elastic member extending from the first body portion and connected to the first shield layer of the first coaxial electrical wire. In this case, it is easy to electrically connect the first metal plate and the first shield layer.
<6> In the connector-equipped multicore cable according to <5>, the first elastic member may press the first coaxial electrical wire against the substrate. In this case, the first coaxial electrical wire is less likely to be displaced on the substrate.
<7> In the connector-equipped multicore cable according to <5> or <6>, the first elastic member may be a first plate spring. In this case, it is easy to manufacture the first metal plate.
<8> In the connector-equipped multicore cable according to any one of <3> to <7>, the substrate may have a second surface to which a second coaxial electrical wire included in the plurality of coaxial electrical wires is and the second surface is opposite to the first surface. The connector may include a second metal plate that covers the second surface to which the second coaxial electrical wire is connected and that is connected to the cover and the first shield layer of the second coaxial electrical wire. The second metal plate may include a second body portion and a second elastic member extending from the second body portion and connected to the first shield layer of the second coaxial electrical wire. In this case, the connector can be easily assembled.
<9> In the connector-equipped multicore cable according to <8>, the second elastic member may press the second coaxial electrical wire against the substrate. In this case, the second coaxial electrical wire is less likely to be displaced on the substrate.
<10> In [8] or [9], the second elastic member may be a second plate spring. In this case, it is easy to manufacture the second metal plate.
<11> In the connector-equipped multicore cable according to any one of <8> to <10>, the first metal plate and the second metal plate may be coupled to each other. In this case, noise of a signal transmitted through the coaxial electrical wire can be further reduced.
<12> A connector-equipped multicore cable according to another aspect of the present disclosure includes a connector including a first end portion and a second end portion, and a multicore cable including a plurality of coaxial electrical wires and connected to the first end portion. The connector includes, at the second end portion, a cover that is made of metal and that covers a connector terminal. The plurality of coaxial electrical wires each include a first shield layer, and the first shield layer and the cover are electrically connected to each other. The connector includes an outer case into which one end of the multicore cable is inserted, a substrate having a first surface to which a first coaxial electrical wire included in the plurality of coaxial electrical wires is connected, and a second surface to which a second coaxial electrical wire included in the plurality of coaxial electrical wires is connected, a first metal plate that covers the first surface to which the first coaxial electrical wire is connected and that is connected to the cover and the first shield layer of the first coaxial electrical wire, and a second metal plate that covers the second surface to which the second coaxial electrical wire is connected and that is connected to the cover and the first shield layer of the second coaxial electrical wire. A portion of the cover is exposed from the outer case. The first metal plate includes a first body portion and a first plate spring extending from the first body portion and connected to the first shield layer of the first coaxial electrical wire. The second metal plate includes a second body portion and a second plate spring extending from the second body portion and connected to the first shield layer of the second coaxial electrical wire. The first metal plate and the second metal plate are coupled to each other.
According to the connector-equipped multicore cable in another aspect of the present disclosure, a ground potential can be supplied to the first shield layer through the cover that is made of metal, and noise of a signal transmitted through the coaxial electrical wire can be reduced.
In the following, an embodiment of the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiment. It should be noted that in the specification and the drawings of the present application, the same reference numerals may be assigned to components having substantially the same function/configuration so that repetitive descriptions may be omitted.
<Configuration of Multicore Cable>
First, a configuration of a connector-equipped multicore cable according to the embodiment is described.
A connector-equipped multicore cable 1 according to the embodiment of the present disclosure may be used, for example, as a cable for connecting electronic devices (not shown) to each other. It should be noted that in the diagrams such as
As illustrated in
<Configuration of Multicore Cable>
Next, a configuration of the multicore cable is described.
As illustrated in
<Configuration of Connector>
Next, the configuration of the connector is described. Each of first connector 3 and second connector 4 has a boot 100 and a strain relief 200 as housings. In first connector 3, strain relief 200 is provided on the back side (B side) of boot 100, and in second connector 4, strain relief 200 is provided on the front side (F side) of boot 100. Second connector 4 has the same configuration as that of first connector 3 except for the orientation based on multicore cable 2. Therefore, hereinafter, the configuration of first connector 3 is described in detail, and the description of the configuration of second connector 4 is omitted.
In first connector 3, a through hole (not shown) is formed in strain relief 200, and one end of multicore cable 2 is inserted into boot 100 through the through hole. That is, multicore cable 2 is connected to a first end portion 31 on the back side (B side) of first connector 3. As illustrated in
First connector 3 has a frame 90 made of metal inside boot 100, and frame 90 is connected to metal shell 6a. Frame 90 includes an upper frame 70 made of metal and a lower frame 80 made of metal. Upper frame 70 and lower frame 80 are connected to each other. Upper frame 70 is provided in the upward U direction with respect to lower frame 80. Upper frame 70 and lower frame 80 are both formed by punching and bending metal plates, for example. For example, the thicknesses of the metal plates used in upper frame 70 and lower frame 80 are between 0.1 mm and 0.4 mm.
As illustrated in
As illustrated in
Next, the configuration inside frame 90 is described. First connector 3 includes a first substrate 11 to which multicore cable 2 is connected inside frame 90.
First substrate 11 has a first surface 11A and a second surface 11B. In this example, first surface 11A is the upper surface (U side surface) of first substrate 11, and second surface 11B is the lower surface (D side surface) of first substrate 11. First surface 11A faces upper plate 71, and second surface 11B faces lower plate 81. First substrate 11 has a pad group 40f and a connector pad group 60f. Connector pad group 60f is provided on the front F of pad group 40f. First substrate 11 includes a wiring layer (not shown) that connects pad group 40f and connector pad group 60f. Pad group 40f and connector pad group 60f are provided on first surface 11A and second surface 11B of first substrate 11. For example, the thickness of first substrate 11 is between 0.5 mm and 1.0 mm. First substrate 11 is formed in a substantially flat plate shape. Electronic components such as capacitors and a semiconductor integrated circuit (IC) chips may be mounted on first substrate 11.
Pad group 40f includes a first surface-side pad group 40Af provided on first surface 11A and a second surface-side pad group 40Bf provided on second surface 11B. As illustrated in
As illustrated in
As illustrated in
Connector pad group 60f includes a first surface-side connector pad group 60Af provided on first surface 11A and a second surface-side connector pad group 60Bf provided in second surface 11B. As illustrated in
Connector pads A1 and A12 are ground terminals (GND) for grounding. Connector pads A2 and A3 are high-speed signal transmission terminals (TX1+, TX1−). Connector pads A4 and A9 are bus-power-supply terminals (VBUS). Connector pad A5 is a configuration channel terminal (CC). Connector pads A6 and A7 are data-signal terminals (D+, D−). Connector pad A8 is a sideband terminal (SBU1). Connector pads A10 and A11 are high-speed signal reception terminals (RX2+, RX2−).
Connector pads B1 and B12 are ground terminals (GND) for grounding. Connector pads B2 and B3 are high-speed signal transmission terminals (TX2+, TX2−). Connector pads B4 and B9 are bus-power-supply terminals (VBUS). Connector pad B5 is a connected-power-supply terminal (VCONN). Connector pad B8 is a sideband terminal (SBU2). Connector pads B10 and B11 are high-speed signal reception terminals (RX1+, RX1−).
First surface-side pad group 40Af and second surface-side pad group 40Bf are connected to first surface-side connector pad group 60Af and second surface-side connector pad group 60Bf through the wiring layer provided inside first substrate 11. For example, pads 41 to 44 and 51 to 54 are connected to connector pads A2, A3, A10, A11, B2, B3, B10, and B11, which are high-speed signal transmission terminals (TX1+, TX1−) or high-speed signal reception terminals (RX2+, RX20). For example, pad 41 is connected to connector pad A11, pad 42 is connected to connector pad A10, pad 43 is connected to connector pad A3, and pad 44 is connected to connector pad A2. For example, pad 51 is connected to connector pad B2, pad 52 is connected to connector pad B3, pad 53 is connected to connector pad B10, and pad 54 is connected to connector pad B11. Further, for example, pad 45 is connected to connector pad A12, pad 46 is connected to connector pad A1, pad 55 is connected to connector pad B1, and pad 56 is connected to connector pad B12.
In the RL direction, ground pads C1 and C2 for grounding are provided on first surface 11A so as to sandwich first surface-side connector pad group 60Af. Ground pad C1 is provided on the right R of first surface-side connector pad group 60Af, and ground pad C2 is provided on the left L of first surface-side connector pad group 60Af. Ground pad C1 may be connected to connector pad A12, and ground pad C2 may be connected to connector pad A1.
In the RL direction, ground pads D1 and D2 for grounding are provided on second surface 11B so as to sandwich second surface-side connector pad group 60Bf. Ground pad D1 is provided on the right R of second surface-side connector pad group 60Bf, and ground pad D2 is provided on the left L of second surface-side connector pad group 60Bf. Ground pad D1 may be connected to connector pad B1, and ground pad D2 may be connected to connector pad B12.
Next, the relationship between first substrate 11, multicore cable 2, and connector plug 6 is described.
As illustrated in
Coaxial electrical wire 110 includes a central conductor 111, an insulating layer 112 provided on the periphery of central conductor 111, an external conductor 113 provided on the periphery of insulating layer 112, and an insulating outer sheath 114 provided on the periphery of external conductor 113. Central conductor 111 is connected to pad 41, and external conductor 113 is connected to pad 45.
Coaxial electrical wire 120 includes a central conductor 121, an insulating layer 122 provided on the periphery of central conductor 121, an external conductor 123 provided on the periphery of insulating layer 122, and an insulating outer sheath 124 provided on the periphery of external conductor 123. Central conductor 121 is connected to pad 42, and external conductor 123 is connected to pad 45.
Coaxial electrical wire 130 includes a central conductor 131, an insulating layer 132 provided on the periphery of central conductor 131, an external conductor 133 provided on the periphery of insulating layer 132, and an insulating outer sheath 134 provided on the periphery of external conductor 133. Central conductor 131 is connected to pad 43, and external conductor 133 is connected to pad 46.
Coaxial electrical wire 140 includes a central conductor 141, an insulating layer 142 provided on the periphery of central conductor 141, an external conductor 143 provided on the periphery of insulating layer 142, and an insulating outer sheath 144 provided on the periphery of external conductor 143. Central conductor 141 is connected to pad 44, and external conductor 143 is connected to pad 46.
Coaxial electrical wire 150 includes a central conductor 151, an insulating layer 152 provided on the periphery of central conductor 151, an external conductor 153 provided on the periphery of insulating layer 152, and an insulating outer sheath 154 provided on the periphery of external conductor 153. Central conductor 151 is connected to pad 51, and external conductor 153 is connected to pad 55.
Coaxial electrical wire 160 includes a central conductor 161, an insulating layer 162 provided on the periphery of central conductor 161, an external conductor 163 provided on the periphery of insulating layer 162, and an insulating outer sheath 164 provided on the periphery of external conductor 163. Central conductor 161 is connected to pad 52, and external conductor 163 is connected to pad 55.
Coaxial electrical wire 170 includes a central conductor 171, an insulating layer 172 provided on the periphery of central conductor 171, an external conductor 173 provided on the periphery of insulating layer 172, and an insulating outer sheath 174 provided on the periphery of external conductor 173. Central conductor 171 is connected to pad 53, and external conductor 173 is connected to pad 56.
Coaxial electrical wire 180 includes a central conductor 181, an insulating layer 182 provided on the periphery of central conductor 181, an external conductor 183 provided on the periphery of insulating layer 182, and an insulating outer sheath 184 provided on the periphery of external conductor 183. Central conductor 181 is connected to pad 54, and external conductor 183 is connected to pad 56.
Coaxial electrical wires 110, 120, 130, and 140 are examples of a first coaxial electrical wire, and external conductors 113, 123, 133, and 143 are examples of a first shield layer. Coaxial electrical wires 150, 160, 170, and 180 are examples of a second coaxial electrical wire, and external conductors 153, 163, 173, and 183 are examples of a first shield layer.
Electrical wires 210 each includes a conductor 211 and an insulating layer 212 provided on the periphery of conductor 211. Conductors 211 of the respective electrical wires 210 are connected to pads 47, 48, 49, 50, 57, 58, and 59.
Each connector pins 6b is connected to respective connector pads A1 to A12 and B1 to B12. Further, metal shell 6a is in contact with ground pads C1, C2, D1 and D2.
Here, the relationship between a metal frame 90 and coaxial electrical wires 110, 120, 130, 140, 150, 160, 170, and 180 is described.
Plate spring 75 is provided on upper frame 70 so as to be positioned at the upper U of pad 45 when frame 90 made of metal is fixed to multicore cable 2. Plate spring 76 is provided on upper frame 70 so as to be positioned at the upper U of pad 46 when frame 90 is fixed to multicore cable 2. Plate spring 85 is provided on lower frame 80 so as to be positioned at the lower D of pad 55 when frame 90 is fixed to multicore cable 2. Plate spring 86 is provided on lower frame 80 so as to be positioned at the lower side D of pad 56 when frame 90 is fixed to multicore cable 2. As described above, external conductor 113 of coaxial electrical wire 110 and external conductor 123 of the coaxial electrical wire 120 are connected to pad 45. External conductor 133 of coaxial electrical wire 130 and external conductor 143 of coaxial electrical wire 140 are connected to pad 46. External conductor 153 of coaxial electrical wire 150 and external conductor 163 of coaxial electrical wire 160 are connected to pad 55. External conductor 173 of coaxial electrical wire 170 and external conductor 183 of coaxial electrical wire 180 are connected to pad 56.
Plate spring 75 contacts external conductors 113 and 123 and presses coaxial electrical wires 110 and 120 against first substrate 11. Plate spring 76 contacts external conductors 133 and 143 and presses coaxial electrical wires 130 and 140 against first substrate 11. Plate spring 85 contacts external conductors 153 and 163 and presses coaxial electrical wires 150 and 160 against first substrate 11. Plate spring 86 contacts external conductors 173 and 183 and presses coaxial electrical wires 170 and 180 against first substrate 11. In other words, plate spring 75 is connected to external conductors 113 and 123, plate spring 76 is connected to external conductors 133 and 143, plate spring 85 is connected to external conductors 153 and 163, and plate spring 86 is connected to external conductors 173 and 183.
In the embodiment of the present disclosure, a metallic upper frame 70 is soldered to metal shell 6a. Plate spring 75 provided on upper frame 70 is connected to external conductors 113 and 123, and plate spring 76 is connected to external conductors 133 and 143. That is, external conductors 113, 123, 133, and 143 are electrically connected to metal shell 6a. External conductors 113 and 123 are supplied with the ground potential through connector pad A12 and the wiring layer of first substrate 11. External conductors 133 and 143 are supplied with the ground potential through connector pad A1 and the wiring layer of first substrate 11. Further, external conductors 113, 123, 133, and 143 are also supplied with the ground potential through metal shell 6a. Therefore, noise of signals transmitted through coaxial electrical wires 110, 120, 130, and 140 can be reduced and reliability can be improved.
Similarly, lower frame 80 that is made of metal is soldered to metal shell 6a. Plate spring 85 provided on lower frame 80 is connected to external conductors 153 and 163, and plate spring 86 is connected to external conductors 173 and 183. That is, external conductors 153, 163, 173, and 183 are electrically connected to metal shell 6a. External conductors 153 and 163 are supplied with the ground potential through connector pad B1 and the wiring layer of first substrate 11. External conductors 173 and 183 are supplied with the ground potential through connector pad B12 and the wiring layer of first substrate 11. Further, external conductors 153, 163, 173, and 183 are also supplied with the ground potential through metal shell 6a. Therefore, noise of signals transmitted through coaxial electrical wires 150, 160, 170, and 180 can be reduced and reliability can be improved.
Since upper frame 70 is used for electrical connection between external conductors 113, 123, 133, and 143 and metal shell 6a, and lower frame 80 is used for electrical connection between external conductors 153, 163, 173, and 183 and metal shell 6a, assembly can be easily performed.
In the embodiment of the present disclosure, since upper frame 70 is connected to shield layer 22 of multicore cable 2 through claw portions 78, external conductors 113, 123, 133, and 143 are also electrically connected to shield layer 22. Therefore, noise of signals transmitted through coaxial electrical wires 110, 120, 130, and 140 can be further reduced, and reliability can be further improved. Further, upper frame 70 and lower frame 80 are connected to each other by fitting protrusion 72a into opening 82a and fitting protrusion 73a into opening 83a. Thus, external conductors 153, 163, 173, and 183 are also electrically connected to shield layer 22. Therefore, noise of signals transmitted through coaxial electrical wires 150, 160, 170, and 180 can be further reduced, and reliability can be further improved.
Since plate spring 75 presses coaxial electrical wires 110 and 120 against first substrate 11, coaxial electrical wires 110 and 120 are less likely to be displaced on first substrate 11, and excellent connection reliability is obtained between external conductors 113 and 123 and pad 45. Further, the electrical connection between plate spring 75 and external conductors 113 and 123 can be maintained for a long period of time without soldering. If soldering is performed for connection between plate spring 75 and external conductors 113 and 123 after external conductors 113 and 123 are soldered to pad 45, external conductors 113 and 123 may be separated from pad 45. By omitting soldering for connection between plate spring 75 and external conductors 113 and 123, detachment of external conductors 113 and 123 from pad 45 can be suppressed. The same applies to plate springs 76, 85 and 86.
In addition, a downward D force acts on first substrate 11 from plate springs 75 and 76 through coaxial electrical wires 110, 120, 130, and 140, and an upward U force acts on first substrate 11 from plate springs 85 and 86 through coaxial electrical wires 150, 160, 170, and 180. Therefore, the position of first substrate 11 in the UD direction is stabilized at the position where the spring forces of plate springs 75 and 76 and the spring forces of plate springs 85 and 86 are balanced. For example, if the spring forces of plate springs 75 and 76 are equal to the spring forces of plate springs 85 and 86, the position of first substrate 11 in the UD direction is stable near the center of frame 90.
Plate springs 75, 76, 85 and 86 can be easily formed by punching and bending metal plates. Therefore, it is easy to manufacture upper frame 70 and lower frame 80.
In addition, since one end of multicore cable 2 is inserted into boot 100 and the portion of metal shell 6a is exposed from boot 100, metal shell 6a can be connected to the receptacle of the electronic device and the inner portion of boot 100 of multicore cable 2 can be insulated from the outside.
Although the embodiments have been described in detail, the present invention is not limited to the specific embodiments, and various modifications and changes can be made within the scope of the claims.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2020/021814 | 6/2/2020 | WO |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2021/245801 | 12/9/2021 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 5518421 | Davis | May 1996 | A |
| 20180261956 | Yamaguchi et al. | Sep 2018 | A1 |
| 20190173237 | Oosaka | Jun 2019 | A1 |
| Number | Date | Country |
|---|---|---|
| 110137726 | Aug 2019 | CN |
| H06-243933 | Sep 1994 | JP |
| 2017-069152 | Apr 2017 | JP |
| 2017-135030 | Aug 2017 | JP |
| 2018-152244 | Sep 2018 | JP |
| 2019-102350 | Jun 2019 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20220320805 A1 | Oct 2022 | US |
