This application is the U.S. National Phase under 35 U.S.C. ยง371 of International Application No. PCT/JP2011/073211, filed on Oct. 7, 2011, which in turn claims the benefit of Japanese Application No. 2010-234717, filed on Oct. 19, 2010, the disclosures of which Applications are incorporated by reference herein.
The present invention relates to a connector that electrically connects circuit boards to each other, and to a socket for use in the same.
Heretofore, a connector, which electrically connects circuit boards to each other, has been known (refer to Patent Literature 1). That is to say, a header mounted on one of the circuit boards and a socket mounted on the other circuit board are fitted to each other, whereby contacts corresponding thereto are brought into contact with and conducted to each other, and conductor patterns of the circuit boards to which the respective contacts are connected are electrically connected to each other. Holding fixtures of the header are soldered to the circuit board, whereby bonding strength between the header and the circuit board is enhanced.
[PTL 1] Japanese Patent Laid-Open Publication No. 2009-231046
Incidentally, with a tendency of thinning a portable instrument in recent years, it is required to lower a height of the connector. However, heretofore, it has been difficult to realize a low-height connector while ensuring soldering strength. That is to say, as shown in
Meanwhile, in the case where the soldering terminals of the holding fixtures 240 of the header 200 have the same length as a length of the soldering terminals 220T of the header contacts, then as shown in
The present invention has been made in order to solve the above-described problems. It is an object of the present invention to provide a low-height connector and a socket for use in the same while ensuring the soldering strength and the fitting workability.
A connector according to a first aspect of the present invention is a connector that electrically connects circuit boards to each other by fitting a header and a socket to each other, the connector including: header holding fixtures for holding the header on the circuit board; and a socket molded article as a molded article of the socket, wherein recessed portions with a recessed shape are formed on the socket molded article so that soldering terminals of the header holding fixtures cannot interfere with the socket molded article when the header and the socket are fitted to each other.
A connector according to a second aspect of the present invention is characterized in that the soldering terminals of the header holding fixtures have the same length as a length of soldering terminals of header contacts electrically connected to the circuit board.
A connector according to a third aspect of the present invention is characterized in that the header holding fixtures are manufactured by using the same components as those of the header contacts electrically connected to the circuit board.
A connector according to a fourth aspect of the present invention is characterized in that the recessed shape of the socket molded article has a tapered shape or an R-shape.
A socket according to a fifth aspect of the present invention is a socket characterized in being used for the connector according to any one of the first to fourth aspects.
a) and 1(b) are views showing a connector of this embodiment:
a) to 2(d) are views for explaining in detail recessed portions formed on the socket of this embodiment:
a) and 3(b) are views showing specific examples of the socket and header of this embodiment:
a) to 4(c) are views showing specific examples of the socket and header of this embodiment:
a) and 5(b) are cross-sectional views when the socket and header of this embodiment are fitted to each other:
a) and 6(b) are views showing a conventional connector:
a) and 7(b) are views showing another conventional connector:
A description is made below in detail of embodiments of the present invention with reference to the drawings.
a) is an overall perspective view of a socket 10 of this embodiment. As shown in this drawing, the socket 10 includes a socket molded article 11 molded of insulating synthetic resin into a rectangular shape as a whole. The socket molded article 11 includes: a peripheral wall portion 13 formed along a peripheral edge portion thereof; and an island portion 14 formed on a center portion thereof. Between the peripheral wall portion 13 and the island portion 14, a fitting groove portion 15 that fits a header 20 thereto is formed. In a longitudinal direction of the socket molded article 11, a plurality of socket contacts 12 are attached at a predetermined pitch p. The socket contacts 12 are belt-like metal members having a predetermined thickness. Connection terminal portions 12T of the socket contacts 12 protrude outward from a lower edge of the peripheral wall portion 13, and are soldered to a conductor pattern of a circuit board (not shown). On both end portions in the longitudinal direction of the socket molded article 11, recessed portions 16 with a recessed shape are formed so that soldering terminals (described later) of header holding fixtures 24 cannot interfere with the socket molded article 11. In other words, in the socket 10, the recessed portions 16, which accept the soldering terminals of the header holding fixtures 24 when the header 20 and the socket 10 are fitted to each other, are provided on portions thereof corresponding to the soldering terminals concerned. In this embodiment, as shown in
b) is an overall perspective view of the header 20 of this embodiment. As shown in this drawing, the header 20 includes a header molded article 21 molded of insulating synthetic resin into a rectangular shape substantially similar to that of the socket molded article 11 as a whole. The header molded article 21 includes a peripheral wall portion formed along a peripheral edge portion thereof. In a longitudinal direction of the header molded article 21, a plurality of header contacts 22 are attached at a pitch p equal to the pitch p of the socket contacts 12. The header contacts 22 are belt-like metal members having a predetermined thickness like the socket contacts 12. Connection terminal portions 22T of the header contacts 22 protrude outward from a lower edge of the peripheral wall portion 23 and are soldered to a conductor pattern of a circuit board (not shown). To both end portions in the longitudinal direction of the header molded article 21 are attached the header holding fixtures 24 formed by performing press molding for metal plates with a predetermined thickness. The soldering terminals of the header holding fixtures 24 are soldered to the circuit board (not shown), and in combination with the fact that the connection terminal portions 22T of the header contacts 22 are soldered, the header 20 is strongly bonded to the circuit board.
a) to (d) are views for explaining in detail the recessed portions 16 formed on the socket 10. That is to say,
As described above, in the connector of this embodiment, the recessed portions 16 with the recessed shape are formed on the socket molded article 11 so that the soldering terminals of the header holding fixtures 24 cannot interfere with the socket molded article 11 when the header 20 and the socket 10 are fitted. In such a way, it is possible to provide a connector with a low-height (for example, a height of 1.5 mm or less) while ensuring soldering strength and fitting workability.
Moreover, in the connector of this embodiment, the soldering terminals of the header holding fixtures 24 have the same length as that of the soldering terminals of the header contacts 22. In such a way, the header holding fixtures 24 and the header contacts 22 can be cut simultaneously, thereby simplifying the process and stabilizing the dimensions.
Moreover, in the connector of this embodiment, the header holding fixtures 24 are manufactured by using the same components as the header contacts 22. In such a way, not only the parts count can be reduced, but also the dimensions can be stabilized since the header holding fixtures 24 and the header contacts 22 are connected to the same carrier portion 25.
Furthermore, in the connector of this embodiment, the recessed shape of the socket molded article 24 has the tapered shape or the R-shape. In such a way, it is possible to maintain the strength of the socket molded article 11 to be high.
Note that the description has been made above of the preferred embodiment; however, the present invention is not limited to the above-described embodiment, but is modifiable in various ways. For example, specifications such as the sizes and materials of the molded articles, contacts and the like of the connector are changeable as appropriate.
The entire contents of Japanese Patent Application No. 2010-234717 (filed on Oct. 19, 2010) are incorporated herein by reference.
The present invention is useful for application to a connector and to a socket for use in the same, the connector requiring to be low in height while ensuring the soldering strength and the fitting workability.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2010-234717 | Oct 2010 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2011/073211 | 10/7/2011 | WO | 00 | 4/16/2013 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2012/053380 | 4/26/2012 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 5626482 | Chan et al. | May 1997 | A |
| 7367816 | Liu | May 2008 | B2 |
| 8272881 | Miyazaki et al. | Sep 2012 | B2 |
| Number | Date | Country |
|---|---|---|
| 2002-033145 | Jan 2002 | JP |
| 2006-210206 | Aug 2006 | JP |
| 2008-218095 | Sep 2008 | JP |
| 2008-243703 | Oct 2008 | JP |
| 2009-231046 | Oct 2009 | JP |
| 2009-283357 | Dec 2009 | JP |
| 2009-283357 | Dec 2009 | JP |
| Entry |
|---|
| International Search Report mailed Jan. 10, 2012 issued in corresponding International Application No. PCT/JP2011/073211. |
| Number | Date | Country | |
|---|---|---|---|
| 20130203272 A1 | Aug 2013 | US |