The Present Disclosure claims priority to prior-filed Japanese Patent Application No. 2012-133170, entitled “Connector,” filed on 13 Jun. 2012 with the Japanese Patent Office. The content of the aforementioned Patent Application is incorporated in its entirety herein.
The Present Disclosure relates, generally, to a connector.
Typically, electronic equipment includes miniaturized, high-performance components. Accordingly, miniaturization and densification of the connector are also required. Therefore, it was proposed that a plurality of conductors patterns be formed on an insulating film substrate, as well as a connector which connected the ends of these conductor patterns to another substrate. An example of this is disclosed in Japanese Patent Application No. 2007-114710, the content of which is hereby incorporated by reference herein in its entirety.
Additionally, during the nesting process, the positive connector (not illustrated) is forced to move with respect to the negative connector in the thickness direction (a direction perpendicular to the Figure) of the negative connector and carries out nesting. At the same time, a convex positive side electrode (not illustrated) projecting from the surface of the negative connector protuberantly enters the wide portions of the inner side opening 954a. Then, when the positive connector is forced to move with respect to negative connector in the longitudinal direction of the Figure, the positive side electrode protuberance moves within the narrow portion.
However, in the conventional connector, since the rear end 958 is welded on circuit wires formed on the surface of the substrate by reflow soldering, for example, when electronic components with low heat resistance are mounted on the substrate, it becomes difficult to use the connector. Further, although a cohesive conductive film such as an anisotropic conductive film can also be used (in lieu of soldering) for connecting the rear end 958 to wires, it is difficult to simultaneously and uniformly apply a pressing force and to connect the plurality of rear ends 958 by pressure.
An object of the Present Disclosure is to provide a connector to solve the aforementioned disadvantages of the conventional connector. Accordingly, the connector is configured as a face of the rear end outwardly extending to the main body on the side of the mounting part more distant to the surface of the mounting part than a face of the main body on the side of the mounting part, and includes an anisotropic conductive film provided between a face of the rear end on the side of the mounting part and the terminal connecting part provided on the surface of the mounting part. It is possible to uniformly push the anisotropic conductive film and to reliably and easily connect the rear ends of the plurality of conductors to wires of the substrate. Accordingly, miniaturization, flattening and reliability are enhanced.
Therefore, in the connector of the Present Disclosure, a connector has a tabulate main body and a plurality of tabulate conductors provided on the main body, and is nested with a pairing connector. Each conductor includes a tabulate terminal located in the main body and engaged with a pairing terminal of the pairing connector, and a rear end outwardly extended to the main body and connected to a terminal connecting part provided on the surface of a mounting part. A face of the rear end on the side of the mounting part is more distant to the surface of the mounting part than a face of the main body on the side of the mounting part. The rear end is connected to the terminal connecting part through an anisotropic conductive film provided between the face on the side of the mounting part and the terminal connecting part.
Further, in another connector of the Present Disclosure, the pairing terminal protrudes. The tabulate terminal is a tabulate part located in a terminal accommodating opening, and includes a pair of contacting arm parts. When the protruded terminal accommodated in the terminal accommodating opening makes relative movement within the terminal accommodating opening, the pair of contacting arm parts elastically deforms to clamp the protruded terminal.
Further, in yet another connector of the Present Disclosure, the main body includes an enhanced layer provided on the conductor at the side of mounting part. The pairing connector is nested with the connector, and a front terminal of the protruded terminal accommodated in the terminal accommodating opening is more distant to the surface of the mounting part than a face of the main body on the side of the mounting part.
Further, in yet another connector of the Present Disclosure, the connector includes a tabulate framework provided on the conductor at the opposite side of the mounting part. A portion of the framework covers the rear end on the opposite side of the mounting part, a face of the framework on the opposite side of the mounting part becomes a pressured face bearing the pressure force of a force-exerting part, and the force-exerting part is used to exert pressure on the anisotropic conductive film.
Further, in yet another connector of the Present Disclosure, the connector further includes a tabulate framework provided on the conductor at the opposite side of the mounting part. The framework includes a peristome corresponding to the rear end, so that a portion of a force-exerting part exerting pressure on the anisotropic conductive film can enter into the peristome.
The organization and manner of the structure and operation of the Present Disclosure, together with further objects and advantages thereof, may best be understood by reference to the following Detailed Description, taken in connection with the accompanying Figures, wherein like reference numerals identify like elements, and in which:
While the Present Disclosure may be susceptible to embodiment in different forms, there is shown in the Figures, and will be described herein in detail, specific embodiments, with the understanding that the Present Disclosure is to be considered an exemplification of the principles of the Present Disclosure, and is not intended to limit the Present Disclosure to that as illustrated.
As such, references to a feature or aspect are intended to describe a feature or aspect of an example of the Present Disclosure, not to imply that every embodiment thereof must have the described feature or aspect. Furthermore, it should be noted that the description illustrates a number of features. While certain features have been combined together to illustrate potential system designs, those features may also be used in other combinations not expressly disclosed. Thus, the depicted combinations are not intended to be limiting, unless otherwise noted.
In the embodiments illustrated in the Figures, representations of directions such as up, down, left, right, front and rear, used for explaining the structure and movement of the various elements of the Present Disclosure, are not absolute, but relative. These representations are appropriate when the elements are in the position shown in the Figures. If the description of the position of the elements changes, however, these representations are to be changed accordingly.
Referring to
Additionally, positive connector 1 has tabulate main body 11 whose flat shape is rectangular. Beginning from the side of the mounting face (i.e., the opposite side of the face as shown in
Base film 15 is made of, for example, resin; however its material can be of any kind of material quality in case of materials with insulativity. Furthermore, on another face (a face on the side of mounting face) of base film 15, there is provided with the flat lamina part used as enhanced layer 16 of plate-shaped enhanced plate part. Enhanced layer 16 is made of, for example, metal; however its material could be resin, and also could be a composite material including glass fiber or carbon fiber, and could be of any kind of material quality.
Additionally, conductor patterns 51, for example, are formed by means of applying processes, such as etching, for patterning on copper foil with the thickness of several dozens of μm, which is previously attached on one face of base film 15. Conductor patterns 51 extend in front-back direction of positive connector 1 (main body 11), and are arranged parallel to each other in a direction of the width of positive connector 1 (main body 11), and adjacent conductor patterns 51 are separated by pattern separating space 52.
Each conductor pattern 51 comprises conductors (i.e., positive conductors) functioning as multiple lines of wires arranged parallel, and includes protruded terminal 53 which exposes from the nesting face of main body 11 and functions as a pairing terminal (i.e., positive terminal). In addition, as shown in the Figures, although conductor patterns 51 are divided into a wide pattern formed with three protruded terminals 53 as well as a narrow pattern formed with protruded terminal 53, and are configured as being composed of the wide pattern and the narrow pattern along a row front end 11a and back end 11b of each main body 11, number, interval and other arrangement means of conductor pattern 51 and protruded terminal 53 are not limited to the examples shown and can be altered.
Each protruded terminal 53 includes a part protruding from surface of conductor pattern 51, and, for example, is integrated with conductor pattern 51 by etching means such as photolithography. In addition, the height of protruded terminal 53 is about 0.1-0.3 mm, and can properly change. Furthermore, as shown, the transverse cross sections of the front terminal and the shaft of protruded terminal 53 preferably has a shape having a bigger size in front-back direction and a smaller size in left-right direction. Although preferably transverse cross section of the front terminal is bigger than that of the shaft, the shape can properly change.
Moreover, each conductor pattern 51 includes rear end 58 extending in the front-back direction of main body 11. Each rear end 58 outwardly protrudes from front end 11a and back end 11b of main body 11, and is connected to a terminal connecting part (i.e., surface of wires or connecting pad conducting to wires) formed on the surface of the first substrate (not illustrated). Thus, positive connector 1 is mounted on the first substrate, and conductor pattern 51 and protruded terminal 53 come into a state of electrically connecting to wires of the first substrate.
On edges of main body 11 on both the left and right side, there is formed ear part 21 as a positive nesting lock part which outwardly extends in width direction. Moreover, although ear part 21 includes front ear part 21a and back ear part 21b, and accommodating groove 22 is formed between front ear part 21a and back ear part 21b, the number and configuration can properly change as required. Furthermore, on nesting faces of front ear part 21a and back ear part 21b, there are provided auxiliary accessories 56. Auxiliary accessory 56, together with conductor pattern 51, are formed by means of applying processes, such as etching, for the purpose of patterning on copper foil with the thickness of several dozens of μm, previously attached on one face of base film 15. Moreover, side edge of auxiliary accessory 56 of front ear part 21a is formed with engaging groove 56a.
Furthermore, although negative connector 101 in this embodiment is a tabulate flat connector which on the whole has a shape of rectangle, and its size in width direction is about 0.3-0.5 mm, its size can properly change. As shown in
Each conductor pattern 151 comprises conductors (i.e., positive conductors) functioning as multiple parallel lines of wires, and includes a tabulate terminal (i.e., accommodating terminal 153 functioning as negative terminal) which exposes from connecting groove 114 in nesting face of main body 111. In addition, as shown, although conductor patterns 151 are divided into a wide pattern formed with three accommodating terminals 153, as well as a narrow pattern formed with protruded terminal 153, and each row of main body 111 on side of front end 111a and side of back end 111b are composed of the wide pattern and the narrow pattern, the number, interval and other arrangement means of conductor patterns 151 and accommodating terminal 153 are not limited to the examples shown and can be altered.
Each accommodating terminal 153 is accommodated in terminal accommodating opening 154, which runs through conductor pattern 151 in thickness direction. Typically, patterns left after patterning conductor pattern 151 become accommodating terminals 153, and the removed parts of materials around accommodating terminal 153 become terminal accommodating opening 154. Therefore, the thickness of accommodating terminal 153 is equal to that of conductor pattern 151. Moreover, each accommodating terminal 153 includes pair of contacting arm parts 153a, whose bottom part is connected to the periphery portion of accommodating terminal 153 in conductor pattern 151 (i.e., edge of terminal accommodating opening 154). Contacting arm part 153a possesses flexibility, and can elastically deform along the width direction of negative connector 101. Furthermore, terminal accommodating opening 154 includes inner side opening 154a inside accommodating terminal 153 and outside opening 154b outside accommodating terminal 153. Inner side opening 154a is the portion of protruded terminal 53 which gets in and is accommodated when accommodating terminal 153 is nested with protruded terminal 53 of positive connector 1, and outside opening 154b is the portion allowing contacting arm part 153a to deform.
In addition, inner side opening 154a has a large area, and typically, its width size is larger than the width size of the front terminal of protruded terminal 53. Furthermore, its size in the up-down direction is also larger than the size in the up-down direction of the front terminal of protruded terminal 53. Therefore, protruded terminal 53 can successfully enter into inner side opening 154a. On the other hand, the gap between opposite-arranged portions of a pair of contacting arm parts 153a is a space with small width, and typically, its width size is smaller than the width size of the shaft of protruded terminal 53. Therefore, when protruded terminal 53, accommodated in the inner side opening 154a, makes relative movements within the gap between opposite-arranged portions of contacting arm part 153a, since the gap between opposite-arranged portions of contacting arm part 153a is against to side face of the shaft of protruded terminal 53 and is extended, with elasticity of contacting arm part 153a, opposite-arranged portions of contacting arm part 153a become a state of being pushed by the side face of the shaft of protruded terminal 53. That is, pair of contacting arm parts 153a elastically clamps protruded terminal 53 from both sides.
Furthermore, inner side opening 154a has a shape as, when approaching the gap between opposite-arranged portions of the contacting arm part 153a, the width size gradually reduces. That is, opposite-arranged contacting arm parts 153a are shaped as inclined taper. Therefore, protruded terminal 53 can successfully enter into the gap between opposite-arranged portions of opposite-arranged contacting arm parts 153a.
In addition, the left side and right side of conductor pattern 151 are provided with negative auxiliary accessories 157. Each negative auxiliary accessory 157 is separated from conductor pattern 151, and spaced between negative auxiliary accessory 157 and conductor pattern 151 is engaging space part 156, which accommodates auxiliary accessory 56 of positive connector 1. In addition, engaging stop arm 157a is formed on negative auxiliary accessory 157, and engaging stop arm 157a is an elastic part with a shape of cantilever, and its protruding portion at a front end is engaged with engaging groove 56a of auxiliary accessory 56.
Additionally, individual conductor pattern 151 includes rear end 158, which extends towards outside of main body 111 along front-back direction. Each rear end 158 is connected to, through later-mentioned Anisotropic Conductive Film (ACF) 161, later-mentioned terminal connecting part 193 formed on surface 191a of second substrate 191, i.e., the surface of a wire or the connecting pad conducting to wires. Thus, negative connector 101 is mounted on second substrate 191, and conductor pattern 151 and accommodating terminal 153 come into a state of electrically connecting to wires of second substrate 191.
In addition, as shown in
Enhanced layer 116 is made of, for example, metal; however its material could be resin, and also could be a composite material, and could be of any kind of material quality. Furthermore, base film 115 is made of, for example, resin; however its material can be of any kind of insulative material. Moreover, although profile sizes of enhanced layer 116 and base film 115 are slightly bigger than connecting groove 114, such profile sizes may be smaller than the profile size of enhanced frame layer 118. Especially, sizes in front-back direction of enhanced layer 116 and base film 115 may be significantly smaller than the profile size of enhanced frame layer 118. Therefore, in a top view, enhanced layer 116 and base film 115 almost will not exceed outside the enhanced frame layer 118, especially in the front-back direction. In addition, on enhanced layer 116 and base film 115, at positions corresponding to terminal accommodating opening 154 of conductor pattern 151, and corresponding to engaging space part 156 between negative auxiliary accessory 157 and conductor pattern 151, there are formed terminal corresponding opening 116a and 115a and engaging space corresponding openings 116b and 115b.
Furthermore, enhanced frame layer 118 is a tabulate part made of, for example, metal, and with a surface shape substantially a rectangle ring. In addition, its material could be resin, a composite material, or any kind of material quality. Moreover, enhanced frame layer 118 includes a pair of transverse frame parts 118a extending along width direction of negative connector 101 (transverse direction of
Moreover, the cover film 117 is made of, for example, resin; however its material can be of any kind of insulative material. Moreover, cover film 117 includes transverse frame part 117a, longitudinal frame part 117b and connecting opening 117c, substantially corresponding to transverse frame part 118a and longitudinal frame part 118b of enhanced frame layer 118 as well as connecting opening 118c. Transverse frame part 117a of cover film 117 and transverse frame part 118a of enhanced frame layer 118 extend to front end 111a and back end 111b of main body 111. Therefore, face of rear end 158 on the opposite side of second substrate 191 (upper portion of
In addition, on longitudinal frame part 118b of enhanced frame layer 118, there is formed ear part 121 as a negative nesting lock part extending inwardly along width direction, and accommodating groove 122 is formed adjacent to ear part 121. Moreover, ear part 121 includes front ear part 121a and back ear part 121b, accommodating groove 122 includes front accommodating groove 122a and back accommodating groove 122b. In addition, number and configuration of ear part 121 and accommodating groove 122 can properly change to be corresponding to ear part 21 of positive connector 1.
Furthermore, as shown in
Therefore, when negative connector 101 is surface-mounted on second substrate 191, first of all, when anisotropic conductive film 161 is arranged between rear end 158 and terminal connecting part 193, negative connector 101 is carried onto predetermined position on surface 191a of second substrate 191. In addition, for example, the side at front end 111a and back end 111b of main body 111 is respectively provided with a piece of anisotropic conductive film 161. For example, two pieces of anisotropic conductive films 161 with lengths comparable to the width direction of main body 111 and with widths comparable to size of front-back direction of transverse frame part 118a of enhanced frame layer 118 are previously prepared. Then, individual anisotropic conductive film 161 is arranged between a face on the side of second substrate 191 of rear end 158 on front end 111a side of main body 111 and terminal connecting part 193, and between a face on the side of second substrate 191 of rear end 158 on back end 111b side of main body 111 and terminal connecting part 193.
Then, a pushing face of the pressure head of a heat press device heated by a heating device is pushed against a face of enhanced frame layer 118 on the side of nesting face, and enhanced frame layer 118 is pushed towards second substrate 191. Thus, since anisotropic conductive film 161 is heated and pressed through enhanced frame layer 118, rear end 158 and terminal connecting part 193 are adhered and conductive. In addition, it is known that, since the heating temperature in reflow soldering is usually 220-60° C., while the heating temperature of anisotropic conductive film 161 is 180-200° C., compared with welding, by using anisotropic conductive film 161, a lower temperature can be applied to connect rear end 158 and terminal connecting part 193.
Furthermore, the pushing face of the pressure head is, for example, rectangular, and has sizes in width direction and in front-back direction larger than sizes in width direction and in front-back direction of enhanced frame layer 118. Thus, it is possible to uniformly push enhanced frame layer 118. Further, it is possible to uniformly push anisotropic conductive film 161.
In addition, as shown in
Furthermore, when pressing anisotropic conductive film 161, since enhanced layer 116 and base film 115 function as spacers, the distance between rear end 158 and terminal connecting part 193 is kept fixed. Therefore, anisotropic conductive film 161 will not be excessively compressed due to pressure, and is compressed at a fixed amount of compression, thus the predetermined conductive state caused by conductive filler can always be achieved, and non-resistance of rear end 158 and terminal connecting part 193 is stable. Furthermore, since anisotropic conductive film 161 will not be excessively compressed, the adhesive will not leak out from anisotropic conductive film 161 and pollute the environment.
Additionally, since rear end 158 is a wide sheet-shaped part with large area, and transverse frame part 118a, as a part of enhanced frame layer 118 located on rear end 158, is also a rectangular plate part with large area, a pressure force, through transverse frame part 118a and rear end 158, is uniformly applied to anisotropic conductive film 161 located below rear end 158. Additionally, since transverse frame part 118a on the side of front end 111a and transverse frame part 118a on the side of back end 111b of main body 111 is connected by longitudinal frame part 118b so as to be integrated, a pressure force, through transverse frame part 118a on the side of front end 111a and transverse frame part 118a on the side of back end 111b, is uniformly applied to anisotropic conductive film 161 carried at the side of front end 111 and anisotropic conductive film 161 carried at the side of back end 111b of main body 111.
Additionally, since rear end 158 does not protrude from enhanced frame layer 118 and is located below the transverse frame part 118a, it is not necessary that the pushing face of the pressure head have a complex shape for pushing rear end 158, as long as it is a flat face that can push enhanced frame layer 118. Therefore, the cost for processing pressure head is not needed. In addition, in this embodiment, although descriptions are made in a case that rear end 58 of positive connector 1 is used as a part that is connected to terminal connecting part formed on surface of first substrate by means such as welding, similar to rear end 158 of negative connector 101, modifications can made so that anisotropic conductive film 161 is used to make connection. Moreover, when nesting positive connector 1 and negative connector 101, first of all, as shown in
Then, positive connector 1 descends relative to negative connector 101; i.e., moves in an engaging direction, forcing the nesting face of positive connector 1 to be opposite-arranged with, against and approach the nesting face of negative connector 101, so that positive connector 1 is accommodated in connecting groove 114 of negative connector 101. Thus, ear part 21 of positive connector 1 enters into corresponding accommodating groove 122 of negative connector 101. Furthermore, auxiliary accessory 56 enters into engaging space part 156. Additionally, each protruded terminal 53 enters into inner side opening 154a at inner side of accommodating terminal 153.
Then, positive connector 1 slides upward relative to negative connector 101 in a locking direction; i.e., in a state that the surface of positive connector 1 is put against or approaches the surface of negative connector 101, positive connector 1 slides forward (the direction to front end 111a) relative to negative connector 101. In such case, individual protruded terminal 53 enters into inner side opening 154a at the inner side of corresponding accommodating terminal 153, slides and is guided in a state that left and right ear parts 21 and auxiliary accessory 56 enter into left and right accommodating grooves 122 and engaging space part 156. Thus, the posture of positive connector 1 relative to negative connector 101 will not be tousled.
Additionally, as shown in
Furthermore, when positive connector 1 slides relative to negative connector 101 in the locking direction (i.e., forward), protruded terminal 53 entered in inner side opening 154a at the inner side of accommodating terminal 153 moves relative to inner side opening 154a, and enters into the gap between opposite-arranged contacting arm parts 153a. Thus, since the gap between contacting arm parts 153a is put against the side face of the shaft of protruded terminal 53 and is extended due to the elasticity of contacting arm part 153a, contacting arm part 153a is pushed by the side face of the shaft of protruded terminal 53. That is to say, the pair of contacting arm parts 153a elastically clamps the shaft of protruded terminal 53 from both sides. Then, this helps contacting arm part 153a to clamp the shaft of protruded terminal 53, and to keep the nested state.
Additionally, accommodating terminal 153 includes a thin wall, as shown in
In this way, in this embodiment, the connector is negative connector 101 which has tabulate main body 111, and a plurality of tabulate conductor pattern 151 provided on tabulate main body 111, and which is nested with positive connector 1. Moreover, individual conductor pattern 151 is located within main body 111, and includes accommodating terminal 153 which is engaged with protruded terminal 53 of positive connector 1 (i.e., pairing terminal), and rear end 158 which extends towards outside main body 111 and is connected with terminal connecting part 193 provided on surface 191a of second substrate 191. The face of rear end 158 on the side of second substrate 191 is more distant from surface 191a of second substrate 191 than the face of main body 111 on the side of second substrate 191. Rear end 158 is connected with terminal connecting part 193 through anisotropic conductive film 161 provided between its face on the side of second substrate 191 and terminal connecting part 193.
Therefore, in a state that negative connector 101 is carried onto surface 191a of second substrate 191, anisotropic conductive film 161 is located between rear end 158 and terminal connecting part 193, and can be connected with terminal connecting part 193 without deforming tabulate conductor pattern 151. Furthermore, when pressing anisotropic conductive film 161, since a part of the main body 111, which is closer to second substrate 191 than conductor pattern 151, function as spacers, the distance between rear end 158 and terminal connecting part 193 is kept fixed. Thus, anisotropic conductive film 161 will not be excessively compressed due to pressure, and is compressed at a fixed amount of compression, thus on-resistance of rear end 158 and terminal connecting part 193 is stable. Additionally, since anisotropic conductive film 161 will not be excessively compressed, the adhesive will not leak out from anisotropic conductive film 161 to pollute the environment.
Furthermore, the pairing terminal is the protruded terminal 53, accommodating terminal 153 is a tabulate part located in terminal accommodating opening 154, and includes the pair of contacting arm parts 153a, when protruded terminal 53, accommodated in the terminal accommodating opening, moves within terminal accommodating opening 154, the pair of contacting arm parts 153a elastically deforms to clamp protruded terminal 53. Therefore, contact between protruded terminal 53 and accommodating terminal 153 is reliably maintained.
Additionally, main body 111 includes enhanced layer 116 provided closer to the side of second substrate 191 than conductor pattern 151; positive connector 1 and negative connector 101 get engaged so that the front terminal of protruded terminal 53 accommodated in terminal accommodating opening 154 is more distant to front face 191a of second substrate 191 than the face of main body 111 on the side of second substrate 191. Therefore, even if the front terminal of protruded terminal 53 protrudes from the face of accommodating terminal 153 at the side of second substrate 191, the front terminal of protruded terminal 53 still will not be put against surface 191a of second substrate 191 to cause damage on such front face 191a, and will not unnecessarily conduct to wires and the like formed on front face 191a.
Moreover, there is also provided with tabulate enhanced frame layer 118 provided on the opposite side of second substrate 191 of conductor pattern 151, transverse frame part 118a of enhanced frame layer 118, which covers the opposite side of second substrate 191 of rear end 158. The face of enhanced frame 18 on the opposite side of second substrate 191 becomes the pressed face, and it bears pressure force for pressing force-exerting part of anisotropic conductive film 161. Therefore, pressure force is uniformly applied onto anisotropic conductive film 161.
Referring to
In this embodiment, enhanced frame layer 118 of negative connector 101 includes a pair of longitudinal frame part 118b, but not transverse frame part 118a. Therefore, a part corresponding to rear end 158 of conductor pattern 151 is peristome 118g. Moreover, left and right longitudinal frame parts 118b are connected by connecting stick 118d which extends in width direction of negative connector 101. In addition, as shown, although only one of connecting stick 118d is arranged at a position adjacent to back end 111b of main body 111, connecting stick 118d can be added at a position adjacent to front end 111a of main body 111. Therefore, connecting opening 118c is delimited at three directions by the pair of longitudinal frame parts 118b and one connecting stick 118d, or delimited at four directions by the pair of longitudinal frame parts 118b and the pair of connecting sticks 118d. In addition, above rear end 158 of conductor pattern 151 (direction to side of nesting face), there is no connecting stick 118d, and connecting stick 118d is arranged at a position closer to the center of front-back direction than rear end 158.
Furthermore, the front and back ends of longitudinal frame part 118b descend further than the other portions (i.e., enhanced body 118f); i.e., they become a supporting leg 118e closer to mounting face of negative connector 101. Therefore, in a side view, enhanced body 118f and supporting legs 118e on both sides are all extended parallel to mounting face of negative connector 101. Enhanced body 118f is more distant to the mounting face of negative connector 101 than supporting leg 118e. The connecting part between enhanced body 118f and supporting leg 118e is bent into a crank shape.
Additionally, the face of supporting leg 118e on the side of second substrate 191 and the face of enhanced layer 116 on the side of second substrate 191 are almost in the same plane. Therefore, when negative connector 101 is carried onto surface 191a of second substrate 191 so that face of enhanced layer 116 on the side of second substrate 191 is put against a surface of second substrate 191, face of supporting leg 118e on the side of second substrate 191 is also put against surface 191a of second substrate 191.
Moreover, rear end 158 of conductor pattern 151 and transverse frame part 117a of cover film 117 are arranged between the left and right supporting legs 118e, and the face of the transverse frame part 117a on the side of nesting face is not covered by enhanced frame layer 118 to be exposed. In addition, since structures of other aspects of negative connector 101 are the same with the first embodiment, descriptions thereof are omitted. Furthermore, since structure of positive connector 1 is the same with the first embodiment, descriptions thereof are omitted.
Although pressure head 181 almost has an oblong shape, both ends in a direction of long side of a portion of it (specifically, the bottom surface) are provided with a pair of pressing bulge 182 formed as protruding downwardly. Moreover, bottom surface of pressing bulge 182 is against to transverse frame part 117a of cover film 117 of negative connector 101, to become a pressed flat pressing against face 182a. In addition, portion between the pair of pressing bulge 182 becomes a relatively upwardly recessed contrast concave 183.
The width of the bottom surface of pressure head 181 (i.e., size in width direction of pressing against face 182a) is shorter than interval between left and right supporting legs 118e of negative connector 101, and is set to be comparable to size in width direction of transverse frame part 117a of cover film 117. Furthermore, the length of contrast concave 183 is longer than the length of enhanced body 118f of negative connector 101. Thus, pressure head 181 can press transverse frame part 117a of cover film 117 and rear end 158 of conductor pattern 151 without pressing enhanced frame layer 118 of negative connector 101. Moreover, when negative connector 101 is surface-mounted onto second substrate 191, similar to the first embodiment, in a state that anisotropic conductive film 161 is located between rear end 158 and terminal connecting part 193, negative connector 101 is loaded onto a predetermined position on surface 191a of second substrate 191.
Then, as shown in
Then, the heat press device (not illustrated) commences, forcing pressure head 181 to descend, i.e., moves towards second substrate 191, as shown in
In this embodiment, pressing against face 182a of pressure head 181 is only put against and pushes transverse frame part 117a of cover film 117 on anisotropic conductive film 161, without pushing other parts of negative connector 101 such as enhanced frame layer 118. Anisotropic conductive film 161 is located between rear end 158 and terminal connecting part 193. Therefore, anisotropic conductive film 161 can be pressed with high pressure force, without raising pushing force exerted by pressure head 181. Furthermore, since the heat of heated pressure head 181 will not be delivered to other parts of negative connector 101 such as enhanced frame layer 118, it becomes possible to efficiently heat anisotropic conductive film 161. In addition, as for other structures and operations of surface-mounting on second substrate 191 of negative connector 101, since they are the same with the first embodiment, descriptions thereof are omitted.
Furthermore, in this embodiment, although a case that rear end 58 of positive connector 1 is the part connected with terminal connecting part formed on surface of first substrate by means such as welding is described, however, similar to rear end 158 of negative connector 101, changes can be made so that connection is made by anisotropic conductive film 161. Additionally, for operation of nesting positive connector 1 and negative connector 101, since it is the same with the first embodiment, descriptions thereof are omitted.
In this way, in this embodiment, there is also provided a tabulate enhanced frame layer 118 arranged at opposite side of second substrate 191 of conductor pattern 151. Enhanced frame layer 118 includes a peristome 118g corresponding to rear end 158, so that pressing bulge 182 of pressure head 181 of pressing anisotropic conductive film 161 can enter into peristome 118g. Therefore, anisotropic conductive film 161 can be pressed with high pressure force, without raising pushing force exerted by pressure head 181. Furthermore, since heat of heated pressure head 181 will not be delivered to other parts of negative connector 101 such as enhanced frame layer 118, it becomes possible to efficiently heat anisotropic conductive film 161. In addition, as for effects of other aspects, since they are the same with the first embodiment, descriptions thereof are omitted.
While a preferred embodiment of the Present Disclosure is shown and described, it is envisioned that those skilled in the art may devise various modifications without departing from the spirit and scope of the foregoing Description and the appended Claims.
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2012-133170 | Jun 2012 | JP | national |
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