1. Field of the Invention
The present invention is directed generally to communications connectors and port modules used with patch panels, and in particular, to multi-cable communications connectors and multi-outlet modules used with patch panels.
2. Description of the Related Art
Presently, to connect multiple communication cables (e.g., Augmented Category 6 cables) together, multiple male and female connectors are used to create separate communication connections for each cable. Further, even though a port module may include multiple forwardly facing outlets, at the back of the port module, each outlet typically has a plurality of insulation displacement connectors that must be connected individually to the wires of a cable. These prior art methods of effecting multiple cable connections are time consuming and may be expensive to implement. Therefore, a need exists for connectors and port modules configured to implement multiple cable connections in a more efficient manner. The present application provides these and other advantages as will be apparent from the following detailed description and accompanying figures.
The trunk cables 20 may be connected to a patch panel 30 mounted inside a conventional rack 34. One or more multi-outlet modules 40 identified individually by reference numeral 44 may be mounted inside the patch panel 30. In the embodiment illustrated, the patch panel 30 includes eight of the multi-outlet modules 40, which may be configured to fit within one rack unit (“RU”). The multi-outlet module 44 has a plurality of outlets 42 (e.g., RJ-45 type outlets) into which a plurality of plugs 52 (e.g., RJ-45 type plugs) may be inserted.
The male-type connector 10 is illustrated in greater detail in
Turning to
The substrates 70, 72, 74, and 76 are substantially identical to one another. In the figures, the substrates 70, 72, 74, and 76 have each been illustrated as a printed circuit board. In such implementations, the substrates 70, 72, 74, and 76 may be characterized as being cable interface boards. Inside the male-type connector 10, the substrates 70 and 72 are spaced apart and substantially parallel to one another and inside the female-type connector 12, the substrates 74 and 76 are spaced apart and substantially parallel to one another. The substrates 70, 72, 74, and 76 each include a first side 80 opposite a second side 82. In the embodiment illustrated, inside the male-type connector 10, the second side 82 of the first substrate 70 is adjacent the first side 80 of the second substrate 72. Similarly, inside the female-type connector 12, the second side 82 of the first substrate 74 is adjacent the first side 80 of the second substrate 76.
Because the substrates 70, 72, 74, and 76 are substantially identical to one another, only the substrate 70 will be described in detail. However, those of ordinary skill in the art appreciate that the substrates 72, 74, and 76 each have substantially identical structures to those described with respect to the substrate 70.
The first layer 90 has a first surface 100 opposite a second surface 102 and the second layer 92 has a first surface 104 opposite a second surface 106. The second surface 102 of the first layer 90 is adjacent the insulating layer 94 and the first surface 104 of the second layer 92 is adjacent the insulating layer 94.
The substrate 70 includes an edge card male connector 120 along a first edge portion 122. As may be seen in
In the embodiment illustrated, the substrate 70 is configured to terminate three cables “C1,” “C2,” and “C3.” The cables “C1,” “C2,” and “C3” are substantially identical to one another. Therefore, only the cable “C1” will be described in detail. However, those of ordinary skill in the art appreciate that the cables “C2” and “C3” each include substantially identical structures to those described with respect to the cable “C1.”
Turning to
Returning to
Elements including or constructed from conductive material (e.g., traces, printed wires, lands, pads, planes, and the like) are categorized herein in two groups. The first group includes signal carrying conductive path elements (e.g., traces, printed wires, and the like), which may be connected to various ancillary conductive elements and are referred to collectively as “conductive elements.” Turning to
The second group includes specialized ground planes. Such specialized ground planes may be implemented as localized, electrically floating, isolated ground planes (“LEFIGPs”). The substrate 70 includes ground planes “GP-1,” “GP-2,” and “GP-3” for the circuits 151, 152, and 153, respectively. Each of the ground planes “GP-1,” “GP-2,” and “GP-3” illustrated is implemented as a LEFIGP. Each of the ground planes “GP-1,” GP-2,” and “GP-3” is disconnected from and electrically isolated from the others. However, each of the ground planes “GP-1,” GP-2,” and “GP-3” may be electrically connected to similar corresponding structures on adjacent mated substrates (not shown) and/or additional local shield elements such as those used to shroud outlets 500-1 to 500-3 (illustrated in
Each of the ground planes “GP-1,” “GP-2,” and “GP-3” is disconnected from the conductive elements (e.g., traces) of the circuits 151, 152, and 153. However, the ground planes “GP-1,” “GP-2,” and “GP-3” are positioned relative to the circuits 151, 152, and 153, respectively, to receive energy radiated outwardly from the conductive elements of the circuits 151, 152, and 153, respectively. For example, the ground planes “GP-1,” “GP-2,” and “GP-3” may be positioned in close proximity to the circuits 151, 152, and 153, respectively, to receive energy radiated outwardly from the conductive elements of the circuits 151, 152, and 153, respectively.
When elements including or constructed from conductive material (e.g., the conductive elements of a circuit or ground plane) are positioned on different layers, they may be interconnected by vertically oriented conductive elements, such as vertical interconnect accesses (“VIAs”) (e.g., a VIA “V-GP” and VIAs “V-1” to “V-8” depicted in
In a conventional communication connector (not shown), the wires of a cable are typically connected (e.g., soldered) to a circuit on the same side of the substrate. In contrast, returning to
The wires “W1” to “W8” of the cables “C1,” “C2,” and “C3” may be soldered to the circuits 151, 152 and 153, respectively. Alternatively, returning to
To help reduce crosstalk, on the first side 80 of the substrate 70, the insulation displacement connectors “IDC-4,” “IDC-5,” “IDC-1,” and “IDC-2” connected to the circuit 152 may be offset from those insulation displacement connectors “IDC-4,” “IDC-5,” “IDC-1,” and “IDC-2” connected to the circuits 151 and 153 relative to the edge card male connector 120. In other words, the insulation displacement connectors “IDC-4,” “IDC-5,” “IDC-1,” and “IDC-2” connected to the circuits 151, 152, and 153 are not aligned along the second edge portion 124 of the substrate 70. Further, on the second side 82 of the substrate 70, the insulation displacement connectors “IDC-7,” “IDC-8,” “IDC-6,” and “IDC-3” connected to the circuit 152 may be offset from those insulation displacement connectors “IDC-7,” “IDC-8,” “IDC-6,” and “IDC-3” of the circuits 151 and 153 relative to the edge card male connector 120. In other words, the insulation displacement connectors “IDC-7,” “IDC-8,” “IDC-6,” and “IDC-3” connected to the circuits 151, 152, and 153 are not aligned along the second edge portion 124 of the substrate 70.
In the embodiment illustrated, the insulation displacement connectors “IDC-4,” “IDC-5,” “IDC-1,” and “IDC-2” connected to the circuit 151 on the first side 80 of the substrate 70 are offset from the insulation displacement connectors “IDC-7,” “IDC-8,” “IDC-6,” and “IDC-3” connected to the circuit 151 on the second side 82 of the substrate 70. The insulation displacement connectors “IDC-4,” “IDC-5,” “IDC-1,” and “IDC-2” of the circuit 152 on the first side 80 of the substrate 70 are offset from the insulation displacement connectors “IDC-7,” “IDC-8,” “IDC-6,” and “IDC-3” of the circuit 152 on the second side 82 of the substrate 70. The insulation displacement connectors “IDC-4,” “IDC-5,” “IDC-1,” and “IDC-2” connected to the circuit 153 on the first side 80 of the substrate 70 are offset from the insulation displacement connectors “IDC-7,” “IDC-8,” “IDC-6,” and “IDC-3” connected to the circuit 153 on the second side 82 of the substrate 70.
As mentioned above, the substrate 70 includes the ground planes “GP-1,” “GP-2,” and “GP-3,” for the circuits 151, 152, and 153, respectively (see
It is often desirable to have the impedance-to-ground of one conductive element of a pair of conductive elements substantially equal to the impedance-to-ground of the other conductive element of the pair. This fosters a condition referred to as “balanced to ground,” which is known to be the best case condition for minimizing crosstalk between the pair of conductors and other surrounding conductors. The conductive material that makes up ground planes “GP-1,” GP-2,” and “GP-3” provide a localized common ground plane for the circuits 151, 152, and 153, respectively. While the overall impedance-to-ground of any conductive element is influenced by additional factors, (such as the length and thickness of the conductive element), the dimensional relationship between each of the paired conductive elements and the conductive components of the associated ground plane at any particular point along the length of the conductive element may be varied to control the impedance of that conductive element to the localized common ground at that particular point. By controlling this impedance along the length of a pair of conductive elements, the overall common mode impedance of the pair may be controlled. In addition, the differential mode impedance of a pair of conductive elements may also be controlled at any point along the length of the pair by varying these impedances; however, this impedance is also influenced significantly by the dimensional relationship between the two paired conductive elements.
By way of a non-limiting example, the traces “TC-1” and “TC-2,” and the ground plane “GP-2” will be used to explain the relationship between a pair of conductive elements, in this case the traces “TC-1” and “TC-2,” and their associated ground plane “GP-2.” However it is understood that the same general relationship applies to any of the other pairs of conductive elements in the circuits 151, 152, and 153 and their respective ground planes “GP-1,” GP-2,” and “GP-3.”
Two impedances that are important for properly matching a connector (e.g., the male-type connector 10 and the female-type connector 12, both illustrated in
In addition, a percentage “ZcmUNBAL,” which is a measure of the inequality of the two common mode impedances “Zg1” and “Zg2,” can be calculated using the following equation:
Thus, the impedance “ZCM” and the percentage “ZcmUNBAL” may each be determined as a function of the impedances “Zg1” and “Zg2.” The impedance “ZDM” may be determined as a function of impedances “Zd,” “Zg1,” and “Zg2.” Furthermore, each of these impedances may be considered at either one specific point along the length of the pair of traces “TC-1” and “TC-2,” or as an overall average impedance representative of the entire length of the traces.
Once a specific substrate is chosen for the first and second substrate layers 90 and 92, having a specific dielectric constant “e”, and thickness “T,” and a path thickness “t,” and lengths of the traces “TC-1” and “TC-2” are chosen, the overall average value of the impedance “Zd” between the traces “TC-1” and “TC-2,” may be determined primarily as a function of the average value of the widths “wd1” and “wd2” and the average value of the distance “d” along the length of the pair of traces. Furthermore, the overall average value of the impedance “Zg1” between the trace “TC-1” and ground may be determined primarily as a function of the average value of the width “wd1,” and the average value of the distance “d1” along the length trace “TC-1.” Likewise, the overall average value of the impedance “Zg2” between the trace “TC-2” and ground may be determined primarily as a function of the average value of the width “wd2” of the trace “TC-2” and the average value of the distance “d2” between the trace “TC-2” and the ground plane “GP-2” along the length of trace “TC-2.”
While the general relationship between the physical and electrical properties of individual segments of the conductive elements with specific dimensional relationships to other conductive elements, including conventional ground elements, are well understood by those of ordinary skill in the art, in the specific case of the complex circuits presented here, (which include traces having continuously varying physical relationships to other conductive elements, ground planes, and ancillary electrically conductive elements as defined previously herein) an electrical performance analysis of the circuits may be accomplished through a successive process of electro-magnetic field simulation, circuit fabrication, and testing. The electrical performance analyses may be used to determine final values of the various parameters (e.g., the substrate material, the thickness “T,” the width “wd1,” the width “wd2,” the distance “d,” the distance “d1,” the distance “d2,” an average conductive element length, the path thickness “t,” and the like) used to construct the conductive elements of the circuits 151, 152, and 153 and the ground planes “GP-1,” GP-2,” and “GP-3.”
Once the overall average values of the impedances “Zd,” “Zg1,” and “Zg2” are established, the overall average values for the differential mode impedance “ZDM,” the common mode impedance “ZCM,” and the percentage “ZcmUNBAL” may be calculated using the equations above. Such parameters may also be empirically determined using appropriate test methods.
It is desirable to design the aforementioned physical and electrical characteristics of the conductive elements, such as the traces “TC-1” and “TC-2,” and the substrate 70, such that the overall average values for the differential mode impedance “ZDM,” and the common mode impedance “ZCM” for the conductive elements equal the differential mode impedance and the common mode impedance, respectively, of a system (not shown) in which a connector (e.g., the male-type connector 10, the female-type connector 12, the multi-outlet module 44, all of
At the same time, it is also desirable to design the aforementioned physical and electrical characteristic of the conductive elements (e.g., the traces “TC-1” and “TC-2”) and the substrate 70, such that the overall average value of the impedance “Zg1,” and the overall average value of the impedance “Zg2” are approximately equal to minimize the percentage “ZcmUNBAL.”
Values for the conductive element widths “wd1” and “wd2” and the distances “d1” and “d2” may be adjusted at any point along the length of the conductive elements (e.g., the traces “TC-1” and “TC-2”) such that the overall average value of the common mode impedance “ZCM” of the conductive elements is substantially identical to the common mode impedance of a system (not shown) in which the substrate 70 (e.g., when incorporated into the male-type connector 10, the female-type connector 12, and the like) is intended to be utilized.
At the same time, the effect of each of these values on the overall value of the differential mode impedance “ZDM” may be considered. However, for differential mode impedance, the distance “d” also plays a significant role in determining the overall value of the common mode impedance “ZCM” of the traces “TC-1” and “TC-2.” Therefore, in the case of the differential mode impedance “ZDM,” the values of the widths “wd1” and “wd2” and the distances “d,” “d1,” and “d2” may be adjusted at any point along the length of the traces “TC-1” and “TC-2,” such that the overall value of the differential mode impedance “ZDM” of the pair of traces is substantially equal to the differential mode impedance of a system (not shown) in which the substrate 70 (e.g., when incorporated into the male-type connector 10, the female-type connector 12, and the like) is intended to be utilized.
The values of the widths “wd1” and “wd2” and the distances “d,” “d1,” and “d2” may be selected such that the overall value of the differential mode impedance “ZDM” for the traces “TC-1” and “TC-2,” (and optionally one or more other pairs of conductors positioned on the first substrate layer 90) is equal to the system impedance of a system (not shown) for which the substrate 70 (e.g., when incorporated into the male-type connector 10, the female-type connector 12, and the like) is intended to be utilized. At the same time, the effect of each of these values on the overall value of the common mode impedance “ZCM” may also be considered. This relationship is understood by those of ordinary skill in the art and will not be described in detail.
The values for the widths “wd1” and “wd2” and the distances “d,” “d1,” and “d2” may be adjusted at any point along the length of the conductive elements (e.g., the traces “TC-1” and “TC-2”) to adjust for anomalies in the differential mode impedance “ZDM” elsewhere along the conductive elements or related to other conductive elements associated therewith, such that the average overall value of the differential mode impedance “ZDM” for the pair of conductive elements equals the differential mode impedances of a system (not shown) in which the substrate 70 (e.g., when incorporated into the male-type connector 10, the female-type connector 12, and the like) is intended to be utilized.
In addition, the overall value of the common mode impedance unbalance percentage “ZcmUNBAL” for the conductive elements (such as the traces “TC-1” and “TC-2”) may be adjusted by modifying the average values of the impedance “Zg1,” which may be accomplished by adjusting the average values of distance “d1” and the width “wd1.” Likewise, the average values of the impedance “Zg2” may be modified by adjusting the average values of the distance “d2” and the width “wd2.”
The values of the distance “d1” and the width “wd1” may be adjusted at any point along the length of one of a pair of conductive elements (such as the trace “TC-1”) to adjust for anomalies in the impedance “Zg1” elsewhere along the conductive element such that overall average impedance “Zg1” remains substantially equal to the overall average impedance “Zg2.” Likewise, the values for distance “d2” and the width “wd2” may be adjusted at any point along the length of the other of the pair of conductive elements (such as the trace “TC-2”) to adjust for anomalies in the impedance “Zg2” elsewhere along the conductive element, such that overall impedance “Zg2” remains substantially equal to the overall average impedance “Zg1.”
While the relationship between the physical and electrical properties of individual segments of the conductive elements (such as traces and their associated ground elements), and the relationship between the physical and electrical properties of any of individual ancillary conductive elements associated with the traces to their associated ground elements, can be analyzed using conventional mathematical algorithms, in the case of the complex circuits presented here, (which include a series of interconnected traces and ancillary conductive elements all having continuously varying physical relationships with conductive elements of their associated ground plane), the electrical performance of the circuits is best analyzed through a successive process of electro-magnetic field simulation, circuit fabrication and testing.
In the embodiment illustrated, the ground planes “GP-1” to “GP-3” each include conductive material positioned on the four layers “GPL1” to “GPL4” interconnected by the VIAs “V-GP.” Referring to
Turning to
Turning again to
Turning again to
Referring to
In some embodiments (not shown), the cables “C1,” “C2,” and “C3” may be secured to either the first side 80 or the second side 82 of the substrate 70. In such embodiments, through-holes (not shown) may be formed in the substrate 70 to provide passageways for the wires “W-4,” “W-5,” “W-1,” and “W-2” from the second side 82 of the substrate 70 to the first side 80 of the substrate, or passageways for the wires “W-7,” “W-8,” “W-3,” and “W-6” from the first side 80 of the substrate 70 to the second side 82 of the substrate, whichever is applicable.
Turning to the circuit 151 having portions illustrated in each of
The wires “W-4” and “W-5” of the twisted-wire pair “P1” of the cable “C1” are connected to the VIAs “V-4” and “V-5,” respectively, of the circuit 151 (e.g., by the insulation displacement connectors “IDC-4” and “IDC-5,” respectively). On the top layer 141, the VIA “V-4” is connected to the contact “CT-W4” of the contacts 161T by a trace “TC-4.” Thus, the wire “W-4” of the cable “C1” is connected to the contact “CT-W4” of the contacts 161T. On the top layer 141, the VIA “V-5” is connected to the contact “CT-W5” of the contacts 161T by a trace “TC-5.” Thus, the wire “W-5” of the cable “C1” is connected to the contact “CT-W5” of the contacts 161T.
The wires “W-1” and “W-2” of the twisted-wire pair “P2” of the cable “C1” are connected to the VIAs “V-1” and “V-2,” respectively, of the circuit 151 (e.g., by the insulation displacement connectors “IDC-1” and “IDC-2,” respectively). On the top layer 141, the VIA “V-1” is connected to the contact “CT-W1” of the contacts 161T by a trace “TC-1.” Thus, the wire “W-1” of the cable “C1” is connected to the contact “CT-W1” of the contacts 161T. On the top layer 141, the VIA “V-2” is connected to the “CT-W2” of the contacts 161T by a trace “TC-2.” Thus, the wire “W-2” of the cable “C1” is connected to the contact “CT-W2” of the contacts 161T.
The wires “W-3” and “W-6” of the twisted-wire pair “P3” of the cable “C1” are connected to the VIAs “V-3” and “V-6,” respectively, of the circuit 151 (e.g., by the insulation displacement connectors “IDC-3” and “IDC-6,” respectively). On the bottom layer 144, the VIA “V-3” is connected to the contact “CT-W3” of the contacts 161B by a trace “TC-3.” Thus, the wire “W-3” of the cable “C1” is connected to the contact “CT-W3” of the contacts 161B. On the bottom layer 144, the VIA “V-6” is connected to the contact “CT-W6” of the contacts 161B by a trace “TC-6.” Thus, the wire “W-6” of the cable “C1” is connected to the contact “CT-W6” of the contacts 161B.
The wires “W-7” and “W-8” of the twisted-wire pair “P4” of the cable “C1” are connected to the VIAs “V-7” and “V-8,” respectively, of the circuit 151 (e.g., by the insulation displacement connectors “IDC-7” and “IDC-8,” respectively). On the bottom layer 144, the VIA “V-7” is connected to the contact “CT-W7” of the contacts 161B by a trace “TC-7.” Thus, the wire “W-7” of the cable “C1” is connected to the contact “CT-W7” of the contacts 161B. On the bottom layer 144, the VIA “V-8” is connected to the contact “CT-W8” of the contacts 161B by a trace “TC-8.” Thus, the wire “W-8” of the cable “C1” is connected to the contact “CT-W8” of the contacts 161B.
On the top layer 141, within the contacts 161T, the contact “CT-Gb” (which is connected to the first layer “GPL1” of the ground plane “GP-1”) is positioned between the contacts “CT-W4” and “CT-W5” connected to the twisted-wire pair “P1” and the contacts “CT-W1” and “CT-W2” connected to the twisted-wire pair “P2.” This may help improve isolation between the twisted-wire pair “P1” and the twisted-wire pair “P2” of the cable “C1.” This arrangement also positions the contacts “CT-W4” and “CT-W5” connected to the twisted-wire pair “P1” between the contacts “CT-Ga” and “CT-Gb” connected to the first layer “GPL1” of the ground plane “GP-1.” This arrangement further positions the contacts “CT-W1” and “CT-W2” connected to the twisted-wire pair “P2” between the contacts “CT-Gb” and “CT-Gc” connected to the first layer “GPL1” of the ground plane “GP-1.” Further, this arrangement may improve isolation between the circuits 151 and 152 by positioning the contact “CT-Gc” of the contacts 161T (connected to the first layer “GPL1” of the ground plane “GP-1”) and the contact “CT-Ga” of the contacts 162T (connected to the first layer “GPL1” of the ground plane “GP-2”) between the contacts “CT-W1” and “CT-W2” of the contacts 161T connected to the twisted-wire pair “P2” in the circuit 151 and the contacts “CT-W4” and “CT-W5” of the contacts 162T connected to the twisted-wire pair “P1” in the circuit 152.
Similarly, on the bottom layer 144, within the contacts 161B, the contact “CT-Ge” (which is connected to the fourth layer “GPL4” of the ground plane “GP-1”) is positioned between the contacts “CT-W3” and “CT-W6” connected to the twisted-wire pair “P3” and the contacts “CT-W7” and “CT-W8” connected to the twisted-wire pair “P4.” This may help improve isolation between the twisted-wire pair “P3” and the twisted-wire pair “P4.” This arrangement also positions the contacts “CT-W3” and “CT-W6” connected to the twisted-wire pair “P3” between the contacts “CT-Ge” and “CT-Gf” connected to the fourth layer “GPL4” of the ground plane “GP-1.” This arrangement further positions the contacts “CT-W7” and “CT-W8” connected to the twisted-wire pair “P4” between the contacts “CT-Gd”and “CT-Ge” connected to the fourth layer “GPL4” of the ground plane “GP-1.” Further, this arrangement may improve isolation between the circuits 151 and 152 by positioning the contact “CT-Gf” of the contacts 161B (connected to the fourth layer “GPL4” of the ground plane “GP-1”) and the contact “CT-Gd” of the contacts 162B (connected to the fourth layer “GPL4” of the ground plane “GP-2”) between the contacts “CT-W3” and “CT-W6” of the contacts 161B connected to the twisted-wire pair “P3” in the circuit 151 and the contacts “CT-W7” and “CT-W8” of the contacts 162B connected to the twisted-wire pair “P4” in the circuit 152.
To further improve isolation, on the top layer 141, the first layer “GPL1” of the ground plane “GP-1” has portions 171a and 171b positioned between the traces “TC-4” and “TC-5,” connected to the VIAs “V-4” and “V-5,” respectively, and the traces “TC-1” and “TC-2,” connected to the VIAs “V-1” and “V-2,” respectively. Similarly, on the bottom layer 144, the fourth layer “GPL4” of the ground plane “GP-1” has portion 171c positioned between the traces “TC-3” and “TC-6,” connected to the VIAs “V-3” and “V-6,” respectively, and the traces “TC-7” and “TC-8,” connected to the VIAs “V-7” and “V-8,” respectively.
To improve isolation between the circuit 151 and nearby circuits (e.g., the circuit 152), portions of the first layer “GPL1” of the ground plane “GP-1” substantially surround the first portion “C-T” of the circuit 151, portions of the second layer “GPL2” of the ground plane “GP-1” substantially surround the second portion “C-M” of the circuit 151, and portions of the fourth layer “GPL4” of the ground plane “GP-1” substantially surround the third portion “C-B” of the circuit 151.
Turning to the circuit 152 having portions illustrated in each of
The wires “W-4” and “W-5” of the twisted-wire pair “P1” of the cable “C2” are connected to the VIAs “V-4” and “V-5,” respectively, of the circuit 152 (e.g., by the insulation displacement connectors “IDC-4” and “IDC-5,” respectively). On the top layer 141, the VIA “V-4” is connected to the contact “CT-W4” of the contacts 162T by a trace “TC-4.” Thus, the wire “W-4” of the cable “C2” is connected to the contact “CT-W4” of the contacts 162T. On the top layer 141, the VIA “V-5” is connected to the contact “CT-W5” of the contacts 162T by a trace “TC-5.” Thus, the wire “W-5” of the cable “C2” is connected to the contact “CT-W5” of the contacts 162T.
The wires “W-1” and “W-2” of the twisted-wire pair “P2” of the cable “C2” are connected to the VIAs “V-1” and “V-2,” respectively, of the circuit 152 (e.g., by the insulation displacement connectors “IDC-1” and “IDC-2,” respectively). On the top layer 141, the VIA “V-1” is connected to the contact “CT-W1” of the contacts 162T by a trace “TC-1.” Thus, the wire “W-1” of the cable “C2” is connected to the contact “CT-W1” of the contacts 162T. On the top layer 141, the VIA “V-2” is connected to the “CT-W2” of the contacts 162T by a trace “TC-2.” Thus, the wire “W-2” of the cable “C2” is connected to the contact “CT-W2” of the contacts 162T.
The wires “W-3” and “W-6” of the twisted-wire pair “P3” of the cable “C2” are connected to the VIAs “V-3” and “V-6,” respectively, of the circuit 152 (e.g., by the insulation displacement connectors “IDC-3” and “IDC-6,” respectively). On the bottom layer 144, the VIA “V-3” is connected to the contact “CT-W3” of the contacts 162B by a trace “TC-3.” Thus, the wire “W-3” of the cable “C2” is connected to the contact “CT-W3” of the contacts 162B. On the bottom layer 144, the VIA “V-6” is connected to the contact “CT-W6” of the contacts 162B by a trace “TC-6.” Thus, the wire “W-6” of the cable “C2” is connected to the contact “CT-W6” of the contacts 162B.
The wires “W-7” and “W-8” of the twisted-wire pair “P4” of the cable “C2” are connected to the VIAs “V-7” and “V-8,” respectively, of the circuit 152 (e.g., by the insulation displacement connectors “IDC-7” and “IDC-8,” respectively). On the bottom layer 144, the VIA “V-7” is connected to the contact “CT-W7” of the contacts 162B by a trace “TC-7.” Thus, the wire “W-7” of the cable “C2” is connected to the contact “CT-W7” of the contacts 162B. On the bottom layer 144, the VIA “V-8” is connected to the contact “CT-W8” of the contacts 162B by a trace “TC-8.” Thus, the wire “W-8” of the cable “C2” is connected to the contact “CT-W8” of the contacts 162B.
On the top layer 141, within the contacts 162T, the contact “CT-Gb” (which is connected to the first layer “GPL1” of the ground plane “GP-2”) is positioned between the contacts “CT-W4” and “CT-W5” connected to the twisted-wire pair “P1” of the cable “C2” and the contacts “CT-W1” and “CT-W2” connected to the twisted-wire pair “P2” of the cable “C2.” This arrangement may help improve isolation between the twisted-wire pairs “P1” and “P2” of the cable “C2.” This arrangement also positions the contacts “CT-W4” and “CT-W5” connected to the twisted-wire pair “P1” of the cable “C2” between the contacts “CT-Ga” and “CT-Gb” connected to the first layer “GPL1” of the ground plane “GP-2.” This arrangement further positions the contacts “CT-W1” and “CT-W2” connected to the twisted-wire pair “P2” of the cable “C2” between the contacts “CT-Gb” and “CT-Gc” connected to the first layer “GPL1” of the ground plane “GP-2.” Further, may improve isolation between the circuits 151 and 152 by positioning the contact “CT-Gc” of the contacts 162T (connected to the first layer “GPL1” of the ground plane “GP-2”) and the contact “CT-Ga” of the contacts 163T (connected to the first layer “GPL1” of the ground plane “GP-3”) between the contacts “CT-W1” and “CT-W2” of the contacts 162T connected to the twisted-wire pair “P2” in the circuit 152 and the contacts “CT-W4” and “CT-W5” of the contacts 163T connected to the twisted-wire pair “P1” in the circuit 153.
Similarly, on the bottom layer 144, within the contacts 162B, the contact “CT-Ge” (which is connected to the fourth layer “GPL4” of the ground plane “GP-2”) is positioned between the contacts “CT-W3” and “CT-W6” connected to the twisted-wire pair “P3” of the cable “C2” and the contacts “CT-W7” and “CT-W8” connected to the twisted-wire pair “P4” of the cable “C2.” This arrangement may help improve isolation between the twisted-wire pair “P3” and the twisted-wire pair “P4.” This arrangement also positions the contacts “CT-W3” and “CT-W6” connected to the twisted-wire pair “P3” of the cable “C2” between the contacts “CT-Ge” and “CT-Gf” connected to the fourth layer “GPL4” of the ground plane “GP-2.” This arrangement further positions the contacts “CT-W7” and “CT-W8” connected to the twisted-wire pair “P4” of the cable “C2” between the contacts “CT-Gd” and “CT-Ge” connected to the fourth layer “GPL4” of the ground plane “GP-2.” Further, this arrangement positions the contact “CT-Gf” of the contacts 162B (connected to the fourth layer “GPL4” of the ground plane “GP-2”) and the contact “CT-Gd” of the contacts 163B (connected to the fourth layer “GPL4” of the ground plane “GP-3”) between the contacts “CT-W3” and “CT-W6” of the contacts 162B connected to the twisted-wire pair “P3” of the circuit 152 and the contacts “CT-W7” and “CT-W8” of the contacts 163B connected to the twisted-wire pair “P4” of the circuit 153.
To further improve isolation, on the top layer 141, the first layer “GPL1” of the ground plane “GP-2” has the portion 172a positioned between the traces “TC-4” and “TC-5,” connected to the VIAs “V-4” and “V-5,” respectively, and the traces “TC-1” and “TC-2,” connected to the VIAs “V-1” and “V-2,” respectively. Similarly, on the bottom layer 144, the fourth layer “GPL4” of the ground plane “GP-2” has portions 172b and 172c positioned between the traces “TC-3” and “TC-6,” connected to the VIAs “V-3” and “V-6,” respectively, and the traces “TC-7” and “TC-8,” connected to the VIAs “V-7” and “V-8,” respectively.
To improve isolation between the circuit 152 and nearby circuits (e.g., the circuits 151 and 153), portions of the first layer “GPL1” of the ground plane “GP-2” substantially surround the first portion “C-T” of the circuit 152, portions of the second layer “GPL2” of the ground plane “GP-2” substantially surround the second portion “C-M” of the circuit 152, and portions of the fourth layer “GPL4” of the ground plane “GP-2” substantially surround the third portion “C-B” of the circuit 152.
Turning to the circuit 153 having portions illustrated in each of
The wires “W-4” and “W-5” of the twisted-wire pair “P1” of the cable “C3” are connected to the VIAs “V-4” and “V-5,” respectively, of the circuit 153 (e.g., by the insulation displacement connectors “IDC-4” and “IDC-5,” respectively). On the top layer 141, the VIA “V-4” is connected to the contact “CT-W4” of the contacts 163T by a trace “TC-4.” Thus, the wire “W-4” of the cable “C3” is connected to the contact “CT-W4” of the contacts 163T. On the top layer 141, the VIA “V-5” is connected to the contact “CT-W5” of the contacts 163T by a trace “TC-5.” Thus, the wire “W-5” of the cable “C3” is connected to the contact “CT-W5” of the contacts 163T.
The wires “W-1” and “W-2” of the twisted-wire pair “P2” of the cable “C3” are connected to the VIAs “V-1” and “V-2,” respectively, of the circuit 153 (e.g., by the insulation displacement connectors “IDC-1” and “IDC-2,” respectively). On the top layer 141, the VIA “V-1” is connected to the contact “CT-W1” of the contacts 163T by a trace “TC-1.” Thus, the wire “W-1” of the cable “C3” is connected to the contact “CT-W1” of the contacts 163T. On the top layer 141, the VIA “V-2” is connected to the “CT-W2” of the contacts 163T by a trace “TC-2.” Thus, the wire “W-2” of the cable “C3” is connected to the contact “CT-W2” of the contacts 163T.
The wires “W-3” and “W-6” of the twisted-wire pair “P3” of the cable “C3” are connected to the VIAs “V-3” and “V-6,” respectively, of the circuit 153 (e.g., by the insulation displacement connectors “IDC-3” and “IDC-6,” respectively). On the bottom layer 144, the VIA “V-3” is connected to the contact “CT-W3” of the contacts 163B by a trace “TC-3.” Thus, the wire “W-3” of the cable “C3” is connected to the contact “CT-W3” of the contacts 163B. On the bottom layer 144, the VIA “V-6” is connected to the contact “CT-W6” of the contacts 163B by a trace “TC-6.” Thus, the wire “W-6” of the cable “C3” is connected to the contact “CT-W6” of the contacts 163B.
The wires “W-7” and “W-8” of the twisted-wire pair “P4” of the cable “C3” are connected to the VIAs “V-7” and “V-8,” respectively, of the circuit 153 (e.g., by the insulation displacement connectors “IDC-7” and “IDC-8,” respectively). On the bottom layer 144, the VIA “V-7” is connected to the contact “CT-W7” of the contacts 163B by a trace “TC-7.” Thus, the wire “W-7” of the cable “C3” is connected to the contact “CT-W7” of the contacts 163B. On the bottom layer 144, the VIA “V-8” is connected to the contact “CT-W8” of the contacts 163B by a trace “TC-8.” Thus, the wire “W-8” of the cable “C3” is connected to the contact “CT-W8” of the contacts 163B.
On the top layer 141, within the contacts 163T, the contact “CT-Gb” (which is connected to the first layer “GPL1” of the ground plane “GP-3”) is positioned between the contacts “CT-W4” and “CT-W5” connected to the twisted-wire pair “P1” of the cable “C3” and the contacts “CT-W1” and “CT-W2” connected to the twisted-wire pair “P2” of the cable “C3.” This arrangement may help improve isolation between the twisted-wire pairs “P1” and “P2” of the cable “C3.” This arrangement also positions the contacts “CT-W4” and “CT-W5” connected to the twisted-wire pair “P1” of the cable “C3” between the contacts “CT-Ga” and “CT-Gb” connected to the first layer “GPL1” of the ground plane “GP-3.” This arrangement further positions the contacts “CT-W1” and “CT-W2” connected to the twisted-wire pair “P2” of the cable “C3” between the contacts “CT-Gb” and “CT-Gc” connected to the first layer “GPL1” of the ground plane “GP-3.”
Similarly, on the bottom layer 144, within the contacts 163B, the contact “CT-Ge” (which is connected to the fourth layer “GPL4” of the ground plane “GP-3”) is positioned between the contacts “CT-W3” and “CT-W6” connected to the twisted-wire pair “P3” of the cable “C3” and the contacts “CT-W7” and “CT-W8” connected to the twisted-wire pair “P4” of the cable “C3.” This arrangement may help improve isolation between the twisted-wire pair “P3” and the twisted-wire pair “P4” of the cable “C3.” This arrangement also positions the contacts “CT-W3” and “CT-W6” connected to the twisted-wire pair “P3” of the cable “C3” between the contacts “CT-Ge” and “CT-Gf” connected to the fourth layer “GPL4” of the ground plane “GP-3.” This arrangement further positions the contacts “CT-W7” and “CT-W8” connected to the twisted-wire pair “P4” of the cable “C3” between the contacts “CT-Gd” and “CT-Ge” connected to the fourth layer “GPL4” of the ground plane “GP-3.”
To further improve isolation, on the top layer 141, the first layer “GPL1” of the ground plane “GP-3” has portions 173a and 173b positioned between the traces “TC-4” and “TC-5,” connected to the VIAs “V-4” and “V-5,” respectively, and the traces “TC-1” and “TC-2,” connected to the VIAs “V-1” and “V-2,” respectively. Similarly, on the bottom layer 144, the fourth layer “GPL4” of the ground plane “GP-3” has portion 173c positioned between the traces “TC-3” and “TC-6,” connected to the VIAs “V-3” and “V-6,” respectively, and the traces “TC-7” and “TC-8,” connected to the VIAs “V-7” and “V-8,” respectively.
To improve isolation between the circuit 153 and nearby circuits (e.g., the circuit 152), portions of the first layer “GPL1” of the ground plane “GP-3” substantially surround the first portion “C-T” of the circuit 153, portions of the second layer “GPL2” of the ground plane “GP-3” substantially surround the second portion “C-M” of the circuit 153, and portions of the fourth layer “GPL4” of the ground plane “GP-3” substantially surround the third portion “C-B” of the circuit 153.
The male-type connector 10 includes an edge card female connector 180 attached to the edge card male connector 120 of the substrate 70 and an edge card female connector 182 attached to the edge card male connector 120 of the substrate 72. The edge card female connectors 180 and 182 attached to the substrates 70 and 72, respectively, are configured to receive the edge card male connectors 120 of the substrates 74 and 76, respectively, of the female-type connector 12. The edge card female connectors 180 and 182 each include a first plurality of contacts 188T (see
In the embodiment illustrated, the second edge portion 124 of the substrate 70 includes a first through-hole 190 and a second through-hole 192 spaced apart therefrom for each of the circuit 151, 152, and 153. Each of the through-holes 190 and 192 is spaced apart from the VIAs “V-1” to “V-8” of the corresponding circuits 151, 152, and 153. Each of the pairs of the first and second through-holes 190 and 192 is configured to permit a conventional cable tie 194 (see
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Because the cable attachment assemblies 200, 202, 204, and 206 are substantially identical to one another, only the cable attachment assembly 200 will be described in detail. However, those of ordinary skill in the art appreciate that the cable attachment assemblies 202, 204, and 206 each include structures substantially identical to those of the cable attachment assembly 200.
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The first cable securing member 214 includes apertures 296, 297, 298, and 299.
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The second cable securing member 216 includes tabs 316, 317, 318, and 319. The apertures 296, 297, 298, and 299 of the first cable securing member 214 are configured to receive the tabs 316, 317, 318, and 319, respectively, and form a snap-fit connection therewith. When connected together, the outwardly opening cable channels 287, 288, and 289 of the first cable securing member 214 are aligned with the outwardly opening cable channels 301, 302, and 303 of the second cable securing member 216 to form cable passageways (not shown) through which the cables “C1,” “C2,” and “C3,” respectively, may pass to enter the cable attachment assembly 200. These cable passageways are terminated by the dividers “D1,” “D2,” and “D3” of the first cable securing member 214 and the intermediate member 218.
Further, when the first and second cable securing members 214 and 216 are connected together, the first and second transverse sidewalls 290 and 292 of the first cable securing member 214 are aligned with the first and second transverse sidewalls 310 and 312, respectively, of the second cable securing members 216 to align the discontinuous transverse channel 293 with the discontinuous transverse channel 313.
Annular members 321, 322, and 323 (shown in
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A different one of the cable ties 194 extends around the tie support 282 of the first cable securing member 214 and the twisted-wire pairs “P1” and “P2” of the cable “C2,” passes through the through-holes 190 and 192 formed in the substrate 70 flanking the circuit 152 connected to the cable “C2,” and extends around the tie support 342 of the intermediate member 218 and the twisted-wire pairs “P3” and “P4” of the cable “C2” to tie all of these components together securely. If the tie support 282 includes the stop portion 186, the cable tie 194 is positioned between the divider “D2” and the stop portion 186. If the tie support 342 includes the stop portion 346, the cable tie 194 is positioned between the divider “D5” and the stop portion 346.
A different one of the cable ties 194 extends around the tie support 283 of the first cable securing member 214 and the twisted-wire pairs “P1” and “P2” of the cable “C3,” passes through the through-holes 190 and 192 formed in the substrate 70 flanking the circuit 153 connected to the cable “C3,” and extends around the tie support 343 of the intermediate member 218 and the twisted-wire pairs “P3” and “P4” of the cable “C3” to tie all of these components together securely. If the tie support 283 includes the stop portion 186, the cable tie 194 is positioned between the divider “D3” and the stop portion 186. If the tie support 343 includes the stop portion 346, the cable tie 194 is positioned between the divider “D6” and the stop portion 346.
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The housing 60 has a substantially hollow interior 376 defined by at least one outer sidewall 378. Inwardly extending support members 380, 381, 382, and 383 may be positioned on the sidewall 378 to extend into the interior 376. The substrate 70 and/or the cable attachment assembly 200 may be supported by the support members 380 and 381 and the substrate 72 and/or the cable attachment assembly 202 may be supported by the support members 382 and 383.
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The housing 60 has a substantially hollow interior 396 defined by at least one outer sidewall 398. Inwardly extending support members 400, 401, 402, and 403 may be positioned on the sidewall 398 to extend into the interior 396. The substrate 74 and/or the cable attachment assembly 204 may be supported by the support members 400 and 401 and the substrate 76 and/or the cable attachment assembly 206 may be supported by the support members 402 and 403.
The male and female-type connectors 10 and 12 may be configured for use in high-speed data communication applications and structured cabling systems. The male-type connector 10 may be configured as 100 ohm balanced multi-cable termination connectors that provide high levels of isolation between the circuits 151, 152, and 153 of the substrates 70 and 72. Similarly, the female-type connector 12 may be configured as 100 ohm balanced multi-cable termination connectors that provide high levels of isolation between the circuits 151, 152, and 153 of the substrates 74 and 76. The male and/or female-type connectors 10 and 12 may be configured to interconnect several Augmented Category 6A circuits simultaneously. In particular, implementations of the male and/or female-type connectors 10 and 12 provide the high degree of isolation needed for Augmented Category 6 connectivity. Further, the male and female-type connectors 10 and 12 may be sized and shaped for incorporation into an ultra high density patch panel system (e.g., a patch panel having 48 ports in a single rack unit (“RU”)).
Six cables 130 may be terminated at the substrates 70 and 72 of the male-type connector 10. The cables 130 may be installed with the substrates 70 and 72 in place. Similarly, six cables 130 may be terminated at the substrates 74 and 76 of the female-type connector 12. The cables 130 may be installed with the substrates 74 and 76 in place.
Isolation between the circuits 151, 152, and 153 on each of the substrates 70, 72, 74, and 76 is accomplished through the strategic positioning of components on the substrate and the positioning of the layers “GPL1” to “GPL4” of the ground planes “GP-1” to “GP-3” on the four layers 141-144, respectively, of the substrates 70, 72, 74, and 76 to improve isolation.
Time and cost savings may be realized by reduced installation time required to connect the male and female-type connectors 10 and 12 to one another.
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In the embodiment illustrated, the plurality of outlets 42 includes an outlet for each of the circuits 151, 152, and 153 (see
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The outlets 500-1, 500-2, and 500-3 and the first substrate 510 form a first electrical subassembly 514 and the outlets 502-1, 502-2, and 502-3 and the second substrate 512 form a second electrical subassembly 516. The first and second electrical subassemblies are substantially identical to one another. Therefore, only the first electrical subassembly 514 will be described in detail. However, those of ordinary skill in the art appreciate that the second electrical subassembly 516 includes substantially identical structures to those described with respect to the first electrical subassembly 514.
Like the substrate 70, the substrate 510 has a first side 580 (see
The first substrate 510 includes circuits 221, 222, and 223 substantially identical to the circuits 151, 152, and 153 positioned on the substrate 70. However, instead of conducting signals between the cables “C1,” “C2,” and “C3” and the edge card male connector 120, the circuits 221, 222, and 223 on the first substrate 510 conduct signals between the outlets 500-1, 500-2, and 500-3 and an edge card male connector 520. The edge card male connector 520 is substantially identical to the edge card male connector 120 and is therefore receivable inside the edge card female connector 180 of the male-type connector 10.
The substrate 510 also includes ground planes (not shown) for the circuits 221, 222, and 223 that are substantially similar to the ground planes “GP-1,” “GP-2,” and “GP-3” of the substrate 70.
As explained above, the edge card male connector 120 of the substrate 70 includes seven contacts 161T, 162T, and 163T on the first side 80 of the substrate for each of the circuits 151, 152, and 153, respectively, and seven contacts 161B, 162B, and 163B on the second side 82 of the substrate for each of the circuits 151, 152, and 153, respectively. For each of the circuits 151, 152, and 153, on the first side 80 of the substrate 70, each of the sets of seven contacts 161T, 162T, and 163T includes three contacts (e.g., the contacts “CT-Ga,” “CT-Gb,” and “CT-Gc”) connected one of the ground planes “GP-1,” “GP-2,” and “GP-3,” and four contacts (i.e., the contacts “CT-W4,” “CT-W5,” “CT-W1,” and “CT-W2”) for the wires “W-4,” “W-5,” “W-1,” and “W-2,” respectively, of one of the cables “C1,” “C2,” and “C3.” For each of the circuits 151, 152, and 153, on the second side 82 of the substrate 70, each of the sets of seven contacts 161B, 162B, and 163B includes three contacts (e.g., the contacts “CT-Gd,” “CT-Ge,” and “CT-Gf”) connected one of the ground planes “GP-1,” “GP-2,” and “GP-3,” and four contacts (i.e., the contacts “CT-W7,” “CT-W8,” “CT-W6,” and “CT-W3”) for the wires “W-7,” “W-8,” “W-6,” and “W-2,” respectively, of one of the cables “C1,” “C2,” and “C3.”
Similarly, the edge card male connector 520 includes seven contacts 561T, 562T, and 563T on the first side 580 of the substrate 510 for each of the circuits 221, 222, and 223, and seven contacts 561B, 562B, and 563B on the second side 582 of the substrate 510 for each of the circuits 221, 222, and 223. For each of the circuits 221, 222, and 223, on the first side 580 of the substrate 510, the seven contacts 561T, 562T, and 563T each include three contacts connected one of the ground planes (not shown) substantially similar to the ground planes “GP-1,” “GP-2,” and “GP-3,” and four contacts for the outlet contacts “JT-4,” “JT-5,” “JT-1,” and “JT-2” of one of the outlets 500-1, 500-2, and 500-3. For each of the circuits 221, 222, and 223, on the second side 582 of the substrate 510, the seven contacts 561B, 562B, and 563B each include three contacts connected one of the ground planes (not shown) substantially similar to the ground planes “GP-1,” “GP-2,” and “GP-3,” and four contacts for the outlet contacts “JT-7,” “JT-8,” “JT-6,” and “JT-2” of one of the outlets 500-1, 500-2, and 500-3.
When the male-type connector 10 is connected to the multi-outlet module 44, the edge card female connector 180 connected to the edge card male connector 120 of the substrate 70 electrically connects with the edge card male connector 520 of the multi-outlet module 44. When so connected, the contacts of the edge card male connector 520 and the contacts of the edge card male connector 120 are connected together in accordance with Table A below.
As is apparent from Table A above, the ground planes “GP-1,” “GP-2,” and “GP-3,” of the male-type connector 10 are connected to the ground planes of the multi-outlet module 44 across the connection formed by the male-type connector 10 and the multi-outlet module 44. This is true for the connection between the substrate 70 and the substrate 510 as well as for the connection between the substrate 72 and the substrate 512. Similarly, the ground planes “GP-1,” “GP-2,” and “GP-3,” of the male-type connector 10 are connected to the ground planes “GP-1,” “GP-2,” and “GP-3,” of the female-type connector 12 across the connection formed by the male-type connector 10 and the female-type connector 12. This is true for the connection between the substrate 70 and the substrate 74 as well as for the connection between the substrate 72 and the substrate 76.
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The housing 490 includes one or more tabs 486 configured to removably secure the multi-outlet module 44 to the patch panel 30 (see
The multi-outlet module 44 may be configured such that when six like modules are used to construct the patch panel 30, the patch panel includes forty-eight outlets (e.g., RJ-45 type outlets) in a single rack unit. Each of the outlets 42 may be configured for use with Augmented Category 6 cabling, and the like.
Once installed in the male-type connector 10, the cables 130 may be easily terminated to the multi-outlet module 44. For example, six cables containing eight contacts each (48 connections in total) can be terminated in one simple motion (i.e., pushing the male-type connector 10 and the multi-outlet module 44 together). Time and cost savings may be realized by reduced installation time required to connect the male-type connector 10 and the multi-outlet module 44 together. Further, the male-type connector 10, the female-type connector 12, and/or the multi-outlet module 44 may be used in ultra high density systems.
The foregoing described embodiments depict different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely exemplary, and that in fact many other architectures can be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality.
While particular embodiments of the present invention have been shown and described, it will be obvious to those skilled in the art that, based upon the teachings herein, changes and modifications may be made without departing from this invention and its broader aspects and, therefore, the appended claims are to encompass within their scope all such changes and modifications as are within the true spirit and scope of this invention. Furthermore, it is to be understood that the invention is solely defined by the appended claims. It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to inventions containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations).
Accordingly, the invention is not limited except as by the appended claims.
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