This invention relates to energy conditioning.
Objects of this invention are to provide energy conditioning, energy conditioning structures, and connectors and devices that incorporate energy conditioners.
The invention provides electrical energy conditioners particularly useful for power applications. Internal structure of the energy conditioners may be included as components of connectors or electrical devices. Electrical devices are devices that include an electrical load.
In all embodiments, internal structure of the conditioner includes a common conductor (G conductor), and some of the common conductor (G conductor) exists between surfaces of portions of two other conductors (A and B conductors), providing an overlapped structure. In all embodiments, the G conductor is electrically insulated from the A and B conductors both when the conditioner is connected in a circuit and when the conditioner is not connected in a circuit. In all embodiments, the A and B conductors are electrically isolated from one another when the conditioner is not connected in a circuit. In all embodiments, the A, B, and G conductors are spatially separated from one another in the overlapped region so that there is no conductive connection between any of them in the overlapped region.
Preferably, the parts of the G, A and B conductors form a layered structural portion (or layered portion) and part of the G conductor forming part of the layered portion exists between the portions of the A and B conductors forming part of the layered portion. That is, the overlapped portion is formed by layered portions of the A, B, and G conductors.
In all embodiments, there are at least two G conductor tabs of the G conductor extending from the overlapped portion or layered portion of the A, B, and G conductors.
In preferred embodiments, the internal structure of the conditioner and either or both of a connector structure and an electrical load are substantially enclosed in a enclosing conductive structure. In these embodiments, the G conductor is coupled, either conductively or primarily substantially capacitively, to the enclosing conductive structure. For these structure, preferably there is at least one conductive path between two tabs of the G conductor that is outside of the overlapped structure. For these structure, preferably, there is a conductive path connecting two tabs of the G conductor that extends between conductive pathways connected to the A and B conductors. For these structure, preferably, there is a conductive path connecting the two tabs of the G conductor that extends between conductive pathways connected to the A and B conductors on one side of the overlapped region, and there is another conductive path between two tabs of the G conductor that extends between conductive pathways connected to the A and B conductors on the other side of the overlapped region. For these structure, preferably, there a conductive pathway connecting two tabs of the G conductor that extends around a conductive path connected to the A conductor, and a conductive pathway connecting to two tabs of the G conductor that extends around a conductive path connected to the B conductor. For these structure, preferably, there a conductive pathway connecting two tabs of the G conductor that extends around a conductive path connected to the A conductor on one side of the overlapped structure, and a conductive pathway connecting to two tabs of the G conductor that extends around a conductive path connected to the B conductor on the same side of the overlapped structure, a conductive pathway connecting two tabs of the G conductor that extends around a conductive path connected to the A conductor on an opposite side of the overlapped structure, and a conductive pathway connecting to two tabs of the G conductor that extends around a conductive path connected to the B conductor on the opposite side of the overlapped structure.
As just noted, preferably, there exists a conductive path connecting the two tabs of the G conductor to one another which does not encircle any conductive path connected to either the A or B conductor. Preferably, this path connecting the two tabs of the G conductor to one another is very close to the outer surface of the overlapped or layered structure. Specifically, that path preferably projects not more than 10 millimeters, preferably not more than 5 millimeters, and preferably not more than about 1 millimeter from an outer major surface of conductive layers of the layered structure. Preferably, the cross sectional area defined by the cross section of the ground strap and the G conductor is less than 30 square millimeters, preferably less than 20 square millimeters, preferably less than 10 square millimeters, and more preferably less than 5 square millimeters.
Preferably, the ground strap is also wide and flat. Preferably, the ground strap is at least 0.5, at least 1.0, at least 2, or at least 5 millimeters wide (as defined by the direction parallel to major surfaces of the overlapped or layered structure and perpendicular to the direction between the G conductor tabs). Preferably, the ground strap is at least 5, at least 10, at least 20, at least 50, or at least 80 percent as wide as the overlapped or layered structure (as defined by the direction parallel to major surfaces of the overlapped or layered structure and perpendicular to the direction between the G conductor tabs, or a direction of a line segment connecting an a tab of an A conductor to a tab of a B conductor).
Many embodiments include additional geometric relationships between portions of the A, B, and G conductors, such as shape and extent of layer overlap of layered portions of the A, B, and G conductors, width of portions of the conductive structures that extend beyond the overlap region, and shapes of the overlapped regions of the three conductive structures. The portions of the conductive structures that extend beyond the overlap region are generally referred to herein as tabs or tab regions. The tabs or tab regions project out of dielectric enclosing other surface of the overlapped region or layered structure of the A, B, and G conductors.
Preferably, either the G conductor or structure designed to connect to the G conductor, is designed to connect to a ground line.
Preferably, the A, B, and G conductors are designed so that the A and B conductors can be electrically connected to lines from a source of electric power. Alternatively, the A, B, G structures are designed so that the A and B conductors can each be electrically connected to data or control lines.
Various embodiments include various one of the following important features.
Preferably, tabs of the G conductor extend in a different direction or different directions than the direction in which tabs of the A and B conductors extend. Preferably, a G tab direction is different from each of an A tab direction and a B tab direction by at least forty five degrees.
Preferably, no two tabs of the A, B, and G conductors are vertically aligned with one another, that is, aligned along a direction perpendicular to the layered region formed by overlap of the A, B, and G conductors.
Preferably, the portions of the A, B, and G conductor tabs that are not coated or potted with dielectric are sufficiently spaced apart to prevent dielectric breakdown, or flash-over, in air. Thus, at 120 volts and 60 cycles, portions of the A or B tabs not coated or covered by dielectric are preferably spaced from portions of other tabs not coated with dielectric by at least 1, 2, 3, 5, or 7 millimeters. The nominal European voltage standard is now 230 volts and 50 Hz, for which uncoated portions of the A or B tabs should be spaced from one another at least 1, 2, 3, 5, 7 or 10 millimeters.
Preferably, the tabs of the A, B, and G conductors are not circular in cross section. Instead they are relatively wide and flat. For example, each tab may have a width to height of cross section of greater than 2, 4, 6, 8, 10, 20, or 30. Here, height refers to the direction passing through the overlapped regions of the A, B, and G electrodes, which in layered structural embodiments, is the distance from the bottom surface to the top surface in the embodiments having a layered structure.
Preferably, at least one G tab projects out of the layered structure in a direction perpendicular to the direction at which a tab of the A or B conductor projects out of the layered structure.
Preferably, all tabs of the A, B, and G conductors project out of the layered structure in different directions.
Preferably, dielectric covers the top and bottom conductive surfaces of the layered structure. Preferably, the overlapped or layered structure is “potted”. That is, it is entirely coated with dielectric material, except for parts of the tab portions.
Preferably, the initial portions of the tab portions where they project out of the overlapped region or layered structure are also coated with dielectric, or potted. Preferably, this dielectric coating covers each tab portion for a distance beyond the overlapped or layered structure of at least 0.01 millimeter, at least 0.1 millimeter, at least 1 millimeter, at least 2 millimeters, or at least 5 millimeters. As the normal intended voltage of an application increases, the distance along with the dielectric should cover the tab regions near the overlapped or layered structure increases. For implementations intended for 120 volt 60 cycle operation, this length should be at least 1 millimeter, and more preferably at least 2 millimeters. For implementations intended for 230 volts and 50 Hz, this length should be at least 1 millimeter, and more preferably at least 2 millimeters, and more preferably at least 3 mm. For digital signal and control line implementations for under 25 volts, preferably, this dielectric coating covers each tab portion for a distance beyond the overlapped region of at least 0.01 millimeter, at least 0.1 millimeter. Typical potting materials have a volume resistivity of greater than about ten to the tenth power ohm centimeters at room temperature.
Preferably, the ratio of length a tab projects out of the layered structures to the height of the layered structure is greater than a certain ratio. Preferably, one or more of the tabs of the A, B, and G conductors project out from side of the layered structure at least 1, 2, 5, 10, or 20 times the height of the conductive layer of the same conductor.
Preferably, the ratio of length a tab projects out of the layered structures to the height of the layered structure is greater than a certain ratio. Preferably, one or more of the tabs of the A, B, and G conductors project out from side of the layered structure by at least one tenth, one eighth, one fourth, one half, 1, 2, 4, 5, 6 or 10 times the height of the layered structure. The height of the layered in this context means the distance between the outside surfaces of the A and B conductors.
At least two of the tabs of the A, B, and G conductors project out of the layered structure at different heights from one another. Preferably, the A, B, and G electrodes all project out of the layered structure at different heights from one another.
The existence of dielectric covering or coating the side surfaces of the overlapped region or layered structure is important. Preferably, the only side surfaces of the A, B, and G conductors that are not enclosed in dielectric are those surfaces forming the tabs that project out of the layered structure. Preferably, the top and bottom surfaces of the overlapped or layered structure are covered or coated with dielectric.
Various ones of the structural features of the layered structure and the tabs projecting out of the layered structure mentioned above help to prevent “flash over” when, for example, 60 cycles AC 120 volt or 50 AC 230 volts is applied across the A and B conductors. In this context, “flash over” means dielectric breakdown through air between various ones of the A, B, and G terminals, such that current flows for example from the A electrode, through air, to the B electrode. “Flash over” connotes the light flash often caused by plasma generation or sparking in air associated with this type of dielectric breakdown.
In preferred connector embodiments, the G conductor is conductively connected to a ground pin of the connector. In preferred device embodiments including a load, the G conductor is conductively connected to a ground pin of the connector.
In less preferred embodiments, the internal structure of the conditioner may reside on a back side of a connector, adjacent but outside of an enclosing conductive structure enclosing the male or female pins of the connector, and the G conductor is either substantially capacitively coupled or conductively connected to the conductive structure enclosing the male or female pins of the connector. Similarly, in less preferred embodiments, internal structure of the conditioner may reside on the outside of an enclosing conductive structure that encloses a load, and the internal structure of the conditioner may be substantially capacitively coupled or conductively connected to the enclosing conductive structure.
For bypass configurations, there exists at least one tab for each of the A and B conductors, and preferably only one tab for each of the A and B conductors. For feed through configurations, there exists at least two tabs for each one of the A and B conductors. For feed through configurations, preferably there exists exactly two tabs for each one of the A and B conductors. For bypass configuration, preferably, there exists exactly one A tab and only one B tab. For both configurations, preferably, there exists exactly two G conductor tabs.
Method of making electrical energy conditioners preferably includes assembly of component parts including planar dielectric elements preferably pre-coated with a conductive layer, conductive electrode elements, and a housing. These methods may include metallizing a surface of a dielectric wafer (such by wet or dry deposition of a metal layer) so that a metal component may subsequently be uniformly mechanically bonded to the metallization, and thereby structurally and uniformly bonded to the surface of the dielectric wafer. However, we also contemplate fabrication at least partially by layering processes in which the conductive layers and various tab structures and spatial layer overlap relationships disclosed herein are achieved by layering and patterning, as opposed to mechanical assembly.
Electrical devices of the invention include internal structure of the conditioner and a load substantially enclosed in a conductive enclosure. The G conductor may be either capacitively or conductively coupled to the conductive enclosure.
Preferably, the electrical conductivity of the portion of the G conductor in the overlapped region is relatively high. For example, the G conductor preferably is formed including a metal extending across the overlapped region that is formed substantially from an elemental metal, like copper, silver, gold, nickel, palladium, etc., to provide a very high conductivity (very low resistivity), less preferably substantially includes a section in the overlapped region spanned by an alloy (including solder), and less preferably includes a section in the overlapped region formed from a conductive paste.
Where applicable, the same numeral refers in the figures to similar or the same component.
Internal structure 1 includes an A conductor, a B conductor, a G conductor, electrically insulating (dielectric) slab 13, and dielectric slab 14. Opposing planar portions of the A and B conductors are separated from one another by a planar portion of the G conductor. Dielectric slabs 13, 14 are disposed between the opposing planar portions of the A, B, and G conductors.
Internal structure 1 resides inside of housings of any of connectors 2-10. Preferably, internal structure 1 resides inside of a conductive housing of any of connectors 2-10. In any case, the A and B conductors of internal structure 1 are electrically connected to corresponding non-ground male or female pins of any of connectors 2-10. Pins of connectors 5, 9, and 10 are labeled A, B, and G, respectively to show the correspondence of the pins to their conductive connections to the A, B, and G conductors. The G electrode of internal structure 1 is either capacitively or conductively connected to a ground pin as shown for connector 10 or capacitively or conductively connected to a conductive housing as shown for connector 9. Preferably, the G electrode is conductively connected, not capacitively connected.
Internal structure 1 includes a rear tab portion of the G conductor (not shown) extending beyond a rear edge of the A conductor (that is, beyond the end of the overlapped portion) and also having a 90 degree bend. Each one of the A, B, and G conductors projects out of the layered structure at a different height along the layered structure, projects out at different directions from one another, and protrudes from different sides of the layered structure. In addition, no tab of the A conductor overlaps, in the direction perpendicular to the major surfaces of the layers of the layered structure, any tab of the B or G conductor. The tab portion of the G conductor does not have a circular cross section; it has a wide flat cross section. The tab portions of the A and B conductors also have wide and flat cross sections.
Not shown in
In one preferred connector assembly, for example the connector assembly of connector 5, internal structure 1 is mounted to an assembly structure such as assembly structure 1200 described for
In one alternative, internal structure 1 is oriented in housings of connectors like connectors 2-10 such that the major surface of the layered structures of internal structure 1 are perpendicular to the extension of the male or female pins of the connector. In some of these embodiments, the bent portions of the tabs of the G conductor are sized to contact inner surfaces of a conductive housing of the connector, providing a pressure contact and some structural support of internal structure 1 in the connector. In some of these embodiments the bent portions of the tabs of conductors A, B, and G are disposed closer to rear ends of pins of the connectors than the planar layers of conductors A, B, and G, and the bent portions are soldered to back portions of corresponding pins.
Alternatively, any one or more of the A, B, and G conductors may define pin structures designed to mate with the rear sides of pins of the corresponding plug. This type of design enables the internal structure 1 to be plugged into the back side of the pin structure in a corresponding connector, thereby facilitating connector assembly. That is, the connector, such as a pug designed for 120 volt or 230 volt, contains an assembly which itself includes connectors to connect to the A, B, G conductors. In related alternative embodiments, additional conductive paths, such as conductive wires, whether or not insulated, may be used to electrically connect one or more of the A, B, and G electrodes to corresponding connector pins in the connector housing.
In many embodiments, after installation of internal structure 1 in a connector housing, the connector is “potted.” That is, the connector structure is filled with resin or glue which then sets or is set to electrically isolate and mechanically secure in position various components. In all embodiments, it is preferable that the side surface of at least the A and B conductors forming the overlapped region be covered with a dielectric, except where tabs exist.
Preferably, the bent portions of the A, B, and G conductors maintain a relatively wide and flat cross section. Relatively wide and flat cross-sections of the A, B, and G conductors minimizes inductance in the A, B, and G conductors.
Upper surface 20 is generally rectangular. Top surface 22 has width 30. Top surface 26 of the A conductor has width 32. Internal structure 1 has width 34 and length 35.
Preferable, widths 30, 32 are less than width 34. Preferably, widths 30, 32 are between 10 and 90 percent of width 34.
Top surface 22 has length 36 from the edge of upper surface 20. Top surface 26 has length 38 from the edge of upper surface 20.
Preferably, lengths 36, 38 are less than widths 30, 32. Preferably, lengths 36, 38 are less than one half length 34, preferably less than one fifth length 34, and more preferably less than one tenth length 34. As shown, lengths 36, 38 are about one twentieth of length 34.
Conductor A includes horizontally extended planar section 46 and vertically extended tab section 48.
Conductor B includes horizontally extended planar section 48 and vertically extended tab section 50.
Conductor G includes horizontally extended planar section 52, first vertically extended tab section 54, and second vertically extended tab section 56 (not shown in
Horizontally extended planar section 46 terminates at B conductor planar edge 58. G conductor planar side surface edge 60 resides at a location in the plane of the layered structure beyond edge 58.
Horizontally extended planar section 48 terminates at edge 62. G conductor planar side surface edge 64 resides at a location in the plane of the layered structure beyond edge 62.
Preferably, the ratio of P to H1, or the ratio of P to the height of the B conductor layer is at least 1, 2, 5, 10, or 20. Preferably, the ratio of the length the G and A conductors project out past the end of the edges of the other conductive layers in the layered structure to the heights of the G and A conductors also is at least 1, 2, 5, 10, or 20.
Preferably, the ratio of P to H3 is at least one tenth, one eighth, one fourth, one half, one, 2, 4, or 6. Preferably, the ratio the length that the tabs of the G and A conductors project out past the edges of the other conductive layers of the layered structure to H3 is also at least one tenth, one eighth, one fourth, one half, one, 2, 4, or 6.
Preferably, the ratio of W1 to H1 is greater than 2, 4, 6, 8, 10, 20, or 30 such that the tab section of the G conductor is wide and flat. Preferably, the corresponding width to height ratios for the tabs of the A and B conductors are greater than 2, 4, 6, 8, 10, 20, or 30.
Preferably, dielectric material, which may be provided by potting or coating, exists between (that is, blocking line of site) any portion of any tab of any of the A, B, and G conductors and any portion of the layered structure of any other conductor. Preferably, dielectric material between any portion of any tab of any of the A, B, and G conductors and any portion of the layered structure of any other conductor has sufficient dielectric strength to prevent dielectric break down between the A and B conductors, and to prevent dielectric breakdown between the A and G or the B and G conductors during normal operation. Normal operation in this context means, for connectors designed for 120 volt 60 cycle operation, normal load conditions of 120 volt and 60 cycle operation. Normal operation means in this context, for connectors designed for operation at other voltages or frequencies, normal load conditions for those other voltages and frequencies. In this context, the applicants realize that there are a myriad of different connector specification designed for different normal load conditions. Dielectric strength depends of course on normal operating conditions. Therefore, no set combination of dielectric materials and thicknesses thereof will cover all embodiments. However, for purposes of definiteness, note that such dielectric coatings may be at least 10 microns thick, at least 0.1 millimeters thick, or at least 1 millimeter thick.
As used herein, the term dielectric generally refers to a material having a solid form, and not to air.
For the reasons just presented with respect to a potting or exterior dielectric coating of the layered structure, the thicknesses of dielectric wafers or layers 42, 44 depend upon application specifications, and are limited to thicknesses sufficient to prevent dielectric breakdown as specified by normal operating conditions. However, again for purposes of definiteness, dielectric wafers 42, 44 may be at least 10 microns thick, at least 0.1 millimeters thick, or at least 1, 2, 3, 4, or 5 millimeters thick The thickness of dielectrics 42, 44 also specifies a distance along the direction perpendicular to the surfaces of the layered structure separating the heights of tab portions of the A, B, and G conductors. Thus, these conductors may each be separated in height from adjacent conductors by at least 10 microns, at least 0.1 millimeters, or at least 1, 2, 3, 4, or 5 millimeters. Tab portions of A and B conductors are separated in height from one another by at least twice those distances.
Sub layers 800A, 800B, 800C, and 800D are metallization layers. That is, they are layers deposited upon dielectric slabs or layers 42, 44. Sub layer 800A forms part of the A conductor. Sub layers 800B and 800C form part of the G conductor. Sub layer 800D forms part of conductor B. In methods of making embodiments wherein non integral components are assembled, sub layers 800A, 800B, 800C, and 800D provide a surface to which surfaces of assembly components of the A, B, and G conductors can wet, thereby making a reliable and uniform physical and electrical integration.
The extension of the A and B tabs away from opposite sides of the structure enables the layered portion of the G conductor to extend in all directions beyond the extent of the layered portions of the A and B conductors. Preferably, the planar portion of the G conductor extends beyond the edge of the A and B conductors at least 1, more preferably at least 2, 10, or 20 times the spacing between the G and A or the G and B conductors.
Importantly, the ground strap passes from the G1 tab to the G2 tab without enclosing any conductive paths connecting to either the A or B conductor. The ground strap in this example is about 3 millimeters wide and about one fifth the width of prototype 900A between the tabs of the A and B conductors, and spaced between about 1 and 2 millimeters from the dielectric bottom surface of prototype 900A.
Preferably, the cross sectional area defined by the cross section of the ground strap 1207 and the G conductor is less than 20 square millimeters, preferably less than 10 square millimeters, and more preferably less than 5 square millimeters. Preferably, the ground strap's path does not project more than 10 millimeters, preferably not more than 5 millimeters, and more preferably not more than about 1 millimeter from an outer major surface of the A or B conductive layers of the layered structure.
In one alternative embodiment, a second ground strap connects the G1 and G2 tabs along a path above the top of the prototype 900A. That is, two ground strap to G conductor loops exist with one circling above the internal structure of the conditioner and one circling below the internal structure of the conditioner.
In one method of fabricating an A, B, G structure, an additional A conductor component including a tab portion is inserted between layers 1661 and 1652 such that a tab portion of the additional A conductor component projects out to the left side of
In one method of fabricating the additional conductive components and the components 1630, 1640, 1650, and 1660, they are assembled with the positioning just indicated, preferably via heating so that the metallization layers wet to each other and to the additional conductive components with which the are placed in conductive contact to form physically integrated structure having, as the conductive components, the A, B, and G conductors. Preferably, the G conductor extends to the left as shown in
Preferably, the additional conductive structures are substantially thicker than the metallization layers.
In one alternative, the ground frame portions 2306, 2307 may be rotated 90 degrees from their orientation shown in
One alternative to the sixth embodiment has the A and B conductors offset relative to one another such that their tab sections have not overlap along the direction perpendicular to the major surfaces of the layered structure. Another alternative has the A and B conductors canted relative to one another such that the A and B conductor tab sections do not project out of the layered structure in the same direction as one another. Moreover, the actual dimensions and shapes of the left side ground frame portion 2306 and right side ground frame portion 2307 are not critical, so long as they both conductively connect to the G conductor. Conductive band 2305 is preferred but optional. External conductive layers 1631, 1662 are optional. Conductive band 2305 need not conductively contact conductive layers 1631, 1662. Although preferable, conductive band 2305 need not conductively contact ground frame portions 2306, 2307. Preferably, conductive band 2305 is at least substantially capacitively coupled to ground frame portions 2306, 2307. In embodiments with no conductive band, ground frame portions 2306, 2307 should be large enough, and/or capacitively coupled or conductively connected to substantial additional conductive material, to provide a sufficient source or sink of charge for a specified level of energy conditioning. Dimensions shown in
Preferably, the structure 2300 of
The foregoing embodiments and alternatives illustrate many variations in A, B, and G conductor shape, overlap relationship, and orientation. The inventors recognize that most of these alternatives are compatible with one another. For example generally rectangular and generally elliptical layers may be used in the same conditioner structure, and A, B, and G conductor layer shapes may vary from the generally rectangular and generally elliptical, so long as the desired overlap of the A, B, and G conductors exists, and the G conductor has at least two tab portions. Moreover, tab portions may project away from the overlapped or layered structures at angles that are not perpendicular to the surfaces or edges of the layered structure, for example at angles between about 15 and 89 degrees from the surface or edges of the overlapped or layered structures.
This application claims priority to U.S. provisional applications 60/473,914, filed May 29, 2003; 60/500,347, filed Sep. 5, 2003; 60/502,617, filed Sep. 15, 2003; and 60/505,874 filed Sep. 26, 2003; 60/523,098 filed Nov. 19, 2003; and 60/534,984, filed Jan. 9, 2004.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2004/014539 | 6/1/2004 | WO | 00 | 10/25/2005 |
Publishing Document | Publishing Date | Country | Kind |
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WO2005/002018 | 1/6/2005 | WO | A |
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