Patent Application
20230341076
The present disclosure relates to connectors for attaching supply lines or instrumentation lines to vacuum tanks in ultra-high vacuum systems.
High vacuum systems are used in many scientific and manufacturing applications, including particle accelerators and semiconductor device fabrication. In some semiconductor device fabrication processes, for example, caustic chemicals are selectively deposited onto a wafer at low pressures, and at temperatures typically in the range of 600° C. to 1000° C. In some processes, the deposition temperatures may exceed 1200° C. Thus, high vacuum systems must operate under severe chemical, pressure, and temperature conditions.
Conventional high vacuum systems have a hard metal vacuum tank with a plurality of hard metal tubes extending from the tank. A hard metal flange, which is generally made from the same metal as the vacuum tank, is welded to the end of each tube. Because the entire system, including all of the tubes and flanges, is generally made from the same material, the joints between the tubes and flanges are very secure and do not deteriorate under the chemical, pressure, and thermal cycling conditions under which high vacuum systems operate. Each flange is connected to another hard metal flange of the same metal on a chemical supply line or a vacuum line to sealingly connect the lines to the vacuum tank. The flanges are connected together by positioning a metal gasket between knife edges or other raised features on the hard metal flanges and then drawing the hard metal flanges together to engage the knife edges or raised features with the soft metal gasket. The hard-metal to hard-metal flange connection is a proven system that provides a secure, durable seal in standard vacuum environments.
Although conventional high vacuum systems with hard metal vacuum tanks perform adequately, newer high vacuum systems use soft metal vacuum tanks because they are generally lighter and less expensive to manufacture. The most common soft metal tanks are made from aluminum. One problem with soft metal tanks, however, is that it is difficult to connect the supply lines and vacuum lines to the tank because the joint between the soft metal tank and the hard metal flanges deteriorates under the severe pressure, temperature cycling, and chemical conditions used in semiconductor manufacturing and other ultra-high vacuum applications. For example, when the soft metal tank is composed of aluminum and the hard metal flanges are composed of stainless steel, the two metals tend to diffuse and react with each other when subjected to low pressure and either repeated temperature cycling or extended periods at high temperatures. This may create undesired alloys, compounds, metal byproducts, and intermetallics at the interface between the metals. After a period of time, therefore, ultra-high vacuum systems with soft metal tanks tend to leak at the joints between the soft metal and hard metal components.
One existing connector system used on soft metal high vacuum tanks has a knife edge flange composed of the same metal as that of the tank and a titanium oxide film coating the knife edge of the soft metal flange. The titanium oxide coating forms a thin hard metal layer over the soft metal flange knife edge that can dig into a soft metal gasket. However, one problem with this connector is that the titanium oxide layer often cracks, as most soft metals may anneal or even crack after repeated use at high temperatures used in typical high vacuum processes. Thus, soft metal flanges with a titanium oxide layer may leak after time in many high vacuum applications.
Ultra-high vacuum systems also create additional difficulties. Conventional high vacuum systems typically operate in the 10−6 to 10−8 torr range. However, it is desirable in some systems to operate at much lower pressures. Ultra-high vacuum systems, by contrast, may operate at 10−9 to 10−16 torr or lower.
U.S. Pat. No. 5,836,623 to Bothell, et al. discloses a connector system for use in ultra-high vacuum systems that includes a reaction-inhibiting barrier formed using explosive welding techniques. Explosive welding, also known as explosive bonding or explosion cladding, is a solid-state welding process that uses controlled, explosive energy to force two or more metals together at high pressures.
Explosive welding is traditionally used to bond a variety of metals together into a single assembly. Explosive welding involves the use of energy displaced from the discharge of explosive materials placed adjacent to a stack of multiple sheets of metal. The force imparted by the explosion creates a momentary pressure sufficient to displace a flyer plate onto a metal base plate at extremely high velocity, which forms a bond. During this process, a compressive wave front exists at the surface of the colliding plates which form a highly energetic plasma at the interface between the plates. This plasma etches the surfaces of the colliding metals, stripping them of contamination and oxides. The clean surfaces are then compressed together by the force of the explosive(s), facilitating the formation of metallurgical bonds.
Explosive welding processes require a secure, open area and the use of explosive ordinance. Methods of replicating the results of the explosive welding process in a controlled and potentially automated environment will offer significant advantages if reliable bond formation can be achieved. The contact pressures required to be achieved at the surface interface between metal sheets to be bonded are very high and require a manufacturing process which can achieve these high pressures.
In explosive welding processes, high temperatures are momentarily generated at the collision point between the two metals. This limits the types of metals that may joined, because the high energy frequently causes brittle intermetallics to form. For this reason, a third metal that does not form brittle phases with either of the other metals is introduced. This additional metal layer is typically referred to as an interlayer. Although necessary to form many joints when using explosive bonding, the use of interlayers complicates manufacturing and introduces an additional point of failure.
There remains a need for a connector system for use in ultra-high vacuum systems that includes a reaction-inhibiting barrier formed using bonding techniques that do not require the generation of extremely high.
A connector for use in an ultra-high vacuum system is disclosed herein. The connector has a metal conduit section with a first hardness, a metal fitting with a second hardness greater than the first hardness of the conduit section, and a metallic reaction-inhibiting barrier positioned between the conduit section and the fitting to sealingly attach the fitting to the conduit section. The metal conduit section has a first end, a second end, and a flow path between the first and second ends. The metal fitting has a rear face proximate to the second end of the conduit section, and an opening between the front and rear faces aligned with the flow path of the conduit section. The reaction-inhibiting barrier is selected from a group of metals that will substantially inhibit metallic and chemical interaction between the conduit section and the fitting under ultra-high vacuum, temperature cycling, and reactive chemical conditions.
Novel methods are disclosed herein for replacing aluminum oxide on the surface of an aluminum sheet with an alternative layer or alternatively removing or displacing the aluminum oxide and preventing re-oxidization for a sufficient time to allow bonding to occur. This allows for the use of bonding methods that can be performed at lower maximum temperatures than generated in explosive welding processes. This enables less complex reaction-inhibiting barriers to be used, such as chrome and titanium. The reaction-inhibiting barrier accordingly substantially prevents deterioration of the joint between the metal conduit section and the metal fitting to reduce leaks under ultra-high vacuum conditions and improve mechanical robustness.
Each of the foregoing and various aspects, together with those set forth below and summarized above or otherwise disclosed herein, including the figures, may be combined without limitation to form claims for a device, apparatus, system, method of manufacture, and/or method of use.
A connector and connector system for use in an ultra-high vacuum system is disclosed herein. The connector is used to connect a soft metal component to another metal component with a hard-metal to hard-metal connection. A soft metal conduit section is preferably bonded to a hard metal fitting with a reaction-inhibiting barrier that is selected from a group of metals that substantially prevents metallic interaction between the soft metal conduit section and the hard metal fitting. The reaction-inhibiting barrier accordingly maintains the chemical integrity of the soft metal conduit section and the hard metal fitting by substantially preventing diffusion, breakdown, or the formation of intermetallics at the interface between the different types of metals. The soft metal conduit section is preferably attached to a component made from the same material, and the hard metal fitting is preferably a hard metal flange adapted to be releasably connected to another hard metal flange. As a result, the disclosed connector provides a hard-metal to hard-metal connection, and it prevents leaks at the joint between the soft metal conduit section and the hard metal fitting.
The connector has a metal conduit section with a first hardness, a metal fitting with a second hardness greater than the first hardness of the conduit section, and a metallic reaction-inhibiting barrier positioned between the conduit section and the fitting to sealingly attach the fitting to the conduit section. The metal conduit section has a first end, a second end, and a flow path between the first and second ends. The metal fitting has a rear face proximate to the second end of the conduit section, and an opening between the front and rear faces aligned with the flow path of the conduit section. The reaction-inhibiting barrier is selected from a group of metals that will substantially inhibit metallic and chemical interaction between the conduit section and the fitting under ultra-high vacuum, temperature cycling, and reactive chemical conditions. The reaction-inhibiting barrier is metallurgically bonded using bonding techniques that do not require extremely high temperatures. Immediately prior to bonding, a surface oxide is removed or displaced from the surface of the metal that ultimately forms the conduit section. This enables the faying surfaces to have metallurgical contact. The reaction-inhibiting barrier accordingly substantially prevents deterioration of the joint between the metal conduit section and the metal fitting to reduce leaks under ultra-high vacuum conditions.
An ultra-high vacuum system may operate in the range of 10−8 to 10−16 torr or lower. Depending on the environment, ultra-high vacuum systems may undergo repeated low temperature cycling from room temperature down to 2° K, repeated high temperature cycling from room temperature up to 775° K, and repeated large range temperature cycling from 2° K to 775° K. Such temperature cycling at such low pressures causes the joints between components composed of aluminum and stainless steel to deteriorate and leak after a short time. Connector systems composed of two metals with different thermal properties under high vacuum will undergo reactions that may result in the formation of various metallic compounds, alloys, or other materials which allow the joint to leak. By using the disclosed connector and connector system, these problems are ameliorated.
The first connector 20 has a soft metal conduit section 30 with a tubular wall 32 that extends along a fluid flow path F between a first end 31 and a second end 33. The tubular wall 32 defines an elongated opening 34 through the conduit section along the flow path F. The first end 31 of the metal conduit section 30 is connected to a port 112 of a tube 110 on the vacuum tank 100. The tube 110 has an elongated opening 114 that extends into an internal cavity within the vacuum tank 100 and is aligned with the elongated opening 34 through the conduit section 30. The conduit section 30 is preferably connected to the port 112 by welding or braising the first end 31 of the conduit section 30 to the tube 110.
The conduit section 30 and the tube 110 are made of compatible metals that maintain a good seal at the joint between the conduit section 30 and the tube 110 under ultra-high vacuum and temperature cycling conditions. Accordingly, the conduit section 30 and the tube 110 are generally made from the same metal. If the tank 100 is aluminum or an aluminum alloy, suitable metals for the conduit section 30 include, but are not limited to, aluminum, titanium, zirconium, yttrium, molybdenum, manganese, copper, and alloys thereof. In some preferred embodiments, the conduit section 30 is made from aluminum.
The first connector 20 also has a metal fitting 60 with a second hardness greater than that of the first hardness of the conduit section 30. The metal fitting 60 has a tubular wall 62 with a rear face 61 positioned proximate to the second end 33 of the conduit section 30, and a flange 66 with a front face 63 facing towards the line 200. The tubular wall 62 defines an opening 64 aligned with the elongated opening 34 of the conduit section 30. The flange 66 extends outwardly from the tubular wall 62, and a plurality of bolt holes 68 pass through the flange 66. The flange 66 also has a raised feature 70 on its front face 63 that extends towards the second connector 120. The raised feature may be rounded (as shown) or may be a sharp knife edge (as shown in
Still referring to
The reaction-inhibiting barrier 80 is selected from a group of metals that substantially prevents metallic or chemical interaction between the soft metal conduit section 30 and the hard metal fitting 60. The reaction-inhibiting barrier 80 may be made from a single metal, or alternatively from multiple metals that are bonded together into a layered metal stack. The reaction-inhibiting barrier 80 accordingly reduces the deterioration at the interface between the soft metal conduit 30 and the hard metal fitting 60 that typically occurs with semiconductor processing chemicals under ultra-high vacuum conditions and extreme temperatures. Therefore, the connector 20 does not leak at the bond between the soft metal conduit section 30 and the metal fitting 60.
In some embodiments, the metal conduit section 30 is made of aluminum, the metal fitting 60 is made of stainless steel, and the reaction-inhibiting barrier 80 has a layer of titanium or a layer of chromium (i.e., a chrome layer) that is bonded to an aluminum oxide inhibitor layer. The titanium or chrome layer is bonded to the stainless steel fitting 60 and the aluminum oxide inhibitor is applied at the faying surface of the aluminum conduit section 30. The aluminum oxide layer on the surface of the conduit section is first displaced or removed, and reoxidation of the aluminum is then prevented for a time sufficient to allow bonding of the aluminum oxide inhibitor to the aluminum of the conduit section 30. The aluminum oxide inhibitor subsequently inhibits the formation of a new layer of aluminum oxide on the faying surface of the aluminum conduit section 30. The titanium or chrome and aluminum oxide inhibitor layers substantially prevent metallic or chemical interaction between the aluminum conduit section 30 and the fitting 60 to maintain the integrity of the joint between the conduit section 30 and the fitting 60 under ultra-high vacuum and temperature cycling conditions.
In some embodiments, the metal conduit section 30 is made of aluminum, the metal fitting 60 is made of stainless steel, and the reaction-inhibiting barrier 80 has a layer of titanium bonded to a layer of an aluminum oxide inhibitor. The titanium layer is bonded to the stainless steel fitting 60 and the aluminum oxide inhibitor is bonded to the aluminum conduit section 30. The aluminum oxide layer on the surface of the conduit section is first displaced or removed, and reoxidation of the aluminum is then prevented for a time sufficient to allow bonding of the aluminum oxide inhibitor to the aluminum of the conduit section 30. The aluminum oxide inhibitor subsequently inhibits the formation of a new layer of aluminum oxide of the surface of the conduit section 30. The titanium and aluminum oxide inhibitor layers substantially prevent disadvantageous metallurgic interaction between the aluminum conduit section 30 and the fitting 60 to maintain the integrity of the joint between the conduit section 30 and the fitting 60 under ultra-high vacuum and temperature cycling conditions.
The aluminum oxide inhibitor may preferably be selected from the group consisting of silver, copper, zinc, gold, and chromium.
In some alternate embodiments, the metal conduit section 30 is made of aluminum, the metal fitting 60 is made of stainless steel, and the reaction-inhibiting barrier 80 has a layer of chromium (i.e., a chrome layer) bonded to a layer of an aluminum oxide inhibitor. The chrome layer is bonded to the stainless steel fitting 60 and the aluminum oxide inhibitor is applied to the aluminum conduit section 30. The aluminum oxide layer on the surface of the conduit section is first displaced or removed, and reoxidation of the aluminum is then prevented for a time sufficient to allow bonding to the chrome layer 80. The chrome layer substantially prevents metallic or chemical interaction between the aluminum conduit section 30 and the fitting 60 to maintain the integrity of the joint between the conduit section 30 and the fitting 60 under ultra-high vacuum and temperature cycling conditions.
In some alternate embodiments, the metal conduit section 30 is made of aluminum, the metal fitting 60 is made of stainless steel, and the reaction-inhibiting barrier 80 is a single layer of titanium or a single layer of chromium (i.e., a chrome layer). The titanium or chrome layer is bonded to both the stainless steel fitting 60 and aluminum conduit section 30. The aluminum oxide layer on the surface of the conduit section is first displaced or removed using a mechanical aluminum oxide disruptor, and reoxidation of the aluminum is then prevented for a time sufficient to allow bonding of the titanium or chrome layer to the aluminum of the conduit section 30. The titanium or chrome layer substantially prevents metallic or chemical interaction between the aluminum conduit section 30 and the fitting 60 to maintain the integrity of the joint between the conduit section 30 and the fitting 60 under ultra-high vacuum and temperature cycling conditions.
The mechanical aluminum oxide disruptor may preferably be selected from the group consisting of zinc, indium, gallium, lead, and bismuth. The aluminum oxide disruptor is applied as a molten metal in a very small quantity and penetrates below the aluminum oxide following its application. The aluminum oxide disruptor displaces the aluminum oxide and enables direct contact of the reaction-inhibiting barrier with aluminum. The aluminum oxide disruptor then dissolves into the bulk aluminum and the reaction-inhibiting barrier 80.
In the connector system 10 shown in
The first and second connectors 20 and 120 are releasably attachable to one another so that the tank 100 may be disconnected from the line 200. To attach the connectors 20 and 120 together, the metal fittings 60 and 160 are drawn together by a number of bolts (not shown) positioned in the bolt holes 68 and 168. As the fittings 60 and 160 are drawn together, the raised features 70 and 170 engage a soft metal gasket 90 between the fittings 60 and 160 to create a sealed connection between the first and second connectors 20 and 120. The seal against the soft metal gasket 90 prevents leaks at the interface between the first and second connectors 20 and 120 under severe chemical, pressure, and temperature cycling conditions. To release the first connector 20 from the second connector 120, the bolts are merely disengaged from the connectors.
One advantage of the disclosed connector system is that the connector does not leak at the joint between the soft metal conduit section 30 and the hard metal fitting 60. By providing a reaction-inhibiting barrier that substantially prevents metallic or chemical interaction between the conduit section and the fitting 60, the joint between the conduit section 30 and the fitting 60 does not deteriorate under the chemical, ultra-high vacuum, and temperature cycling conditions typically associated with semiconductor manufacturing and other ultra-high vacuum applications. The disclosed connector system thus provides a durable, highly-effective transition connector between different metals that is releasably attachable to another connector.
Another advantage of the disclosed connector system is that it provides a hard-metal to hard-metal connection between a soft metal component and a component made from another metal. Unlike many prior art connectors used with soft metal components, the disclosed connector system uses a hard metal fitting that can withstand large temperature extremes without cracking. Therefore, the first and second connectors 20 and 120 provide the desirable hard-metal to hard-metal connections necessary for releasable connectors in ultra-high vacuum and temperature cycling conditions.
As depicted in
In some embodiments, the first metal layer 13 is coated with a first layer 81 of an oxide inhibitor and the second metal layer 16 is coated with a second layer 83 of reaction-inhibiting barrier 80, as shown in
Suitable techniques for coating the reaction-inhibiting barrier onto the first or second metal layers include vacuum deposition techniques such as PVD and CVD, metal spray techniques such as flame, plasma, and cold spray techniques, or electroplating.
Thus, for example, titanium or chromium may be plated onto stainless steel using a vacuum deposition technique such as PVD or CVD, a metal spray technique such as a flame, plasma, or cold spray, or electroplating to yield a titanium or chrome plated stainless steel plate.
Aluminum oxide is removed or displaced from the conduit section 30 and reoxidization is prevented for a time sufficient to allow bonding between the reaction-inhibiting barrier 80 and the aluminum of the conduit section 30 to occur. This allows for bonding techniques that may be performed without the maximum temperature exceeding 525° C. at any point during the bonding process and that do not require localized temperatures in excess of 525° C. for even a short duration. Although the precise mechanism of explosive welding processes is not well understood, it is presumed that an extremely high maximum temperature is achieved for a short duration during explosive welding. Despite the extremely short duration of extremely high temperature during explosive welding, this is nonetheless sufficient to render the use of various potential reaction-inhibiting barriers incompatible with an explosive welding process. The high temperatures provide the necessary energy to form brittle intermetallics that are not formed at lower temperatures. By maintaining a comparatively lower temperature throughout the bonding process, a wider variety of reaction-inhibiting barriers, including reaction-inhibiting barriers composed of chromium or titanium, may be used.
An aluminum oxide layer may be mechanically removed from the surface of an aluminum plate that will form the conduit section prior to bonding thereto of a stainless steel plate coated with a reaction-inhibiting barrier. Alternatively, an aluminum oxide layer on the surface of an aluminum plate that will form the conduit section may be reduced to aluminum metal prior to bonding thereto of a stainless steel plate coated with a reaction-inhibiting barrier.
In some embodiments, aluminum oxide is plasma etched off the surface of an aluminum plate under vacuum. An oxide inhibitor is then vacuum deposited onto the aluminum while under high vacuum so that there is little oxygen available to interfere with bonding. Bonding occurs by pressing or rolling a stainless steel plate coated with a titanium or chrome layer against the aluminum plate at temperatures below 525° C., more preferably below 500° C., and even more preferably below 400° C.
In some alternate embodiments, aluminum oxide is plasma etched off the surface of an aluminum plate under vacuum, and then a stainless steel plate coated with a titanium or chrome layer is immediately bonded to the aluminum plate by pressing or rolling the coated stainless steel plate against the aluminum plate at temperatures below 525° C., more preferably below 500° C., and even more preferably below 400° C.
In some other alternate embodiments, an oxide inhibitor metal such as silver, copper, or zinc is electroplated onto the surface of an aluminum plate. Aluminum oxide is chemically removed from the surface of the aluminum plate and is replaced by the oxide inhibitor metal. Bonding occurs by pressing or rolling a stainless steel plate coated with a titanium or chrome layer against the aluminum plate at temperatures below 525° C., more preferably below 500° C., and even more preferably below 400° C.
In some other alternate embodiments, aluminum oxide on the surface of an aluminum plate is mechanically disrupted with a molten metal such as zinc, indium, gallium, lead, or bismuth. The molten metal displaces or dissolves the aluminum oxide while migrating or penetrating below the oxide so as to prevent or otherwise inhibit the aluminum oxide layer from reforming. Bonding occurs by pressing or rolling a stainless steel plate coated with a titanium or chrome layer against the aluminum plate at temperatures below 525° C., more preferably below 500° C., and even more preferably below 400° C.
In yet other alternate embodiments, aluminum oxide on the surface of an aluminum plate is mechanically disrupted by stretching the aluminum plate while the aluminum plate is in contact with a stainless steel plate coated with a titanium or chrome layer. The titanium or chrome layer on the surface of the stainless steel plate is in metallurgical contact with the aluminum for a period of time sufficient to form metallic bonds. The metallurgical contact between the titanium or chrome layer and the aluminum plate provides a low oxygen environment such that the aluminum oxide layer is not able to re-form. Bonding occurs by pressing or rolling a stainless steel plate coated with a titanium or chrome layer against the aluminum plate at temperatures below 525° C., more preferably below 500° C., and even more preferably below 400° C.
Previously known bimetallic bonding techniques employ explosive welding techniques for bonding. Although explosive welding is well suited for removing the aluminum oxide layer off aluminum, it produces a very high temperature for a short duration at the bonding site. This very high temperature may cause the metals at the bonding site to interact with sufficient energy to form intermetallics. This is problematic in stainless steel-aluminum joints, as the intermetallics are often brittle or occupy less volume than the parent metals, which leads to porosity and leakage. This is unsuitable for ultra-high vacuum flanges and fittings, which must not leak or have micro-porosity. For this reason, it is critical to use a reaction-inhibiting barrier to prevent brittle intermetallics from forming between the aluminum and the stainless steel. The aluminum oxide removal techniques disclosed herein enable the use of bonding methods that do not require high momentary heat loads.
In alternate embodiments, flanges may be made without conduit section 330(a), without conduit section 330(b), or without both.
In operation, a plurality of bolts (not shown) in the bolt holes 368(a) and 368(b) draw the metal fittings 360(a) and 360(b) into engagement with a soft metal gasket 90, until the knife edges 370(a) and 370(b) of the metal fittings 360(a) and 360(b) seal against the soft metal gasket 90. In view of the position of the reaction-inhibiting barriers 380(a) and 380(b) shown in
In operation, the vacuum pump 500 draws down the pressure within the vacuum tank 100 to a desired level, which may be approximately 10−8 to 10−16 torr or lower. The vacuum system 12 is also heated or cooled to a desired temperature between 2° K and 1400° K, and the temperatures may be repeatedly cycled several times between a first high temperature and a second low temperature. The appropriate chemicals from the first and second chemical supplies 300 and 400 are then selectively delivered into the vacuum tank 100 through the supply lines 200(a) and 200(b). As discussed above with respect to
The vacuum system 12, and more specifically the connectors 120(a)-(c), maintain an ultra-high vacuum after at least twenty temperature cycles and more preferably after over 200 temperature cycles. The standard for determining whether a reaction-inhibiting barrier has maintained the integrity of the joint between the conduit section and the fitting is measured by the extent of leaking at the joint. Thus, a reaction-inhibiting barrier that substantially inhibits metallic interaction between the conduit section and the fitting may allow a measurable change in structure at the joint so long as the connector maintains an ultra-high vacuum after repeated temperature cycling.
In operation, a plurality of bolts (not shown) positioned in the bolt holes 468(a) and 468(b) may be used to draw the metal fittings 460(a) and 460(b) into engagement with the C-shaped spring 490. As the C-shaped spring 490 is compressed, the contact points between the C-shaped spring 490 and the recesses 462(a) and 462(b) create a seal between the first and second connectors 420(a) and 420(b).
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention disclosed herein. Although the various inventive aspects are disclosed in the context of certain illustrated embodiments, implementations, and examples, it should be understood by those skilled in the art that the invention extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the invention and obvious modifications and equivalents thereof. In addition, while a number of variations of various inventive aspects have been shown and described in detail, other modifications that are within their scope will be readily apparent to those skilled in the art based upon reviewing this disclosure. It should be also understood that the scope of this disclosure includes the various combinations or sub-combinations of the specific features and aspects of the embodiments disclosed herein, such that the various features, modes of implementation, and aspects of the disclosed subject matter may be combined with or substituted for one another. The generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Further, any range of numbers recited above describing or claiming various aspects of the invention, such as ranges that represent a particular set of properties, units of measure, conditions, physical states, or percentages, is intended to literally incorporate any number falling within such range, including any subset of numbers or ranges subsumed within any range so recited. The terms “about” and “approximately” when used as modifiers are intended to convey that the numbers and ranges disclosed herein may be flexible as understood by ordinarily skilled artisans and that practice of the disclosed invention by ordinarily skilled artisans using properties that are outside of a literal range will achieve the desired result.
Each of the foregoing and various aspects, together with those summarized above or otherwise disclosed herein, including the figures, may be combined without limitation to form claims for a device, apparatus, system, method of manufacture, and/or method of use.
All references cited herein are hereby expressly incorporated by reference.
This application claims the benefit of U.S. Provisional Patent Application Ser. No. 63/363,475, filed on Apr. 22, 2022, the disclosure of which is hereby incorporated in its entirety herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 63363475 | Apr 2022 | US |
