This application claims priority to Japanese Patent Appln. No. 2005-131252 filed Apr. 28, 2005, the entirety of which is hereby incorporated by reference.
1. Field of the Invention
The present invention relates to a connector, and more specifically to a connector that is able to reduce the adverse effects of whiskers generated when making a conductor part.
2. Background of the Technology
Once emplaced, the contact of the connector is solder connected, for example.
In recent years, use of various kinds of hazardous substances has been restricted in order to protect the environment. For example, in Europe, a regulation referred to as Restriction on Hazardous Substances (ROHS) has been issued to restrict the use of a number of particular chemical substances. Among the restricted substances is lead, which is a common substance in solder. As a result, efforts are being made to develop lead-free solder. Among other applications, lead-free solder is needed for connecting the contact parts of connectors to devices.
Various lead-free solders have been developed, including a number of “tin system” solders. These tin system solders typically use tin (Sn) or tin-copper (Sn—Cu) as a solder constituent.
One problem that has arisen in the development of lead-free solders is the need to address the generation of “whiskers” during the soldering process. It is well known that a needle crystal, referred to interchangeably herein as a “whisker”, is often generated in the lead-free solder application process. In the tin system, for example, tin in the solder is typically the source of the crystals forming such whiskers.
Recently, it has been reported that when the whisker grows or when the grown whisker scatters, additional problems, such as the creation of short-circuits between terminals or to ground can result. Scattering of whiskers occurs, for example, when the whisker is displaced during insertion or removal of the connector.
In the connector illustrated in
Potential serious impacts can result from generation of such whiskers, including lowering of reliability of apparatuses produced that have whiskers. Various measures have been proposed to suppress whisker generation, as described in the various documents listed as References below. However, since at least some whiskers are inevitably generated with the use of lead-free solder, reduction of whisker generation provides only a limited solution to this problem, and it is therefore very difficult or impossible to completely solve the problem of whisker generation in these existing art solutions.
Moreover, in the various measures proposed in the listed prior art documents, additional means are often required over normal soldering or other plating techniques. For example, it may be necessary for a new additional process to be used when manufacturing a component, in order to reduce generation of whiskers, or an improvement may be required for the solder material itself.
JP-A No. 2002-69688
JP-A No. 2002-164106
JP-A No. 2005-56606
http://www.maruwa-ss.co.ip/pb.pdf (as viewed on Apr. 10, 2005)
http://www.jae.co.jp/gihou/pdf28/q—03.pdf (as viewed on Apr. 10, 2005)
http://www.toyohashiplating.co.ip/New%20information%20of%20Pb%20free%Plating%202.htm0 (as viewed on Apr. 10, 2005)
http://tsc.jeita.or.ip/TSC/COM/MS/7_EASM/Japanese/met/data/Pressrelease_Jpn200306.pdf/ (as viewed on Apr. 10, 2005)
Embodiements of the present invention provide connectors that are able to reduce or control generation of whiskers, such as whiskers tending to cause short circuits, in the component to which such connectors are attached or in which such connectors are formed.
In order to solve the problems discussed above, as well as others, the present invention includes a connector comprising a contact portion and a housing portion, the housing portion having a formed recess area into which the contact portion is receivable, such as by press fit. Embodiments of the present invention provide that the depth of the recess area is about 0.5 mm and height of the recess area, as measured between the surface of the received contact portion and a wall of the formed recess area, is about 0.1 mm or less.
Moreover, embodiments of the present invention include a connector comprising a housing portion and a contact portion inserted into an opening formed in the housing portion, the opening in the housing portion including a recess formed in such a shape and size that no internal wall of the recess contacts the received contact portion of the connector.
According to embodiments of the present invention, such problems as short circuits due to generation of whiskers may thereby be prevented without any addition or modification to standard solder plating processes or solder plating materials.
For example, according to one embodiment of the present invention, the potentially whisker generating part is contained within the recess part, such that, if a whisker is generated, the recess prevents or reduces likelihood of contact with the whisker, thereby reducing or eliminating the risk of scattering the whisker and thereby causing additional problems, such as short circuits.
Additional advantages and novel features of the invention will be set forth in part in the description that follows, and in part will become more apparent to those skilled in the art upon examination of the following or upon learning by practice of the invention.
In the drawings:
Exemplary embodiments of the present invention will now be described in accordance with the appended figures.
As shown in the embodiment of
In
Since the generated whisker 3 is contained within the recess are 4 formed in the housing portion 2, contact with the whisker 3—even during insertion and removal of the connector—is prevented, thereby minimizing the likelihood of scattering of the whisker 3.
In tests conducted by the applicant using components created in accordance with embodiments of the present invention, it has been shown that whiskers up to the length up to about 400 μm may be generated. In order to prevent contact with such a whisker when the connector is inserted or removed, the depth k of the recess area 4 provided in the housing portion 2 should be sufficient to cover at least a whisker 3 of the test length generated. Accordingly, in one embodiment of the present invention, the depth k of recess portion 4 is set to about 500 μm (=0.5 mm), as illustrated in
Variation in the size of the recess area 4, in terms of the height h shown in
On the other hand, if height h of the recess area 4 is too great, foreign matter may easily enters the recess area 4, and such foreign matter may contact the generated whisker 3. When such a possibility is taken into consideration, it is preferable that height h of the recess area 4 be set to about 0.05 mm to 0.1 mm. Such height h can also be altered to other ranges as necessary for the expected size of a whisker generated.
Moreover, it is also possible, in view of containing the area where generation of a whisker is anticipated as likely, to extend sufficiently the length of the pressure-fitting part, for example, in place of forming a recess in the housing, or to insert another member where a recess part not in contact with the contact surface is inserted into the contact.
Embodiments of the connector of the present invention will now be compared with an exemplary existing art connector shown in
As illustrated in the embodiment of the connector of
In contrast, no recess area is formed in the periphery of the opening 15 in the housing 12 of the existing art illustrated in
In the connector illustrated in
Example embodiments of the present invention have now been described in accordance with the above advantages. It will be appreciated that these examples are merely illustrative of the invention. Many variations and modifications will be apparent to those skilled in the art.
Number | Date | Country | Kind |
---|---|---|---|
2005-131252 | Apr 2005 | JP | national |