The present invention relates to a connector, particular to a connector that is not easily distorted by high temperatures and external forces.
Current electronic products tend to be compact and light weight. Therefore, electrical devices used in manufacturing the electronic products tend to be miniaturized too.
Various electronic products use a connector to transmit signals.
To solve the above-identified problem, the present invention provides a connector that can be still accurately fixed to an electronic product such as a printed circuit board at a high temperature or with an external force. The connector according to an embodiment of the present invention comprises: a housing having two ends; a plurality of terminals arranged on the housing for electrically contacting with a board; a pair of arms extending from each of the ends of the housing; a first projection and a second projection formed on each of the pair of arms; and a metal member (112) including: a hold-down portion (114) and a first recess (116); wherein when the metal member (112) is detachably disposed along each of the arms (106), the first recess (116) is capable of accommodating the first projection (108) with a first buffer space (130) existing therebetween and the metal member (112) is spaced from the second projection (110) by a second buffer space (140), such that when the hold-down portion (114) is soldered to the board, the first projection (108) or the second projection (110) may prevent the board or the housing (102) from being overwarpped.
The present invention can be understood with reference to the following figures.
According to another embodiment, the first buffer space 130 is preferably 0.2 mm, and the second buffer space 140 is preferably 0.2 mm. However, in other embodiments, the first buffer space 130 and the second buffer space 140 are not limited to 0.2 mm and can be adjusted according to structural features of the connector. During the elements of the connector are assembled, the hold-down portion (114) of the mental member 112 is soldered to the printed circuit board. During the soldering step, the printed circuit board and/or the housing maybe distorted or warped due to the heat or the external force. The first buffer space 130 and the second buffer space 140 may accommodate the distortion or warpage of the printed circuit board or the housing 102, and the connector 100 may still be accurately fixed to the printed circuit board.
It should be understood that the embodiments as described above only are preferred embodiments of the present invention. Modifications made according to the spirit of the present invention and their functions do not depart from the spirit of the present invention covered by the specification and the drawings and should be included within the scope of the claims.
Number | Date | Country | Kind |
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095103569 | Jan 2006 | TW | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/SG2007/000022 | 1/24/2007 | WO | 00 | 6/7/2010 |