This application claims the benefit of the filing date under 35 U.S.C. ยง 119(a)-(d) of Japanese Patent Application No. 2018-134135, filed on Jul. 17, 2018.
The present invention relates to a connector and, more particularly, to a contact of a connector.
A connector for connecting a pair of circuit boards has a housing with a first receiving portion receiving an end portion of a first circuit board plugged in from a front. A second receiving portion of the housing receives an end portion of a second circuit board plugged in from behind. A contact of the connector has a first contact portion contacting the first circuit board received in the first receiving portion and a second contact portion contacting the second circuit board plugged into the second receiving portion. The contact is elongated in frontward and rearward directions and has a fixed portion fixed to the housing in a middle portion thereof.
It is necessary to ensure that the second contact portion comes into contact with the second circuit board when the second circuit board is received in the second receiving portion. For this reason, the second contact portion is so located as to interfere with the second circuit board when that second circuit board is received. Moreover, when the second circuit board is received, the second contact portion elastically deforms under a pressing force from the second circuit board. A portion of the housing supporting the fixed portion supports a stress due to this elastic deformation.
The second circuit board received in the second receiving portion and the second contact portion may be soldered together in a reflow oven. The connector having the second circuit board received therein is put into the reflow oven. Thereupon, the housing softens, and the housing may deform due to the stress. If the housing deforms, the pressing force received by the second contact portion affects the first contact portion near the first receiving portion and, consequently, the position of the first contact portion changes; the attitude of the contact changes.
Removing the connector from the reflow oven then results in fixation of the changed attitude of the contact. If this happens, when the first circuit board is received in the first receiving portion, the contact pressure of the first contact portion to the first circuit board may be too strong, resulting in damage to the first circuit board. Alternatively, if there is a considerable change in the attitude of the contact, the contact may collide with the first circuit board plugged into the first receiving portion, resulting in buckling.
Japanese Patent Application No. JP 2009-129576A discloses an electronic device in which a stress relief structure for relieving a stress due to a screw connection is provided between a supporting portion for a housing and a screwing portion; a contact supported by the housing is connected to a circuit board by screwing. However, J P 2009-129576A discloses a structure for relieving a stress due to screwing, not a structure that takes into consideration thermal deformation of the housing. In addition, JP 2009-129576A does not contemplate the contact coming into contact with two circuit boards. Consequently, there is a need for a connector capable of inhibiting a change in the attitude of the contact even when heating softens the housing.
A connector includes a housing and a contact elongated in a frontward and rearward direction. The contact has a fixed portion fixed to the housing in a middle in the frontward and rearward direction, a first contact portion formed in a front end portion for coming into contact with a first circuit board, a second contact portion formed in a rear end portion for coming into contact with a second circuit board, and a deflective portion formed between the fixed portion and the second contact portion. The deflective portion is adapted to deflect when the second contact portion receives a force from the second circuit board.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein like reference numerals refer to like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will convey the concept of the disclosure to those skilled in the art.
A connector 10 according to an embodiment, as shown in
As shown in
Each contact 30, as shown in
The connector 10 is heated in a reflow oven with the second circuit board 60 received in the second receiving portion 20B, with the second circuit board 60 abutting on an abutting portion 22 of the housing 20 shown in
It is necessary to ensure that the second contact portion 32 comes into contact with the received second circuit board 60 in order to prevent a soldering failure from occurring. Therefore, a distance d2 between the second contact portions 32 of the vertically-arranged two contacts 30 shown in
Because the distance d2 between the second contact portions 32 is set narrower than the thickness of the second circuit board 60, when the second circuit board 60 is plugged in, the second circuit board 60 widens the distance d2. A portion of the contact 30 nearer to the second contact portion 32 than the fixed portion 33 elastically deforms, thereby applying a stress to the housing 20. The distance d2 between the second contact portions 32 and/or the thickness of the second circuit board 60 may also have a tolerance, and, depending on a combination of these tolerances, the second contact portions 32 may also be pushed apart strongly.
When the second circuit board 60 is soldered to the connector 10, the housing 20 is also heated in the reflow oven, and thus the housing 20 softens. If a connector in which the second contact portions 32 are pushed apart strongly by the second circuit board 60 is put into the reflow oven, the housing 20 softened by heating may deform due to the strong force. If the housing 20 still deformed is removed from the reflow oven and returns to room temperature, the housing 20 hardens again, staying deformed. This deformation of the housing 20 leads to a change in the attitude of the contact 30, which is an attitude having the distance d1 between the first contact portions 31 narrowed. If the first circuit board 50 is plugged into the connector 10 having such a change in the attitude of the contact 30, the first contact portion 31 may come into contact with the first circuit board 50 unnecessarily strongly, resulting in a damage to the first circuit board 50. Alternatively, the contact 30 may also collide with a front end face of the first circuit board 50, resulting in buckling.
The connector 10 of the present embodiment inhibits a change in the attitude of the contact 30 due to being put into the reflow oven in the following manner.
As shown in
The deflective portions 34 of the lateral two contacts 30 of the three contacts 30 shown in
The deflective portion 34 is only required to be formed in a position which is nearer to the second contact portion 32 (a soldered side) than the fixed portion 33 fixed to the housing 20, and which is not fixed to the housing 20 from above and below, and to have an easily-deflecting structure or shape. That is, the deflective portion 34 is not limited to the illustrated narrower or depressed shape. Though the width of the contact 30 is narrowed in
Number | Date | Country | Kind |
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JP2018-134135 | Jul 2018 | JP | national |
Number | Name | Date | Kind |
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3413594 | Fernald | Nov 1968 | A |
7080999 | Narui | Jun 2006 | B2 |
7976344 | Brunker | Jul 2011 | B2 |
Number | Date | Country |
---|---|---|
106654683 | May 2017 | CN |
5-15744 | Apr 1993 | JP |
2003142183 | May 2003 | JP |
2003-272746 | Sep 2003 | JP |
2006012708 | Jan 2006 | JP |
2009-129576 | Jun 2009 | JP |
2009300330 | Dec 2009 | JP |
2013-38076 | Feb 2013 | JP |
Entry |
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Abstract of JP 2009129576, dated Jun. 11, 2009, 1 page. |
Japanese Office Action and English translation thereof corresponding to Application No. 201910645246.7, dated Jul. 21, 2022, 10 pages. |
Japanese Search Report dated Jul. 17, 2022 corresponding to Application No. 201910645246.7, 2 pages. |
Notice of Reasons for Refusal and English translation thereof, Application No. 2018-134135, dated Apr. 15, 2022, 8 pages. |
Number | Date | Country | |
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20200028290 A1 | Jan 2020 | US |