Samtec. Rugged, High Bandwidth Interconnects Save Space On PCB by Danny Boesing. Mar. 14, 2019. https://blog.samtec.com/post/rugged-high-bandwidth-interconnects-save-space-on-pcb/ (Year: 2019). |
Mouser Electronics. Samtec Razor Beam™ LSHM High-Speed Connectors. Sep. 4, 2018. https://www.mouser.com/new/samtec/samtec-lshm-connectors/ (Year: 2018). |
Office Action in Taiwanese Patent Application No. 110303910, dated Aug. 31, 2022, 5 pages. |
Office Action in Taiwanese Patent Application No. 110304043, dated Aug. 31, 2022, 5 pages. |
Office Action in Taiwanese Patent Application No. 110304333, dated Aug. 31, 2022, 5 pages. |
Official Communication issued in corresponding Taiwanese Patent Application No. 110304333, dated Apr. 29, 2022. |
Official Communication issued in corresponding Taiwanese Patent Application No. 110303910 dated Mar. 31, 2022. |
Musser et al., “Connector”, U.S. Appl. No. 29/886,650, filed Mar. 10, 2023. |
Musser et al., “Connector and Contact”, U.S. Appl. No. 29/832,053, filed Mar. 24, 2022. |
Musser et al., “Connector”, U.S. Appl. No. 29/832,052, filed Mar. 24, 2022. |
Musser et al., “Connector”, U.S. Appl. No. 29/833,175, filed Apr. 1, 2022. |
Musser et al., “Connector”, U.S. Appl. No. 29/833,208, filed Apr. 1, 2022. |
Musser et al., “Contact”, U.S. Appl. No. 29/841,151, filed Jun. 3, 2022. |
Musser et al., “Connector”, U.S. Appl. No. 29/716,202, filed Dec. 6, 2019. |
First Office Action in CN202011418253.2, dated Jun. 15, 2022, 10 pages. |
Office Action issued in TW110304511, dated Jun. 29, 2022, 4 pages. |
Office Action issued in TW110304512, dated Jun. 29, 2022, 4 pages. |
Official Communication issued in corresponding Chinese Patent Application No. 201910602689.8, dated Aug. 23, 2021. |
Official Communication issued in corresponding Taiwanese Patent Application No. 109142234, dated Sep. 16, 2021. |
Office Action in KR10-2023-7019678, dated Jul. 15, 2023, 4 pages. |