Claims
- 1. A composition of matter for use in wallboard, comprising:
an organic binder which is polymerized in situ in a crosslinked molecular network during a polymerization reaction, wherein the polymerization reaction comprises at least one polymer forming material that is hydrophobic; a foaming agent; and a plurality of inorganic particles coated by the organic binder, and wherein the foaming agent forms voids within a network of the coated inorganic particles that are bound together by the organic binder.
- 2. The composition of matter of claim 1, wherein the foaming agent comprises a surfactant stabilized aqueous solution.
- 3. A composition of matter for use in wallboard, comprising:
an organic binder which is polymerized in situ in a crosslinked molecular network during a polymerization reaction, wherein the polymerization reaction comprises at least one polymer forming material that is hydrophobic, and a plurality of inorganic particles coated by the organic binder, wherein said polymerization produces an expansion by decomposition of at least one polymer forming material and wherein the at least one polymer forming material that is hydrophobic and the at least one polymer forming material that decomposes need not be the same polymer forming material, and wherein said decomposition evolves a gas phase that forms voids within a network of the coated inorganic particles that are bound together by the organic binder.
- 4. The composition of matter of claim 3, wherein the organic binder comprises hydrophobic and hydrophilic moieties.
- 5. The composition of matter of claim 3, wherein the organic binder is polymerized from at least one preexisting polymer.
- 6. The composition of matter of claim 3, wherein the organic binder is polymerized from at least one monomer.
- 7. The composition of matter of claim 3, wherein the organic binder comprises at least one polymer selected from the group of polymers consisting of epoxies, polyurethanes, polyesters, polyketones/diamines, and poly(maleic anhydride alt-1-octadecene)/diamenes.
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application Serial No. 60,273,925, to David Soane, entitled “Construction Board Materials with Engineered Microstructures,” filed Mar. 7, 2001.
Provisional Applications (1)
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Number |
Date |
Country |
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60273925 |
Mar 2001 |
US |